The Europe Outsourced Semiconductor Assembly and Testing Market is expected to witness market growth of 4.4% CAGR during the forecast period (2022-2028).
Automotive technology has transitioned from wire bond to flip chip ball grid array (FCBGA), which improves package support and increases device efficiency. For instance, Intel's Mobileye EyeQ5 plans to develop a 7 nm FinFET process, which can contribute to reliability & packaging support in the devices utilized in the automotive industry. As a result, the market growth is boosted by technology transactions.
Companies that have their packaging plants use OSAT firms to complete tasks that exceed the capacity of those plants or for specialty packaging. These OSAT businesses bear the brunt of market fluctuations because they are the "tail end of the whip" in the semiconductor industry. When the economy is weak, semiconductor makers will first fill up their own packaging facilities before contracting out the work to OSAT firms, which may leave them with less work overall. On the other hand, when the market is strong, the OSAT firms' plants are completely full.
As companies in nations like the UK and Germany try to accommodate their employees who are working from home due to the coronavirus pandemic, laptops, network peripherals, and hardware components are in high demand. The introduction of the "stay at home" culture has also increased the demand for a laptop and other smart gadgets for personal use. This increase in demand is expected to encourage the production of such consumer electronics which requires semiconductors. Thus, the rising need for semiconductors is expected to support the market growth for outsourced semiconductor assembly and testing market in the Europe region.
The Germany market dominated the Europe Outsourced Semiconductor Assembly and Testing Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $2,636.3 million by 2028. The UK market is anticipated to grow at a CAGR of 3.5% during (2022 - 2028). Additionally, The France market is is expected to exhibit a CAGR of 5.2% during (2022 - 2028).
Based on Application, the market is segmented into Consumer Electronics, Industrial, Telecommunications, Medical & Healthcare, Automotive, Aerospace & Defense, and Logistics & Transportation. Based on Packaging Type, the market is segmented into Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die. Based on Process, the market is segmented into Testing, Sorting, Sawing, Assembly. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.
Automotive technology has transitioned from wire bond to flip chip ball grid array (FCBGA), which improves package support and increases device efficiency. For instance, Intel's Mobileye EyeQ5 plans to develop a 7 nm FinFET process, which can contribute to reliability & packaging support in the devices utilized in the automotive industry. As a result, the market growth is boosted by technology transactions.
Companies that have their packaging plants use OSAT firms to complete tasks that exceed the capacity of those plants or for specialty packaging. These OSAT businesses bear the brunt of market fluctuations because they are the "tail end of the whip" in the semiconductor industry. When the economy is weak, semiconductor makers will first fill up their own packaging facilities before contracting out the work to OSAT firms, which may leave them with less work overall. On the other hand, when the market is strong, the OSAT firms' plants are completely full.
As companies in nations like the UK and Germany try to accommodate their employees who are working from home due to the coronavirus pandemic, laptops, network peripherals, and hardware components are in high demand. The introduction of the "stay at home" culture has also increased the demand for a laptop and other smart gadgets for personal use. This increase in demand is expected to encourage the production of such consumer electronics which requires semiconductors. Thus, the rising need for semiconductors is expected to support the market growth for outsourced semiconductor assembly and testing market in the Europe region.
The Germany market dominated the Europe Outsourced Semiconductor Assembly and Testing Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $2,636.3 million by 2028. The UK market is anticipated to grow at a CAGR of 3.5% during (2022 - 2028). Additionally, The France market is is expected to exhibit a CAGR of 5.2% during (2022 - 2028).
Based on Application, the market is segmented into Consumer Electronics, Industrial, Telecommunications, Medical & Healthcare, Automotive, Aerospace & Defense, and Logistics & Transportation. Based on Packaging Type, the market is segmented into Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die. Based on Process, the market is segmented into Testing, Sorting, Sawing, Assembly. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.
Scope of the Study
Market Segments Covered in the Report:
By Application- Consumer Electronics
- Industrial
- Telecommunications
- Medical & Healthcare
- Automotive
- Aerospace & Defense
- Logistics & Transportation
- Ball Grid Array
- Quad & Dual
- Multi-package
- Chip Scale Package
- Stacked Die
- Testing
- Sorting
- Sawing
- Assembly
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Amkor Technology, Inc.
- Advanced Silicon S.A
- Alphacore, Inc.
- Device Engineering, Inc.
- HiDensity Group
- Luminar Technologies, Inc.
- Presto Engineering
- Sencio BV
- Shortlink AB
- SiFive, Inc.
Unique Offerings from the Publisher
- Exhaustive coverage
- The highest number of market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Europe Outsourced Semiconductor Assembly and Testing Market by Application
Chapter 4. Europe Outsourced Semiconductor Assembly and Testing Market by Packaging Type
Chapter 5. Europe Outsourced Semiconductor Assembly and Testing Market by Process
Chapter 6. Europe Outsourced Semiconductor Assembly and Testing Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Amkor Technology, Inc.
- Advanced Silicon S.A
- Alphacore, Inc.
- Device Engineering, Inc.
- HiDensity Group
- Luminar Technologies, Inc.
- Presto Engineering
- Sencio BV
- Shortlink AB
- SiFive, Inc.
Methodology
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