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Europe Radiation Hardened Electronics Market Size, Share & Industry Trends Analysis Report By Component, By Manufacturing Technique, By Product Type, By Application (Space, Aerospace & Defense, Nuclear Power Plant, Medical), By Country and Growth Forecast, 2022 - 2028

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    Report

  • 128 Pages
  • June 2022
  • Region: Europe
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5636741
The Europe Radiation Hardened Electronics Market is expected to witness market growth of 3.5% CAGR during the forecast period (2022-2028).

The aerospace and defense industries are the primary users of radiation hardening and survival testing. Defense systems and facilities that are expected to function in the aftermath of a nuclear explosion must be tolerant of huge amounts of radiation, which necessitates the use of radiation-hardened electronics. These radiation-hardened electronics and systems must also be able to work in the event of secondary radiation impacts, such as an electromagnetic pulse, which is a massive dosage of electromagnetic radiation. For that functionality to be maintained through an event where these systems are exposed to high levels of radiation, it requires radiation-hardened electronics to be used in the design.

Solar flares, which release tremendous volumes of radiation, are one of the greatest risks to industrial and military satellite systems in space. Solar flares with enough force can even harm electronics on Earth's surface, triggering power outages and system malfunctions. Solar flares are especially dangerous to spacecraft, spacecraft, and space stations because they have no atmosphere to protect them. Radiation hardening measures are critical for protecting human passengers from the direct impacts of electromagnetic exposure to radiation as well as preventing damage to spacecraft electronic equipment caused by space radiation.

The Robotic Exploration of Severe Environments project was a Helmholtz Alliance research project aimed at improving Germany's robotics capabilities for extreme climates such as deep-sea and space exploration from 2012 to 2017. The project's common technological study goal was to increase autonomous robotic functionality for both application domains, while the focus was also on putting research into practice, increasing technology readiness, and demonstrating features and functionality during test protests in realistic environments.

The deep-sea domain conducted a demonstration in the Arctic region (Svalbard) in October 2017, and the space domain conducted the ROBEX analog mission on Mt Etna in June/July 2017, bringing together several DLR establishments with other German research groups to illustrate independent robotics abilities in the dangerous deep sea and outer space environments.

The development of webcams for surveillance technology to monitor nuclear reactors or nuclear waste storage sites is gaining popularity. Radiation tolerance is required for some applications, with doses in the Megagray (SiOsub 2) range, whereas the most resistant commercial or prototype equipment based on solid-state image sensors can withstand doses as low as a few Known Good Yield. The radiation hardening technique developed by research groups to improve the tolerance to ionizing radiation of various sub-parts of these imaging techniques by working at the components and assemblies design levels at the same time.

The Germany market dominated the Europe Radiation Hardened Electronics Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $117.2 million by 2028. The UK market is estimated to grow at a CAGR of 2.6% during (2022-2028). Additionally, The France market is expected to witness a CAGR of 4.3% during (2022-2028).

Based on Component, the market is segmented into Power Management, Mixed Signal ICs, Processors & Controllers, and Memory. Based on Manufacturing Technique, the market is segmented into Radiation-Hardening by Design (RHBD) and Radiation-Hardening by Process (RHBP). Based on Product Type, the market is segmented into Commercial-off-the-Shelf (COTS) and Custom Made. Based on Application, the market is segmented into Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Renesas Electronics Corporation, STMicroelectronics N.V., Infineon Technologies AG, Texas Instruments, Inc., Microchip Technology, Inc., Teledyne Technologies, Inc., Honeywell International, Inc., BAE Systems PLC, Xilinx, Inc., and TTM Technologies, Inc.

Scope of the Study


Market Segments Covered in the Report:


By Component
  • Power Management
  • Mixed Signal ICs
  • Processors & Controllers
  • Memory
By Manufacturing Technique
  • Radiation-Hardening by Design (RHBD)
  • Radiation-Hardening by Process (RHBP)
By Product Type
  • Commercial-off-the-Shelf (COTS)
  • Custom Made
By Application
  • Space
  • Aerospace & Defense
  • Nuclear Power Plant
  • Medical
  • Space
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Key Market Players


List of Companies Profiled in the Report:

  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Microchip Technology, Inc.
  • Teledyne Technologies, Inc.
  • Honeywell International, Inc.
  • BAE Systems PLC
  • Xilinx, Inc.
  • TTM Technologies, Inc.

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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Radiation Hardened Electronics Market, by Component
1.4.2 Europe Radiation Hardened Electronics Market, by Manufacturing Technique
1.4.3 Europe Radiation Hardened Electronics Market, by Product Type
1.4.4 Europe Radiation Hardened Electronics Market, by Application
1.4.5 Europe Radiation Hardened Electronics Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market composition & scenarios
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.2.4 Geographical Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies Percentage Distribution (2018-2022)
3.3.2 Key Strategic Move (Product Launches and Product Expansions 2019, May - 2022, Apr) Leading Players
Chapter 4. Europe Radiation Hardened Electronics Market by Component
4.1 Europe Power Management Market by Country
4.2 Europe Mixed Signal ICs Market by Country
4.3 Europe Processors & Controllers Market by Country
4.4 Europe Memory Market by Country
Chapter 5. Europe Radiation Hardened Electronics Market by Manufacturing Technique
5.1 Europe Radiation-Hardening by Design (RHBD) Market by Country
5.2 Europe Radiation-Hardening by Process (RHBP) Market by Country
Chapter 6. Europe Radiation Hardened Electronics Market by Product Type
6.1 Europe Commercial-off-the-Shelf (COTS) Market by Country
6.2 Europe Custom Made Market by Country
Chapter 7. Europe Radiation Hardened Electronics Market by Application
7.1 Europe Space Market by Country
7.2 Europe Aerospace & Defense Market by Country
7.3 Europe Nuclear Power Plant Market by Country
7.4 Europe Medical Market by Country
7.5 Europe Others Market by Country
Chapter 8. Europe Radiation Hardened Electronics Market by Country
8.1 Germany Radiation Hardened Electronics Market
8.1.1 Germany Radiation Hardened Electronics Market by Component
8.1.2 Germany Radiation Hardened Electronics Market by Manufacturing Technique
8.1.3 Germany Radiation Hardened Electronics Market by Product Type
8.1.4 Germany Radiation Hardened Electronics Market by Application
8.2 UK Radiation Hardened Electronics Market
8.2.1 UK Radiation Hardened Electronics Market by Component
8.2.2 UK Radiation Hardened Electronics Market by Manufacturing Technique
8.2.3 UK Radiation Hardened Electronics Market by Product Type
8.2.4 UK Radiation Hardened Electronics Market by Application
8.3 France Radiation Hardened Electronics Market
8.3.1 France Radiation Hardened Electronics Market by Component
8.3.2 France Radiation Hardened Electronics Market by Manufacturing Technique
8.3.3 France Radiation Hardened Electronics Market by Product Type
8.3.4 France Radiation Hardened Electronics Market by Application
8.4 Russia Radiation Hardened Electronics Market
8.4.1 Russia Radiation Hardened Electronics Market by Component
8.4.2 Russia Radiation Hardened Electronics Market by Manufacturing Technique
8.4.3 Russia Radiation Hardened Electronics Market by Product Type
8.4.4 Russia Radiation Hardened Electronics Market by Application
8.5 Spain Radiation Hardened Electronics Market
8.5.1 Spain Radiation Hardened Electronics Market by Component
8.5.2 Spain Radiation Hardened Electronics Market by Manufacturing Technique
8.5.3 Spain Radiation Hardened Electronics Market by Product Type
8.5.4 Spain Radiation Hardened Electronics Market by Application
8.6 Italy Radiation Hardened Electronics Market
8.6.1 Italy Radiation Hardened Electronics Market by Component
8.6.2 Italy Radiation Hardened Electronics Market by Manufacturing Technique
8.6.3 Italy Radiation Hardened Electronics Market by Product Type
8.6.4 Italy Radiation Hardened Electronics Market by Application
8.7 Rest of Europe Radiation Hardened Electronics Market
8.7.1 Rest of Europe Radiation Hardened Electronics Market by Component
8.7.2 Rest of Europe Radiation Hardened Electronics Market by Manufacturing Technique
8.7.3 Rest of Europe Radiation Hardened Electronics Market by Product Type
8.7.4 Rest of Europe Radiation Hardened Electronics Market by Application
Chapter 9. Company Profiles
9.1 Renesas Electronics Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expense
9.1.5 Recent strategies and developments
9.1.5.1 Product Launches and Product Expansions
9.1.5.2 Acquisition and Mergers
9.2 STMicroelectronics N.V.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expense
9.2.5 Recent strategies and developments
9.2.5.1 Product Launches and Product Expansions
9.2.6 SWOT Analysis
9.3 Infineon Technologies AG
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 Recent strategies and developments
9.3.5.1 Product Launches and Product Expansions
9.3.5.2 Acquisition and Mergers
9.3.5.3 Geographical Expansions
9.3.6 SWOT Analysis
9.4 Texas Instruments, Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expense
9.4.5 SWOT Analysis
9.5 Microchip Technology, Inc.
9.5.1 Company overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 Recent strategies and developments
9.5.5.1 Product Launches and Product Expansions
9.6 Teledyne Technologies, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments
9.6.5.1 Product Launches and Product Expansions
9.7 Honeywell International, Inc.
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 BAE Systems PLC
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 SWOT Analysis
9.9 Xilinx, Inc. (Advanced Micro Devices, Inc.)
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Segmental and Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments
9.9.5.1 Partnerships, Collaborations, and Agreements
9.9.5.2 Product Launches and Product Expansions
9.10. TTM Technologies, Inc.
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses

Companies Mentioned

  • Renesas Electronics Corporation
  • STMicroelectronics N.V.
  • Infineon Technologies AG
  • Texas Instruments, Inc.
  • Microchip Technology, Inc.
  • Teledyne Technologies, Inc.
  • Honeywell International, Inc.
  • BAE Systems PLC
  • Xilinx, Inc.
  • TTM Technologies, Inc.

Methodology

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