6G Communications Dielectric, Thermal and Transparent Materials : Markets, Technology 2025-2045” starts with an Executive Summary and Conclusions clearly pulling everything together for those with limited time. Those 26 pages are mainly lucid new infograms, the 13 key conclusions and 2025-2045 roadmaps. The 30 forecast lines then add pages as both tables and graphs. The 41-page Introduction gives a thorough background to 6G hardware with SWOT appraisals and introduces some 2024 research.
Flood of 2024 research analysed
Then come two large chapters on your thermal materials and device opportunities in the light of breakthroughs in 2024 with a large amount of 2024 research analysed. Chapter 3 “6G thermal management materials and applications” (94 pages) presents the overall thermal picture, with the latest view of needs matched to the latest toolkit. That includes new thermally conductive polymers and composites, thermal metamaterial, hydrogel, aerogel, ionogel, pyrolytic graphite and graphene for both 6G infrastructure and client devices. There is even deep coverage of thermal systems you may wish to supply.
6G cooling becomes a large opportunity
Cooling emerges as the major thermal requirement due to 6G infrastructure making more heat and requiring client devices to manage heat in smaller formats. Indeed, emerging markets are in hotter places such as India and global warming also contributes to the 6G cooling problem. Conventional vapor compression cooling heats cities by up to several degrees and is not fit-and-forget so attention turns to solid state cooling for 6G merging with its hosts such as high-rise buildings and loitering stratospheric drones.
Consequently, a dedicated Chapter 4, “Solid state cooling for 6G using dielectric, thermal and transparent materials” (35 pages) analyses this favourite for infrastructure and client devices on the 20-year view. See eleven primary conclusions, most needed compounds for future solid-state cooling in 211 recent research announcements and twelve solid-state cooling operating principles compared by 10 capabilities. The research pipeline of solid-state cooling by topic vs technology readiness level is presented in three new maturity curves 2025, 2035, 2045.
Thermal interface materials, thermoelectric, caloric, passive daytime radiative and other cooling principles are covered. Interestingly, your ultra-WBG materials such as SiN, AlN, BN and dielectrics such as silicas and aluminas are here need for cooling but later identified for many other 6G uses as well. It is found that solid state cooling suitable for 6G mainly needs inorganics whereas the other needs addressed in the report mainly need identified polymers.
Invisibility
Invisible 6G infrastructure will be more acceptable and functional from solar drones at 20km to satellites and transparent materials and devices, two major types being covered in Chapter 5, “Invisibility solves acceptance and performance problems: Transparent passive reflect-arrays and all-round STAR RIS”, its 32 pages including two SWOT appraisals and a large amount of research progress in 2024.
Dielectric multifunctional metamaterials
Chapter 6, “Metamaterial basics, transmission, energy harvesting and more for 6G communications” takes 20 pages the assess a large amount of 2024 advance and give a SWOT appraisal. Understand why 6G demands progress from metal patterning on epoxy laminate to flexible, transparent, self-cleaning - even all dielectric - metamaterials for making 6G photovoltaics follow the sun and keep cool and for handling THz, near IR and visible light. See the remarkable research progress in 2024 achieving just that and also making electricity from movement, useful in 6G client devices.
Optical transmission materials and devices emerging
Then comes a large Chapter 7, “Dielectrics, optical materials, semiconductors for 6G 0.3THz to visible light 6G transmission” at 109 pages. Mostly dielectrics, it also includes ultra-wide gap semiconductors coming in and the flood of new research progress on all these topics. Overall, the important performance parameters are identified and, for dielectrics, a very detailed look at permittivities and dissipation factors DF for 20 dielectric families at the higher 6G frequencies. Matched against needs, it reveals that the emerging market for dielectrics with intermediate DF, low permittivity such as polyimides will be large, that for low DF, low permittivity such as porous silicas will be significant but there will also be a market for high permittivity, low DF such as hafnium oxide. What about Fluoropolymers (PBVE, PTFE, PVDF), epsilon near zero materials, THz and optical tuning materials? It is all here with a host of 2024 research advances and latest views.
Partners and acquisitions
To save time, you will need partners and acquisitions, mostly small companies, so the final Chapter 8, “Some small companies involved in 6G added value material and device manufacturing technologies” in 40 pages, profiles 14 for you to consider.
An important takeaway from, “6G Communications Dielectric, Thermal and Transparent Materials : Markets, Technology 2025-2045” is that the most successful materials in research for 6G thermal, dielectric and transparent applications have exceptionally varied morphologies, formats and applications in the preferred solid-state phase and are useful in many new composites. Overall, they are fairly-evenly divided between inorganics and organics with a trend to multifunctional smart materials using both.
Table of Contents
Samples
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Companies Mentioned
- AALTO HAPS
- Active Aerogels
- Aerogel Technologies
- Aerogel UK
- AGC
- Analog Devices
- Anritsu
- Apple
- Arctic
- Aspen Aerogels
- B-Com
- BT
- Cabot Corp.
- China Telecommunications
- Cold Case Gear
- Corning
- Covestro
- DeGruyter
- Dow
- DuPont
- Echodyne
- Enersens
- Ericsson
- Evolv Technology
- Fiat
- Finistar
- Fractal Antenna Systems
- Fujitsu
- Gentherm
- GLPOLY
- Guangdong Alison Hi-Tech
- Greenerwave
- Guizhou Aerospace
- Henkel
- Huawei
- HTC
- iQLP
- Kyocera
- Kymeta
- LATYS Intelligence
- Lenovo
- LG
- Metacept
- Metamaterials Inc now Meta
- Metawave
- Microsoft
- Mitsubishi
- Motorola
- Murata
- Nano High Tech
- NanoMeta technogies
- NEC
- Netgear
- Nitrium
- Noctua
- Nokia
- Nubia
- NTT
- NTT DoCoMo
- OPPO
- Orange
- Panasonic
- Parker Hannefin
- Pivotal Commware
- Plasmonics
- Qualcomm
- Quektel
- Radi-CoolRoger
- Rohde & Schwartz
- Sabic
- Samsung
- Schott
- Sekisui
- Sharp
- Shenzhen Aerogel Technology
- Shenzhen Zhouming Technology
- Shin-Etsu
- Sierra
- SNCF
- SolAero
- Sony
- Space Liquid Metal Technology Development Jiangsu
- SensorMetrix
- Spectrolab
- Strouss
- Suzhou Daysan
- TDK
- Telefonica
- Telit
- Teraview
- Thermal Graphite
- Thermionics
- Toyota
- Tubitak
- VIVO
- WL Gore
- Wuhan Raycus
- Xiamen Nameite
- Xiaomi
- ZTE
Methodology
Research Inputs Include:
- Appraisal of which targeted needs are genuine
- Web, literature, databases, experience and patents
- Close study of research pipeline
- Appraisal of regional initiatives
- Actitivies of standard bodies
- Limitations of physics and chemistry
- Interviews
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