Middle East & Africa Radiation-Hardened Electronics Market Forecast to 2028 - COVID-19 Impact and Regional Analysis - by Component, Manufacturing Technique and Application

The MEA radiation-hardened electronics market is expected to grow from US$ 72.40 million in 2021 to US$ 87.43 million by 2028; it is estimated to grow at a CAGR of 2.7% from 2021 to 2028.

The increase in demand for radiation-hardened electronics by the end-use industries has influenced manufacturers to invest in product development. Major players operating in the market include BAE Systems; Microchip Technology Inc.; Texas Instruments Incorporated; Renesas Electronics Corporation; and Xilinx, Inc. Some of the recent product developments across the region have taken place in recent years. For instance, in October 2021, VORAGO Technologies announced Arm Cortex-M4 VA41628 and VA41629, two new radiation-hardened microcontrollers designed to give flexibility in space-based missions for the aerospace & defense sector. Consumers of the product will be able to upgrade from previous generations of rad-hard arm microcontrollers with functional compatibility and a more powerful entry-level M4 core and scale up to more highly integrated M4 core options with code compatibility owing to the new product additions to VORAGO's M4 family. Further, Renesas Electronics Corporation introduced a new radiation-hardened 16-channel current driver with an integrated 4-bit decoder in May 2019 to help satellite command and telemetry systems reduce their size, weight, and power (SWaP). The ISL72814SEH combines the decoder, input level shifter, and 16 current driver arrays in a single monolithic IC. For medium earth orbit (MEO), geosynchronous earth orbit (GEO), highly elliptical orbit (HEO), and deep space mission profiles, the device allows satellite designers to considerably boost system capacity while reducing solution footprint by 50%. The rise in investment in product development by the radiation-hardened electronic manufacturers is expected to contribute to the growth of the radiation-hardened electronics market over the forecast period.

With the new features and technologies, vendors can attract new customers and expand their footprints in emerging markets. This factor is likely to drive the MEA radiation-hardened electronics market . The MEA radiation-hardened electronics market is expected to grow at a good CAGR during the forecast period.

MEA Radiation-Hardened Electronics Market Segmentation

The MEA radiation-hardened electronics market is segmented based on component, manufacturing technique, application, and country. Based on component, the market is segmented into power management components, analog and digital mixed signal devices, memory, and controllers & processors. The power management component segment dominated the market in 2021 and is expected to be the fastest-growing segment during the forecast period. Based on manufacturing technique, the market is segmented into radiation hardening by design (RHBD) and radiation hardening by process (RHBP). The radiation hardening by design (RHBD) segment dominated the market in 2021. It is anticipated to be the fastest-growing segment during the forecast period. Based on application, the market is segmented into aerospace & defense, nuclear power plant, space, and others. The space segment dominated the market in 2021, and the others segment is expected to be the fastest-growing segment during the forecast period. Based on country, the MEA radiation-hardened electronics market is segmented into Saudi Arabia, the UAE, South Africa, and the Rest of MEA.

BAE Systems; Data Device Corporation; Honeywell International Inc.; Infineon Technologies AG; Microchip Technology Inc.; Renesas Electronics Corporation; STMicroelectronics; Texas Instruments Incorporated; VORAGO Technologies; and Xilinx, Inc. (AMD) are among the leading companies in the MEA radiation-hardened electronics market.