LAMEA Outsourced Semiconductor Assembly and Testing Market Size, Share & Industry Trends Analysis Report By Application, By Packaging Type (Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die), By Process, By Country and Growth Forecast, 2022 - 2028

The Latin America, Middle East and Africa Outsourced Semiconductor Assembly and Testing Market is expected to witness market growth of 8.5% CAGR during the forecast period (2022-2028).

Following the sealing, a number of procedures are carried out, including post-mold cure, trim and form, plating, and printing. The finished product is tested following packaging completion, typically through the incoming, testing, and packing processes, and is then stored in preparation for shipping. Scribing, assembly, bonding, plastic sealing, bonding, debonding, plating, printing, ribbing and molding, inspection, testing, and packaging are common packaging processes.

According to the form, size, and structure of the package, semiconductor devices can be divided into surface mount type, pin insertion type, and advanced package. The technical indexes are more sophisticated than those of the previous generation, starting with DIP, SOP, QFP, PGA, and BGA, followed by CSP, and then SIP.

The UAE has a strong healthcare infrastructure and one of the most economically developed & diverse markets in the region. The UAE government has prioritized building a top-notch healthcare infrastructure, and as a result, the industry has grown and developed significantly in recent years. The UAE government has taken swift action to implement preventive health measures. The UAE's healthcare industry has expanded to meet the nation's population's changing needs and the country's goal of developing into a major regional center for medical tourism.

The Brazil market dominated the LAMEA Outsourced Semiconductor Assembly and Testing Market by Country in 2021, and is expected to continue to be a dominant market till 2028; thereby, achieving a market value of $833 million by 2028. The Argentina market is experiencing a CAGR of 9.1% during (2022 - 2028). Additionally, The UAE market is expected to display a CAGR of 8.2% during (2022 - 2028).

Based on Application, the market is segmented into Consumer Electronics, Industrial, Telecommunications, Medical & Healthcare, Automotive, Aerospace & Defense, and Logistics & Transportation. Based on Packaging Type, the market is segmented into Ball Grid Array, Quad & Dual, Multi-package, Chip Scale Package, and Stacked Die. Based on Process, the market is segmented into Testing, Sorting, Sawing, Assembly. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Amkor Technology, Inc., Advanced Silicon S.A, Alphacore, Inc., Device Engineering, Inc., HiDensity Group, Luminar Technologies, Inc., Presto Engineering, Sencio BV, Shortlink AB, and SiFive, Inc.

Scope of the Study

Market Segments Covered in the Report:

By Application

• Consumer Electronics
• Industrial
• Telecommunications
• Medical & Healthcare
• Automotive
• Aerospace & Defense
• Logistics & Transportation

By Packaging Type

• Ball Grid Array
• Quad & Dual
• Multi-package
• Chip Scale Package
• Stacked Die

By Process

• Testing
• Sorting
• Sawing
• Assembly

By Country

• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

• Amkor Technology, Inc.
• Advanced Silicon S.A
• Alphacore, Inc.
• Device Engineering, Inc.
• HiDensity Group
• Luminar Technologies, Inc.
• Presto Engineering
• Sencio BV
• Shortlink AB
• SiFive, Inc.

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