The global system in package (SiP) technology market size was valued at $14.77 billion in 2020, and is projected to reach $34.15 billion by 2030, registering a CAGR of 9.7% from 2021 to 2030. A system in package (SiP) is a technique that combines many integrated circuits (ICs) or semiconductor dies with diverse functionality into a single package or a system that performs multiple functions. SiP has progressed from a niche technology with a limited number of applications to a high-volume technology with a wide range of uses. In mobile applications, the technology is often employed in stack memory or logic devices, as well as compact modules. SiP has become a viable alternative to system on chip (SoC) due to various advantages, such as flexibility, less R&D costs, and low product costs.
Growth of the global system in package (SiP) technology market is anticipated to be driven by factors, such as advent of 5G network connected devices, high demand for compact electronics gadgets with internet connectivity, and rise in the number of the Internet of Things (IoT) devices. In addition, growing adoption of smartphones and smart wearables boosts the market growth. However, higher level of integration leads to thermal issues acts as a major restraint for the market. On the contrary, high demand from Asia-Pacific is expected to fuel the market growth during the forecast period.
The system in package (SiP) technology market is segmented on the basis of packaging technology, packaging method, end user, and region. By packaging technology, the market is classified into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. Depending on packaging method, it is categorized into wire bond and flip chip. On the basis of end user, market is divided into consumer electronics, automotive, telecommunication, industrial system, aerospace & defense, and others.
Region-wise, the system in package (SiP) technology market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the system in package (SiP) technology market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the consumer electronics segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc., ASE Group, Chipmos Technologies Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technologies Inc., Qualcomm Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., and Toshiba Corporation.
Growth of the global system in package (SiP) technology market is anticipated to be driven by factors, such as advent of 5G network connected devices, high demand for compact electronics gadgets with internet connectivity, and rise in the number of the Internet of Things (IoT) devices. In addition, growing adoption of smartphones and smart wearables boosts the market growth. However, higher level of integration leads to thermal issues acts as a major restraint for the market. On the contrary, high demand from Asia-Pacific is expected to fuel the market growth during the forecast period.
The system in package (SiP) technology market is segmented on the basis of packaging technology, packaging method, end user, and region. By packaging technology, the market is classified into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. Depending on packaging method, it is categorized into wire bond and flip chip. On the basis of end user, market is divided into consumer electronics, automotive, telecommunication, industrial system, aerospace & defense, and others.
Region-wise, the system in package (SiP) technology market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the system in package (SiP) technology market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the consumer electronics segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc., ASE Group, Chipmos Technologies Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technologies Inc., Qualcomm Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., and Toshiba Corporation.
Key Benefits For Stakeholders
- This study comprises analytical depiction of the global system in package (SiP) technology market size along with current trends and future estimations to depict imminent investment pockets.
- The overall system in package (SiP) technology market analysis is determined to understand the profitable trends to gain a stronger foothold.
- The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
- The current system in package (SiP) technology market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
- Porter’s five forces analysis illustrates the potency of the buyers and the system in package (SiP) technology market share of key vendors.
- The report includes the market trends and the market share of key vendors.
Key Market Segments
By Packaging Technology
- 2D IC Packaging
- 2.5D IC Packaging
- 3D IC Packaging
By Packaging Method
- Wire Bond
- Flip Chip
By End User
- Consumer Electronics
- Automotive
- Telecommunication
- Industrial System
- Aerospace and Defense
- Others
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- Taiwan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- CHIPMOS TECHNOLOGIES INC.
- POWERTECH TECHNOLOGIES INC.
- ASE GROUP
- AMKOR TECHNOLOGY INC.
- FUJITSU LTD
- TOSHIBA CORPORATION
- RENESAS ELECTRONICS CORPORATION
- SAMSUNG ELECTRONICS CO LTD
- Qualcomm Inc
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Table of Contents
CHAPTER 1: INTRODUCTION
CHAPTER 2: EXECUTIVE SUMMARY
CHAPTER 3: MARKET OVERVIEW
CHAPTER 4: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY
CHAPTER 5: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING METHOD
CHAPTER 6: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY END USER
CHAPTER 7: SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY REGION
CHAPTER 8: COMPANY LANDSCAPE
CHAPTER 9: COMPANY PROFILES
LIST OF TABLES
LIST OF FIGURES
Executive Summary
According to this report titled, 'System in Package (SiP) Technology Market,' the system in package (sip) technology market size was valued at $14.8 billion in 2020, and is estimated to reach $34.2 billion by 2030, growing at a CAGR of 9.7% from 2021 to 2030. Asia-Pacific is expected to be the leading contributor toward the system in package (SiP) technology market during the forecast period, followed by LAMEA and Europe.System in package (SiP) technology is a packaging approach that combines numerous electronic sub components with other passive components on a single substrate. The key benefits of system in package (SiP) technology is that they are not only IC packages with many dies, but also incorporate active systems or subsystems within the IC package.
Growth of the global system in package (SiP) technology industry is anticipated to be driven by factors such advent of 5G network connected devices, high demand for compact electronics gadgets with internet connectivity, and rise in the number of the Internet of Things (IoT) devices. In addition, growing adoption of smartphones and smart wearables boost the market growth. However, higher level of integration leads to thermal issues acts as a major restraint for the market. On the contrary, high demand from Asia-Pacific is expected to fuel the market growth during the forecast period.
Moreover, developing nations tend to witness high penetration of system in package (SiP) technology products, especially in the automotive segment, which is anticipated to augment the system in package (SiP) technology market growth. Factors such as growing need for circuit miniaturization in microelectronic devices accelerate the market growth. Also, system in package design is in the latest trend.
The system in package (SiP) technology market is segmented on the basis of packaging technology, packaging method, end user, and region. By packaging technology, the market is classified into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. Depending on packaging method, it is categorized into wire bond and flip chip. On the basis of end user, market is divided into consumer electronics, automotive, telecommunication, industrial system, aerospace & defense, and others. Also, the report provides a detailed System in Package (SiP) Technology Market Analysis based on competitive intensity and how the competition will take shape in coming years.
Region-wise, the System in Package (SiP) Technology market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific contributed maximum revenue in 2020. Also, between 2020 and 2030, the system in package (SiP) technology market in Asia-Pacific is expected to grow at a faster rate as compared to other regions. This is attributed to increase in demand from emerging economical countries such as India, China, and South Korea.
KEY FINDINGS OF STUDY
- The 2.5D IC packaging segment is projected to be the major packaging technology, followed 3D IC packaging.
- Asia-Pacific and North America collectively accounted for more than 75% of the system in package (SiP) technology market share in 2020.-
- India is anticipated to witness highest growth rate during the forecast period.
- The U.S. was the major shareholder in the North America system in package (SiP) technology market, accounting for approximately $ 70% share in 2020.
- By packaging method, the wire bond segment generated the highest revenue in 2020. However, the flip chip segment is expected to witness the highest growth rate in the future.
- Region-wise, the system in package (SiP) technology market was dominated by Asia-Pacific. Also, Asia-Pacific is expected to witness significant growth in the coming years.
Companies Mentioned
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- CHIPMOS TECHNOLOGIES INC.
- POWERTECH TECHNOLOGIES INC.
- ASE GROUP
- AMKOR TECHNOLOGY INC.
- FUJITSU LTD
- TOSHIBA CORPORATION
- RENESAS ELECTRONICS CORPORATION
- SAMSUNG ELECTRONICS CO LTD
- Qualcomm Inc
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 310 |
| Published | April 2022 |
| Forecast Period | 2020 - 2030 |
| Estimated Market Value ( USD | $ 14.77 billion |
| Forecasted Market Value ( USD | $ 34.15 billion |
| Compound Annual Growth Rate | 8.7% |
| Regions Covered | Global |
| No. of Companies Mentioned | 10 |
