The global wafer level packaging market size was valued at $4.54 billion in 2020, and is projected to reach $23.56 billion by 2030, registering a CAGR of 18.8% from 2021 to 2030. Wafer-level packaging (WLP) is a technology of packaging an integrated circuit (IC) where all of the packaging process steps are carried out at the wafer level. The components used in assembly (such as bumps) are applied to the wafer pre-dicing in wafer level packaging. However, wafers are diced into independent dies and then combined into a semiconductor package in traditional semiconductor fabrication. WLP provides various benefits such as reduced testing time & cost, easier inventory management, among others.
Growth of the global wafer level packaging market is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.
The global wafer level packaging market is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others.
Region wise, the wafer level packaging market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the wafer level packaging market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the automotive segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation.
Growth of the global wafer level packaging market is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.
The global wafer level packaging market is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others.
Region wise, the wafer level packaging market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the wafer level packaging market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the automotive segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation.
Key Benefits For Stakeholders
- This study comprises analytical depiction of the global wafer level packaging market size along with current trends and future estimations to depict imminent investment pockets.
- The overall wafer level packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.
- The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
- The current wafer level packaging market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
- Porter’s five forces analysis illustrates the potency of the buyers and the wafer level packaging market share of key vendors.
- The report includes the market trends and the market share of key vendors.
Key Market Segments
By Technology
- Fan in wafer level packaging
- Fan out wafer level packaging
By Type
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others
By End User
- Consumer Electronics
- IT and Telecommunication
- Automotive
- Healthcare
- Others
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- Taiwan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- Amkor Technology, Inc.
- Fujitsu
- Jiangsu Changjiang Electronics Technology Co. Ltd
- Deca Technologies
- Qualcomm Technologies, Inc.
- Toshiba Corporation
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- ASML Holding N.V
- Lam Research Corporation
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Table of Contents
CHAPTER 1: INTRODUCTION
CHAPTER 2: EXECUTIVE SUMMARY
CHAPTER 3: MARKET OVERVIEW
CHAPTER 4: WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY
CHAPTER 5: WAFER LEVEL PACKAGING MARKET, BY TYPE
CHAPTER 6: WAFER LEVEL PACKAGING MARKET, BY END USER
CHAPTER 7: WAFER LEVEL PACKAGING MARKET, BY REGION
CHAPTER 8: COMPANY LANDSCAPE
CHAPTER 9: COMPANY PROFILES
LIST OF TABLES
LIST OF FIGURES
Executive Summary
According to this report titled, 'Wafer Level Packaging Market,' the wafer level packaging market size was valued at $4.5 billion in 2020, and is estimated to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030. Asia-Pacific is expected to be the leading contributor toward the wafer level packaging market during the forecast period, followed by LAMEA and Europe.WLP is used for interconnecting semiconductor devices such as micro sensors, microscopic devices, microprocessors, and others to external circuitry while utilizing deposited solder bumps onto the chip pads. It allows integration of wafer fab, packaging, burn-in, and test at wafer level to streamline the manufacturing process undertaken by a device.
Growth of the global wafer level packaging industry is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the wafer level packaging market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.
Moreover, developing nations tend to witness high penetration of wafer level packaging products, especially in healthcare segment, which is anticipated to augment the market growth. Factors such as technological advancements and innovations in wafer level packaging products accelerate the market growth. Also, In semiconductor advance packaging sector wlcsp package, wlcsp process flow, and wafer chip scale package are in the latest trends.
The global wafer level packaging industry is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others. Also, the report provides a detailed Wafer level packaging market Analysis based on competitive intensity and how the competition will take shape in coming years.
Region wise, the wafer level packaging market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific contributed maximum revenue in 2020. Also, between 2020 and 2030, the wafer level packaging market in Asia-Pacific is expected to grow at a faster rate as compared to other regions. This is attributed to increase in demand from emerging economical countries such as India, China, and South Korea.
Key findings of the Study
- The fan in wafer level packaging segment is projected to be the major technology, followed by fan out wafer level packaging.
- Asia-Pacific and North America collectively accounted for more than 75% of the wafer level packaging market share in 2020.
- India is anticipated to witness highest growth rate during the forecast period.
- U.S. was the major shareholder in the North America wafer level packaging market, accounting for approximately $ 69% share in 2020.
- Depending on type, the consumer electronics segment generated the highest revenue in 2020. However, the others segment is expected to witness the highest growth rate in the future.
- Region wise, the wafer level packaging market was dominated by Asia-Pacific. Also, Asia-Pacific is expected to witness significant growth in the coming years.
Companies Mentioned
- Amkor Technology, Inc.
- Fujitsu
- Jiangsu Changjiang Electronics Technology Co. Ltd
- Deca Technologies
- Qualcomm Technologies, Inc.
- Toshiba Corporation
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- ASML Holding N.V
- Lam Research Corporation
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 315 |
| Published | April 2022 |
| Forecast Period | 2020 - 2030 |
| Estimated Market Value ( USD | $ 4.54 billion |
| Forecasted Market Value ( USD | $ 23.56 billion |
| Compound Annual Growth Rate | 17.9% |
| Regions Covered | Global |
| No. of Companies Mentioned | 10 |
