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The semiconductor packaging materials market is forecasted to grow by USD 9.13 billion during 2023-2028, accelerating at a CAGR of 5.3% during the forecast period. The report on the semiconductor packaging materials market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT, advanced semiconductor material packaging technologies, and surge in global demand for consumer electronics and smart electronic devices.
The semiconductor packaging materials market is segmented as below:
By Material
- Organic substrates
- Lead frames
- Bonding wires
- Ceramic packages
- Others
By End-user
- Consumer electronics
- Automotive
- Medical devices
- Communication and telecom
- Others
By Geography
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This study identifies the increase in adoption of flip-chip, sip, lead-free packaging solutions as one of the prime reasons driving the semiconductor packaging materials market growth during the next few years. Also, growing preference for SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging and surge in adoption of semiconductor ICs will lead to sizable demand in the market.
The report on the semiconductor packaging materials market covers the following areas:
- Semiconductor packaging materials market sizing
- Semiconductor packaging materials market forecast
- Semiconductor packaging materials market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor packaging materials market vendors that include Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD., and Texas Instruments Inc. Also, the semiconductor packaging materials market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
Executive Summary
The following companies are recognized as the key players in the global semiconductor packaging materials market: Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD., and Texas Instruments Inc..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is increase in adoption of flip-chip, sip, lead-free packaging solutions."
According to the report, one of the major drivers for this market is the increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- BASF SE
- ChipMOS TECHNOLOGIES INC.
- DuPont de Nemours Inc.
- Henkel AG and Co. KGaA
- Heraeus Holding GmbH
- Hitachi Ltd.
- Honeywell International Inc.
- Indium Corp.
- Intel Corp.
- KYOCERA Corp.
- LG Innotek Co. Ltd.
- MITSUI and CO. LTD.
- Nan Ya Printed Circuit Board Corp.
- Nippon Steel Corp.
- Powertech Technology Inc.
- Samsung Electronics Co. Ltd.
- TAIWAN SEMICONDUCTOR CO. LTD.
- Texas Instruments Inc.
