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Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User, By Type, By Regional Outlook and Forecast, 2022 - 2028

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    Report

  • 213 Pages
  • May 2022
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5615599
Description Jump to:

The Global Wafer Level Packaging Market size is expected to reach $14.1 billion by 2028, rising at a market growth of 17.7% CAGR during the forecast period.

Wafer level packaging (WLP) is a technique for connecting packaging elements to an integrated circuit before slicing it. Unlike the traditional approach, which involves slicing the wafer into individual circuits before attaching the packaging components, this procedure does not include slicing the wafer into distinct circuits. Factors such as increased usage of high-speed, compact-size, and less expensive electronic goods are expected to propel the worldwide wafer level packaging business forward. Furthermore, the technological superiority of wafer level packaging over traditional packaging approaches, as well as the approaching requirement for circuit downsizing in microelectronic devices, drive market growth. Moreover, the increased utilization of wafers throughout the automotive industry is anticipated to drive the market.

Wafer-level packaging entails extending wafer fabrication methods to include device connectivity and protection. Most alternative types of packaging start with wafer dicing and then place the individual die in a plastic box with solder bumps attached. Wafer-level packaging entails attaching the bottom and top outer layers of packaging, as well as the solder bumps, onto integrated circuits while the wafer is still in the wafer, and then slicing the wafer. At the moment, there is no one industry-standard approach to wafer-level packaging. Because of their small size, cellphones are a popular application for WLPs.

Because of the rapid advancements in integrated circuit manufacturing processes, fans in wafer level packaging solutions are becoming increasingly significant in the semiconductor packaging area. Moreover, one of the primary drivers driving the market for wafer level packaging solutions is the demand for faster, lighter, smaller, and more cost-effective electronic equipment with high performance as well as low-cost packaging. WLP can be found in consumer electronic devices such as cellphones and other semiconductor devices, as well as in ICs. One of the primary elements driving demand for wafer level packaging technology over traditional packaging solutions is the growing demand for technical improvement in mobile devices that are capable of completing a variety of programs in a single small-end product.

COVID-19 Impact Analysis

The COVID-19 outbreak had a considerable impact on the semiconductor and electronics industries. Due to an increase in the number of COVID-19 cases, business and manufacturing facilities in several nations were closed during the pandemic. Additionally, the partial and complete travel restrictions impacted the worldwide supply chain, making it difficult for manufacturers to access customers. The COVID-19 outbreak had a global impact on society and the economy. The impact of this pandemic was growing rapidly, and it affected worldwide business. The crisis has wreaked havoc on the stock market, causing a drop in corporate confidence, a major slowdown in the supply chain, and an increase in customer concern. Due to the shutdown of production operations, various countries under the lockdown lost a significant amount of business and money.

Market Growth Factors

Cost-effective and time-efficient

Electrical testing is less expensive and takes less time because these programs were designed with DFT in mind. Because the connections are exposed on the wafer, advanced fabs can automate this procedure, and testing is not required after packaging. Burn-in testing is also accelerated due to the utilization of a single wafer. The IC verification method includes two critical steps, including assessing reliability and functional testing. Wafer-level packaging was not designed specifically to improve DFT, but it undoubtedly helps because it exposes critical test locations and interconnects directly on the wafer.

Optimizes temperature control

When the casting solutions are efficiently emerging from the film, imidization rates can be better regulated. Controlled and regulated temperature ramp rates provide an enhanced system window for optimal polyimide film curing. When using many layers of polyimide, optimal temperature control is very important. Due to tension, improper curing can cause the first polyimide layer to soften and the metal lines to wrinkle. Absorption of oxygen in the polyimide can result in a dark, brittle coating. Vacuum / N2 cycles generate an oxygen-free environment for curing. The diameter of the intermediate wafer determines the investment and manufacturing infrastructure in traditional WLCSP processing.

Market Restraining Factors

Requirement for high initial investment

Various wafer level packaging, or WLP, technologies are currently being introduced in the market at an extremely high altitude, particularly in portable and mobile applications. In recent years, a considerable number of wafer level packaging units were installed in smartphones, tablet PCs, and portable gadgets, indicating a significant rise in the wafer level packaging industry. However, there are several challenges that are being posed to the market players operating in this sector. one of the major challenges is that wafer level packaging requires a higher capital investment than traditional flip-chip and wire bonding packaging since it uses fab-like tools for the redistribution process using thin layer metals and dielectric polymers. Cost reduction is a significant aspect of expanding the market beyond its present limitations.

End User Outlook

Based on End User, the market is segmented into Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, and Others. In 2021, the consumer electronics segment recorded the largest revenue share of the wafer level packaging market. The constantly increasing growth of this segment is attributed to the advancements in electronic packaging technology, which have resulted in highly efficient and robust electrical interconnect methods for electronic products.

Type Outlook

Based on Type, the market is segmented into WLCSP, 2.5D TSV WLP, 3D TSV WLP, Nano WLP, and Others. In 2021, the 2.5D TSV WLP segment garnered a substantial revenue share of the wafer level packaging market. The increased capacity, reduced system space requirements, improved performance, and low power consumption are all characteristics that contribute to the widespread use of 2.5D TSV WLP. This factor is expected to aid in increasing the growth of this segment across the market in the forecast years.

Technology Outlook

Based on Technology, the market is segmented into Fan IN and Fan OUT. In 2021, the Fan-in WLP segment witnessed the largest revenue share of the wafer level packaging market. The increasing growth of this segment is attributed to the st4rong position of Fan-in WLP technology in the semiconductor sector, offering undeniable benefits in terms of shape and cost. Moreover, technological improvement and innovation continue to expand the range of fan-in WLP solutions. The growing use and use of fans in wafer level packaging across automotive, consumer electronics, and industrial applications are driving the demand for sophisticated fan-in WLP solutions around the world. Furthermore, the IoT (Internet of Things) promises a plethora of new applications for which fan-in WLP is expected to be an ideal option, presenting a lucrative chance to further boost the demand.

Regional Outlook

Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. In 2021, Asia-Pacific accounted for the largest revenue share of the wafer level packaging market. The growth of the regional market is majorly attributed to the fact that Taiwan is home to some of the world's largest semiconductor manufacturers, fueling demand for sophisticated semiconductor packaging, particularly in PLPs. According to the Semiconductor Industry Association (SIA), this region accounts for more than half of worldwide semiconductor sales, giving Taiwanese manufacturers more opportunities to supply FOWLP for growing semiconductor applications. The majority of enterprises in the country are expanding their Fan-out packaging production capacity, which is projected to boost exports while also helping to strengthen the local market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include ASML Holding N.V., Fujitsu Limited, Toshiba Corporation, Qualcomm, Inc., Amkor Technology, Inc., Deca Technologies, Inc., Jiangsu Changjing Electronics Technology Co., Ltd., Tokyo Electron Ltd., Applied Materials, Inc., and Lam Research Corporation.

Scope of the Study

Market Segments Covered in the Report:

By End User

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecommunication
  • Others

By Type

  • WLCSP
  • 5D TSV WLP
  • 3D TSV WLP
  • Nano WLP
  • Others

By Technology

  • Fan IN
  • Fan OUT

By Geography

  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

  • ASML Holding N.V.
  • Fujitsu Limited
  • Toshiba Corporation
  • Qualcomm, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies, Inc.
  • Jiangsu Changjing Electronics Technology Co., Ltd.
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • Lam Research Corporation

Unique Offerings from KBV Research

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Wafer Level Packaging Market, by End User
1.4.2 Global Wafer Level Packaging Market, by Type
1.4.3 Global Wafer Level Packaging Market, by Technology
1.4.4 Global Wafer Level Packaging Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Global Wafer Level Packaging Market by End User
3.1 Global Consumer Electronics Market by Region
3.2 Global Automotive Market by Region
3.3 Global Healthcare Market by Region
3.4 Global IT & Telecommunication Market by Region
3.5 Global Others Market by Region
Chapter 4. Global Wafer Level Packaging Market by Type
4.1 Global WLCSP Market by Region
4.2 Global 2.5D TSV WLP Market by Region
4.3 Global 3D TSV WLP Market by Region
4.4 Global Nano WLP Market by Region
4.5 Global Others Market by Region
Chapter 5. Global Wafer Level Packaging Market by Technology
5.1 Global Fan IN Market by Region
5.2 Global Fan OUT Market by Region
Chapter 6. Global Wafer Level Packaging Market by Region
6.1 North America Wafer Level Packaging Market
6.1.1 North America Wafer Level Packaging Market by End User
6.1.1.1 North America Consumer Electronics Market by Country
6.1.1.2 North America Automotive Market by Country
6.1.1.3 North America Healthcare Market by Country
6.1.1.4 North America IT & Telecommunication Market by Country
6.1.1.5 North America Others Market by Country
6.1.2 North America Wafer Level Packaging Market by Type
6.1.2.1 North America WLCSP Market by Country
6.1.2.2 North America 2.5D TSV WLP Market by Country
6.1.2.3 North America 3D TSV WLP Market by Country
6.1.2.4 North America Nano WLP Market by Country
6.1.2.5 North America Others Market by Country
6.1.3 North America Wafer Level Packaging Market by Technology
6.1.3.1 North America Fan IN Market by Country
6.1.3.2 North America Fan OUT Market by Country
6.1.4 North America Wafer Level Packaging Market by Country
6.1.4.1 US Wafer Level Packaging Market
6.1.4.1.1 US Wafer Level Packaging Market by End User
6.1.4.1.2 US Wafer Level Packaging Market by Type
6.1.4.1.3 US Wafer Level Packaging Market by Technology
6.1.4.2 Canada Wafer Level Packaging Market
6.1.4.2.1 Canada Wafer Level Packaging Market by End User
6.1.4.2.2 Canada Wafer Level Packaging Market by Type
6.1.4.2.3 Canada Wafer Level Packaging Market by Technology
6.1.4.3 Mexico Wafer Level Packaging Market
6.1.4.3.1 Mexico Wafer Level Packaging Market by End User
6.1.4.3.2 Mexico Wafer Level Packaging Market by Type
6.1.4.3.3 Mexico Wafer Level Packaging Market by Technology
6.1.4.4 Rest of North America Wafer Level Packaging Market
6.1.4.4.1 Rest of North America Wafer Level Packaging Market by End User
6.1.4.4.2 Rest of North America Wafer Level Packaging Market by Type
6.1.4.4.3 Rest of North America Wafer Level Packaging Market by Technology
6.2 Europe Wafer Level Packaging Market
6.2.1 Europe Wafer Level Packaging Market by End User
6.2.1.1 Europe Consumer Electronics Market by Country
6.2.1.2 Europe Automotive Market by Country
6.2.1.3 Europe Healthcare Market by Country
6.2.1.4 Europe IT & Telecommunication Market by Country
6.2.1.5 Europe Others Market by Country
6.2.2 Europe Wafer Level Packaging Market by Type
6.2.2.1 Europe WLCSP Market by Country
6.2.2.2 Europe 2.5D TSV WLP Market by Country
6.2.2.3 Europe 3D TSV WLP Market by Country
6.2.2.4 Europe Nano WLP Market by Country
6.2.2.5 Europe Others Market by Country
6.2.3 Europe Wafer Level Packaging Market by Technology
6.2.3.1 Europe Fan IN Market by Country
6.2.3.2 Europe Fan OUT Market by Country
6.2.4 Europe Wafer Level Packaging Market by Country
6.2.4.1 Germany Wafer Level Packaging Market
6.2.4.1.1 Germany Wafer Level Packaging Market by End User
6.2.4.1.2 Germany Wafer Level Packaging Market by Type
6.2.4.1.3 Germany Wafer Level Packaging Market by Technology
6.2.4.2 UK Wafer Level Packaging Market
6.2.4.2.1 UK Wafer Level Packaging Market by End User
6.2.4.2.2 UK Wafer Level Packaging Market by Type
6.2.4.2.3 UK Wafer Level Packaging Market by Technology
6.2.4.3 France Wafer Level Packaging Market
6.2.4.3.1 France Wafer Level Packaging Market by End User
6.2.4.3.2 France Wafer Level Packaging Market by Type
6.2.4.3.3 France Wafer Level Packaging Market by Technology
6.2.4.4 Russia Wafer Level Packaging Market
6.2.4.4.1 Russia Wafer Level Packaging Market by End User
6.2.4.4.2 Russia Wafer Level Packaging Market by Type
6.2.4.4.3 Russia Wafer Level Packaging Market by Technology
6.2.4.5 Spain Wafer Level Packaging Market
6.2.4.5.1 Spain Wafer Level Packaging Market by End User
6.2.4.5.2 Spain Wafer Level Packaging Market by Type
6.2.4.5.3 Spain Wafer Level Packaging Market by Technology
6.2.4.6 Italy Wafer Level Packaging Market
6.2.4.6.1 Italy Wafer Level Packaging Market by End User
6.2.4.6.2 Italy Wafer Level Packaging Market by Type
6.2.4.6.3 Italy Wafer Level Packaging Market by Technology
6.2.4.7 Rest of Europe Wafer Level Packaging Market
6.2.4.7.1 Rest of Europe Wafer Level Packaging Market by End User
6.2.4.7.2 Rest of Europe Wafer Level Packaging Market by Type
6.2.4.7.3 Rest of Europe Wafer Level Packaging Market by Technology
6.3 Asia Pacific Wafer Level Packaging Market
6.3.1 Asia Pacific Wafer Level Packaging Market by End User
6.3.1.1 Asia Pacific Consumer Electronics Market by Country
6.3.1.2 Asia Pacific Automotive Market by Country
6.3.1.3 Asia Pacific Healthcare Market by Country
6.3.1.4 Asia Pacific IT & Telecommunication Market by Country
6.3.1.5 Asia Pacific Others Market by Country
6.3.2 Asia Pacific Wafer Level Packaging Market by Type
6.3.2.1 Asia Pacific WLCSP Market by Country
6.3.2.2 Asia Pacific 2.5D TSV WLP Market by Country
6.3.2.3 Asia Pacific 3D TSV WLP Market by Country
6.3.2.4 Asia Pacific Nano WLP Market by Country
6.3.2.5 Asia Pacific Others Market by Country
6.3.3 Asia Pacific Wafer Level Packaging Market by Technology
6.3.3.1 Asia Pacific Fan IN Market by Country
6.3.3.2 Asia Pacific Fan OUT Market by Country
6.3.4 Asia Pacific Wafer Level Packaging Market by Country
6.3.4.1 China Wafer Level Packaging Market
6.3.4.1.1 China Wafer Level Packaging Market by End User
6.3.4.1.2 China Wafer Level Packaging Market by Type
6.3.4.1.3 China Wafer Level Packaging Market by Technology
6.3.4.2 Japan Wafer Level Packaging Market
6.3.4.2.1 Japan Wafer Level Packaging Market by End User
6.3.4.2.2 Japan Wafer Level Packaging Market by Type
6.3.4.2.3 Japan Wafer Level Packaging Market by Technology
6.3.4.3 India Wafer Level Packaging Market
6.3.4.3.1 India Wafer Level Packaging Market by End User
6.3.4.3.2 India Wafer Level Packaging Market by Type
6.3.4.3.3 India Wafer Level Packaging Market by Technology
6.3.4.4 South Korea Wafer Level Packaging Market
6.3.4.4.1 South Korea Wafer Level Packaging Market by End User
6.3.4.4.2 South Korea Wafer Level Packaging Market by Type
6.3.4.4.3 South Korea Wafer Level Packaging Market by Technology
6.3.4.5 Singapore Wafer Level Packaging Market
6.3.4.5.1 Singapore Wafer Level Packaging Market by End User
6.3.4.5.2 Singapore Wafer Level Packaging Market by Type
6.3.4.5.3 Singapore Wafer Level Packaging Market by Technology
6.3.4.6 Malaysia Wafer Level Packaging Market
6.3.4.6.1 Malaysia Wafer Level Packaging Market by End User
6.3.4.6.2 Malaysia Wafer Level Packaging Market by Type
6.3.4.6.3 Malaysia Wafer Level Packaging Market by Technology
6.3.4.7 Rest of Asia Pacific Wafer Level Packaging Market
6.3.4.7.1 Rest of Asia Pacific Wafer Level Packaging Market by End User
6.3.4.7.2 Rest of Asia Pacific Wafer Level Packaging Market by Type
6.3.4.7.3 Rest of Asia Pacific Wafer Level Packaging Market by Technology
6.4 LAMEA Wafer Level Packaging Market
6.4.1 LAMEA Wafer Level Packaging Market by End User
6.4.1.1 LAMEA Consumer Electronics Market by Country
6.4.1.2 LAMEA Automotive Market by Country
6.4.1.3 LAMEA Healthcare Market by Country
6.4.1.4 LAMEA IT & Telecommunication Market by Country
6.4.1.5 LAMEA Others Market by Country
6.4.2 LAMEA Wafer Level Packaging Market by Type
6.4.2.1 LAMEA WLCSP Market by Country
6.4.2.2 LAMEA 2.5D TSV WLP Market by Country
6.4.2.3 LAMEA 3D TSV WLP Market by Country
6.4.2.4 LAMEA Nano WLP Market by Country
6.4.2.5 LAMEA Others Market by Country
6.4.3 LAMEA Wafer Level Packaging Market by Technology
6.4.3.1 LAMEA Fan IN Market by Country
6.4.3.2 LAMEA Fan OUT Market by Country
6.4.4 LAMEA Wafer Level Packaging Market by Country
6.4.4.1 Brazil Wafer Level Packaging Market
6.4.4.1.1 Brazil Wafer Level Packaging Market by End User
6.4.4.1.2 Brazil Wafer Level Packaging Market by Type
6.4.4.1.3 Brazil Wafer Level Packaging Market by Technology
6.4.4.2 Argentina Wafer Level Packaging Market
6.4.4.2.1 Argentina Wafer Level Packaging Market by End User
6.4.4.2.2 Argentina Wafer Level Packaging Market by Type
6.4.4.2.3 Argentina Wafer Level Packaging Market by Technology
6.4.4.3 UAE Wafer Level Packaging Market
6.4.4.3.1 UAE Wafer Level Packaging Market by End User
6.4.4.3.2 UAE Wafer Level Packaging Market by Type
6.4.4.3.3 UAE Wafer Level Packaging Market by Technology
6.4.4.4 Saudi Arabia Wafer Level Packaging Market
6.4.4.4.1 Saudi Arabia Wafer Level Packaging Market by End User
6.4.4.4.2 Saudi Arabia Wafer Level Packaging Market by Type
6.4.4.4.3 Saudi Arabia Wafer Level Packaging Market by Technology
6.4.4.5 South Africa Wafer Level Packaging Market
6.4.4.5.1 South Africa Wafer Level Packaging Market by End User
6.4.4.5.2 South Africa Wafer Level Packaging Market by Type
6.4.4.5.3 South Africa Wafer Level Packaging Market by Technology
6.4.4.6 Nigeria Wafer Level Packaging Market
6.4.4.6.1 Nigeria Wafer Level Packaging Market by End User
6.4.4.6.2 Nigeria Wafer Level Packaging Market by Type
6.4.4.6.3 Nigeria Wafer Level Packaging Market by Technology
6.4.4.7 Rest of LAMEA Wafer Level Packaging Market
6.4.4.7.1 Rest of LAMEA Wafer Level Packaging Market by End User
6.4.4.7.2 Rest of LAMEA Wafer Level Packaging Market by Type
6.4.4.7.3 Rest of LAMEA Wafer Level Packaging Market by Technology
Chapter 7. Company Profiles
7.1 ASML Holding N.V.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.2 Fujitsu Limited
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental Analysis
7.2.4 SWOT Analysis
7.3 Toshiba Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research and Development Expense
7.4 Qualcomm, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.5 Amkor Technology, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expense
7.6 Deca Technologies, Inc.
7.6.1 Company Overview
7.6.2 Recent strategies and developments:
7.6.2.1 Partnerships, Collaborations, and Agreements:
7.6.2.2 Product Launches and Product Expansions:
7.7 Jiangsu Changjing Electronics Technology Co., Ltd.
7.7.1 Company Overview
7.8 Tokyo Electron Ltd.
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research & Development Expenses
7.9 Applied Materials, Inc.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.10. Lam Research Corporation
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expenses

Companies Mentioned

  • ASML Holding N.V.
  • Fujitsu Limited
  • Toshiba Corporation
  • Qualcomm, Inc.
  • Amkor Technology, Inc.
  • Deca Technologies, Inc.
  • Jiangsu Changjing Electronics Technology Co., Ltd.
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • Lam Research Corporation

Methodology

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Table Information

Report AttributeDetails
No. of Pages213
PublishedMay 2022
Forecast Period2021 - 2028
Estimated Market Value ( USD ) in 2021 $ 4669 Million
Forecasted Market Value ( USD ) by 2028 $ 14057 Million
Compound Annual Growth Rate17.7%
Regions CoveredGlobal
No. of Companies Mentioned10

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