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The distributed temperature sensing market is poised to grow by $314.03 mn during 2022-2026, accelerating at a CAGR of 6.85% during the forecast period. The report on the distributed temperature sensing market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis of the current global market scenario, the latest trends and drivers, and the overall market environment. The market is driven by the need for enhanced safety and improvement in productivity yields, growing adoption of fiber optic sensors, and high deployment of fiber optic sensors in applications involving high temperatures.
The distributed temperature sensing market analysis includes the application segment and geographic landscape.
The distributed temperature sensing market is segmented as below:
By Application
- Oil and gas
- Manufacturing
- Industrial infrastructure monitoring
- Environmental monitoring
- Others
By Geographical Landscape
- North America
- APAC
- Europe
- Middle East and Africa
- South America
The report on distributed temperature sensing market covers the following areas:
- Distributed temperature sensing market sizing
- Distributed temperature sensing market forecast
- Distributed temperature sensing market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market through study, synthesis, and summation of data from multiple sources by analyzing key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Five Forces Analysis
5 Market Segmentation by Application
6 Customer Landscape
7 Geographic Landscape
8 Drivers, Challenges, and Trends
9 Vendor Landscape
10 Vendor Analysis
11 Appendix
List of Exhibits
Executive Summary
The publisher recognizes the following companies as the key players in the global distributed temperature sensing market: AP Sensing GmbH, Baker Hughes Co., Bandweaver, Banner Engineering Corp., Furukawa Electric Co. Ltd., GESO GmbH and Co. KG, Halliburton Co., Honeywell International Inc., Johnson Controls International Plc, Luna Innovations Inc., NXP Semiconductors NV, Opsens Inc., Qualcomm Inc., Robert Bosch GmbH, Schlumberger Ltd., STMicroelectronics NV, Sumitomo Electric Industries Ltd., Texas Instruments Inc., Weatherford International Plc, and Yokogawa Electric Corp.Commenting on the report, an analyst from the research team said: `The latest trend gaining momentum in the market is the growing importance of DTS in the oil and gas sector.`
According to the report, one of the major drivers for this market is the need for enhanced safety and improvement in productivity yields.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AP Sensing GmbH
- Baker Hughes Co.
- Bandweaver
- Banner Engineering Corp.
- Furukawa Electric Co. Ltd.
- GESO GmbH and Co. KG
- Halliburton Co.
- Honeywell International Inc.
- Johnson Controls International Plc
- Luna Innovations Inc.
- NXP Semiconductors NV
- Opsens Inc.
- Qualcomm Inc.
- Robert Bosch GmbH
- Schlumberger Ltd.
- STMicroelectronics NV
- Sumitomo Electric Industries Ltd.
- Texas Instruments Inc.
- Weatherford International Plc
- Yokogawa Electric Corp.
