The North America Molded Interconnect Device (MID) Market is expected to witness market growth of 13.4% CAGR during the forecast period (2022-2028).
Molded interconnect devices are transforming traditional electrical and mechanical designs in a variety of applications, especially in the telecommunications as well as automotive industries. These devices perform best when several components in a circuit-board product are substituted. MIDs combines electrical and mechanical functions into a single unit, which contributes significantly to design in terms of assembly and manufacturability. MIDs are used in a wide range of applications. The telecommunications industry has discovered the value of using these devices, specifically for internal antennas in cell phones. This new antenna design replaces the traditional antenna stub or retractor. It is also used in automobiles, such as brake light fixtures.
By embedding features such as a connector, a lamp holder, or a wire harness within a device, these devices can reduce component count as well as cost. MIDs can also be developed to be self-supporting, eliminating the need for additional mechanical parts to support PC boards. As a result, by removing the necessary number of parts, these devices reduce assembly time and save space.
The United States is among the nations having largest automotive industry. The demand for commercial vehicles is heavily influenced by the growth of logistics and delivery services, which is further complemented by vehicle fleet expansion by key e-commerce giants such as Amazon, etc. Engine technology advancements are accelerating in tandem with rising emission standards across the world. These factors are significant supporters of the region's incremental growth in the automotive sector. The nation is home to major automotive OEMs and it is also influenced positively by the country's large supportive infrastructure and electric vehicle policies.
The US market dominated the North America Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $603.8 Million by 2028. The Canada market is experiencing a CAGR of 16% during (2022 - 2028). Additionally, The Mexico market is exhibiting a CAGR of 15% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
Molded interconnect devices are transforming traditional electrical and mechanical designs in a variety of applications, especially in the telecommunications as well as automotive industries. These devices perform best when several components in a circuit-board product are substituted. MIDs combines electrical and mechanical functions into a single unit, which contributes significantly to design in terms of assembly and manufacturability. MIDs are used in a wide range of applications. The telecommunications industry has discovered the value of using these devices, specifically for internal antennas in cell phones. This new antenna design replaces the traditional antenna stub or retractor. It is also used in automobiles, such as brake light fixtures.
By embedding features such as a connector, a lamp holder, or a wire harness within a device, these devices can reduce component count as well as cost. MIDs can also be developed to be self-supporting, eliminating the need for additional mechanical parts to support PC boards. As a result, by removing the necessary number of parts, these devices reduce assembly time and save space.
The United States is among the nations having largest automotive industry. The demand for commercial vehicles is heavily influenced by the growth of logistics and delivery services, which is further complemented by vehicle fleet expansion by key e-commerce giants such as Amazon, etc. Engine technology advancements are accelerating in tandem with rising emission standards across the world. These factors are significant supporters of the region's incremental growth in the automotive sector. The nation is home to major automotive OEMs and it is also influenced positively by the country's large supportive infrastructure and electric vehicle policies.
The US market dominated the North America Molded Interconnect Device (MID) Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $603.8 Million by 2028. The Canada market is experiencing a CAGR of 16% during (2022 - 2028). Additionally, The Mexico market is exhibiting a CAGR of 15% during (2022 - 2028).
Based on Product Type, the market is segmented into Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems and Others. Based on Process, the market is segmented into Laser Direct Structuring (LDS), Two-Shot Molding and Film Techniques. Based on Vertical, the market is segmented into Consumer Electronics, Telecommunications, Automotive, Medical, Industrial and Military & Aerospace. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Molex, LLC (Koch Industries, Inc.), TE Connectivity Ltd., Taoglas, KYOCERA AVX Components Corporation (Kyocera Corporation), Amphenol Corporation, LPKF Laser & Electronics AG, HARTING Technology Group, MID Solutions GmbH, and 2E mechatronic GmbH & Co. KG
Scope of the Study
Market Segments Covered in the Report:
By Product Type- Antennae & Connectivity Modules
- Sensors
- Connectors & Switches
- Lighting Systems
- Others
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Film Techniques
- Consumer Electronics
- Telecommunications
- Automotive
- Medical
- Industrial
- Military & Aerospace
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
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Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. North America Molded Interconnect Device (MID) Market by Product Type
Chapter 4. North America Molded Interconnect Device (MID) Market by Process
Chapter 5. North America Molded Interconnect Device (MID) Market by Vertical
Chapter 6. North America Molded Interconnect Device (MID) Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Molex, LLC (Koch Industries, Inc.)
- TE Connectivity Ltd.
- Taoglas
- KYOCERA AVX Components Corporation (Kyocera Corporation)
- Amphenol Corporation
- LPKF Laser & Electronics AG
- HARTING Technology Group
- MID Solutions GmbH
- 2E mechatronic GmbH & Co. KG
Methodology
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