The Asia Pacific Digital Isolator Market is expected to witness market growth of 9.2% CAGR during the forecast period (2022-2028).
The addition of a solid ground plane beside the high-speed signal layer provides controlled impedance for transfer light interconnects as well as a low-inductance channel for return current flow. A high-frequency bypass capacitance is created by placing the power supply adjacent to the ground plane. The slower-speed control signals can be routed on the bottom layer for more flexibility, as their lengths usually allow for a tolerance of discontinuities like vias. To keep the stack symmetrical, a second power or ground plane system must be added if an additional supply voltage plane or signal layer is required. This keeps the second from warping by making it mechanically stable. Additionally, the power and ground planes at each power system can be positioned closer together, resulting in a considerable increase in high-frequency bypass capacitance.
Although Australia's semiconductor business is smaller in comparison to other economies, it does comprise strengths and strategic relevance. NSW and Australia have the ability to improve their participation across the global semiconductor value chain if they take a long-term strategy and comply with it. The dynamism and transformation that have characterized the semiconductor industry in the last 40 years allowing countries, like Taiwan and Singapore, to develop and succeed is expected to accelerate significantly in the next 40 years. It is expected to offer various growth prospects for new market players across the region, such as Australian companies with innovative products, processes, or business models, to emerge and thrive in the global semiconductor value chain and related industries.
Singapore, Taiwan, China, South Korea, and Israel have all developed strategic national industrial policies and initiatives in order to not only engage in the semiconductor value chain but also to rise in importance and significance. These comprehensive national-level initiatives have expedited and harnessed each country's existing and rising comparative and competitive advantages.
The China market dominated the Asia Pacific Digital Isolator Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $294.1 million by 2028. The Japan market is anticipated to grow at a CAGR of 8.6% during (2022 - 2028). Additionally, The India market is expected to showcase a CAGR of 9.9% during (2022 - 2028).
Based on Technology, the market is segmented into Capacitive Coupling, Magnetic Coupling, and Giant Magnetoresistive. Based on Vertical, the market is segmented into Industrial, Telecommunications, Automotive, Healthcare, Aerospace & Defense, Energy & Power, and Others. Based on Application, the market is segmented into Gate Drivers, DC/DC Converters, Analog to Digital Converters, USB & Other Communication Ports, and CAN Isolation & Others. Based on Insulating Material, the market is segmented into Silicon Dioxide (Sio2)-based, Polyimide-based, and Others. Based on Channel, the market is segmented into 4 Channel, 6 Channel, 2 Channel, and 8 Channel & Others. Based on Data rate, the market is segmented into More than 75 Mbps, 25 - 75 Mbps, and Up To 25 Mbps. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Renesas Electronics Corporation, Texas Instruments, Inc., Analog Devices, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Rohm Semiconductors, Broadcom, Inc., Skyworks Solutions, Inc., Vicor Corporation, and NVE Corporation.
The addition of a solid ground plane beside the high-speed signal layer provides controlled impedance for transfer light interconnects as well as a low-inductance channel for return current flow. A high-frequency bypass capacitance is created by placing the power supply adjacent to the ground plane. The slower-speed control signals can be routed on the bottom layer for more flexibility, as their lengths usually allow for a tolerance of discontinuities like vias. To keep the stack symmetrical, a second power or ground plane system must be added if an additional supply voltage plane or signal layer is required. This keeps the second from warping by making it mechanically stable. Additionally, the power and ground planes at each power system can be positioned closer together, resulting in a considerable increase in high-frequency bypass capacitance.
Although Australia's semiconductor business is smaller in comparison to other economies, it does comprise strengths and strategic relevance. NSW and Australia have the ability to improve their participation across the global semiconductor value chain if they take a long-term strategy and comply with it. The dynamism and transformation that have characterized the semiconductor industry in the last 40 years allowing countries, like Taiwan and Singapore, to develop and succeed is expected to accelerate significantly in the next 40 years. It is expected to offer various growth prospects for new market players across the region, such as Australian companies with innovative products, processes, or business models, to emerge and thrive in the global semiconductor value chain and related industries.
Singapore, Taiwan, China, South Korea, and Israel have all developed strategic national industrial policies and initiatives in order to not only engage in the semiconductor value chain but also to rise in importance and significance. These comprehensive national-level initiatives have expedited and harnessed each country's existing and rising comparative and competitive advantages.
The China market dominated the Asia Pacific Digital Isolator Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $294.1 million by 2028. The Japan market is anticipated to grow at a CAGR of 8.6% during (2022 - 2028). Additionally, The India market is expected to showcase a CAGR of 9.9% during (2022 - 2028).
Based on Technology, the market is segmented into Capacitive Coupling, Magnetic Coupling, and Giant Magnetoresistive. Based on Vertical, the market is segmented into Industrial, Telecommunications, Automotive, Healthcare, Aerospace & Defense, Energy & Power, and Others. Based on Application, the market is segmented into Gate Drivers, DC/DC Converters, Analog to Digital Converters, USB & Other Communication Ports, and CAN Isolation & Others. Based on Insulating Material, the market is segmented into Silicon Dioxide (Sio2)-based, Polyimide-based, and Others. Based on Channel, the market is segmented into 4 Channel, 6 Channel, 2 Channel, and 8 Channel & Others. Based on Data rate, the market is segmented into More than 75 Mbps, 25 - 75 Mbps, and Up To 25 Mbps. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Renesas Electronics Corporation, Texas Instruments, Inc., Analog Devices, Inc., Infineon Technologies AG, NXP Semiconductors N.V., Rohm Semiconductors, Broadcom, Inc., Skyworks Solutions, Inc., Vicor Corporation, and NVE Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Technology
- Capacitive Coupling
- Magnetic Coupling
- Giant Magnetoresistive
By Vertical
- Industrial
- Telecommunications
- Automotive
- Healthcare
- Aerospace & Defense
- Energy & Power
- Others
By Application
- Gate Drivers
- DC/DC Converters
- Analog to Digital Converters
- USB & Other Communication Ports
- CAN Isolation & Others
By Insulating Material
- Silicon Dioxide (Sio2)-based
- Polyimide-based
- Others
By Channel
- 4 Channel
- 6 Channel
- 2 Channel
- 8 Channel & Others
By Data Rate
- More than 75 Mbps
- 25 - 75 Mbps
- Up To 25 Mbps
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Renesas Electronics Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Rohm Semiconductors
- Broadcom, Inc.
- Skyworks Solutions, Inc.
- Vicor Corporation
- NVE Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. Asia Pacific Digital Isolator Market by Technology
Chapter 5. Asia Pacific Digital Isolator Market by Vertical
Chapter 6. Asia Pacific Digital Isolator Market by Application
Chapter 7. Asia Pacific Digital Isolator Market by Insulating Material
Chapter 8. Asia Pacific Digital Isolator Market by Channel
Chapter 9. Asia Pacific Digital Isolator Market by Data Rate
Chapter 10. Asia Pacific Digital Isolator Market by Country
Chapter 11. Company Profiles
Companies Mentioned
- Renesas Electronics Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Rohm Semiconductors
- Broadcom, Inc.
- Skyworks Solutions, Inc.
- Vicor Corporation
- NVE Corporation
Methodology
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