M2M/IoT Development - Sub-1GHz Communications - Technologies, Markets, Applications 2023

1.1 General
1.2 Specifics
1.3 Scope
1.4 Research Methodology
1.5 Target Audience

2.1 M2M Communications Development
2.1.1 Special Needs
2.1.1.1 Spectrum
2.1.1.2 Summary
2.1.2 Standardization - Industry Activities
2.1.2.1 IEEE
2.1.2.2 ETSI
2.1.2.3 ITU
2.1.2.4 oneM2M Alliance
2.1.2.4.1 Service Layer Architecture
2.1.2.4.2 Benefits
2.1.2.5 M2M Alliance
2.1.2.6 Open Mobile Alliance (OMA)
2.1.2.7 Summary
2.1.3 Market
2.1.3.1 Statistics
2.1.3.2 Estimate
2.1.4 Industry: Innovations

• Arqiva/Sensus
• Iota Networks
• Kore Telematics
• SigFox/Telit
• Telensa/Plextek

2.2 IoT
2.2.1 M2M and IoT
2.2.1.1 M2M
2.2.1.2 IoT
2.2.1.3 IoT - M2M
2.2.2 Open Interconnect Consortium
2.2.3 Industrial Internet Consortium
2.2.4 IoT Platforms
2.2.5 IoT and ITU
2.2.6 IoT International Forum
2.2.7 IEEE 2413 and IoT
2.2.7.1 2413.1
2.2.7.2 P2413.2
2.2.8 ISO/IEC
2.2.8.1 Layered Structure
2.2.9 IoT - Market
2.2.10 Applications

3.1 ITU Designation
3.2 Sub-1GHz Transmission Benefits and Limitations
3.3 Generations
3.3.1 Details

4.1 IEEE-802.15.4g-Smart Utility Network
4.1.1 General
4.1.2 Need
4.1.3 Value
4.1.4 Overview - PHY
4.1.5 Regions
4.1.5.1 Frequencies Allocations
4.1.6 Details
4.1.6.1 Requirements: Major Characteristics
4.1.6.2 Considerations
4.1.6.3 Network Specifics
4.1.6.4 PHY/MAC Modifications
4.1.7 Market
4.1.8 Summary
4.1.9 Wi-SUN
4.1.10 Manufacturers - Examples

• Analog Devices
• Elster (a part of Honeywell)
• Microchip
• TI

4.2 IEEE 802.22-19
4.2.1 General
4.2.2 Status - IEEE 802.22-19
4.2.3 Developments
4.2.4 IEEE 802.22-2019 Overview
4.2.4.1 Major Characteristics
4.2.5 IEEE 802.22 Details
4.2.5.1 Physical Layer - Major Characteristics
4.2.5.2 MAC Layer
4.2.6 Cognitive Functions
4.2.7 IEEE 802.22 - Marketing Considerations for SG
4.2.8 Major Applications
4.2.9 Usage Models
4.2.10 Benefits
4.2.11 Summary
4.2.12 Group
4.2.12.1 IEEE 802.22.1
4.2.12.2 IEEE 802.22.2
4.2.12.3 IEEE 802.22a-2014
4.2.12.4 IEEE 802.22b-2015
4.2.12.5 IEEE P802.22.3 - Standard for Spectrum Characterization and Occupancy Sensing
4.2.12.6 8802-22:2015/Amd 1-2017
4.3 IEEE 802.11ah (Wi-Fi HaLow)
4.3.1 General
4.3.2 Goal and Schedule
4.3.3 Attributes
4.3.4 Use Cases
4.3.5 PHY
4.3.5.1 Bandwidth
4.3.5.2 Channelization
4.3.5.3 Transmission Modes and MIMO
4.3.6 MAC Layer
4.3.7 Summary
4.3.8 Vendors

• Methods2Business
• Morse Micro
• Newracom-Aviacomm
• Palma Ceia SemiDesign
• Silex

4.4 IEEE 802.11af - White-Fi
4.4.1 General: Expectations - White-Fi
4.4.2 Differences
4.4.3 Benefits
4.4.4 Specifics
4.4.4.1 Interference
4.4.4.2 Main Principles
4.4.5 PHY
4.4.6 Architecture
4.4.7 Market
4.4.8 Vendors

• Aviacomm
• Carlson Wireless

4.5 Ultra Narrow Band (UNB)
4.5.1 Origin
4.5.2 Support
4.5.3 Major Features
4.5.4 SigFox
4.5.4.1 Company
4.5.4.2 Technology - Details
4.5.4.3 Uplink
4.5.4.4 Downlink
4.5.4.5 SmartLNB
4.5.4.6 Coverage
4.5.4.7 Use Cases
4.5.4.8 Industry

• Adeunis RF
• Innocomm
• Microchip
• On Semiconductor
• Telit
• TI

4.6 Weightless Communications
4.6.1 SIG
4.6.2 Weightless-N
4.6.2.1 General
4.6.2.2 Open Standard
4.6.2.3 Nwave
4.6.2.4 Summary
4.6.3 Weightless-P
4.6.3.1 General
4.6.3.2 Details
4.6.3.3 Vendors
4.6.4 Weightless Technologies and Competition

5.1 ZigBee - IEEE 802.15.4
5.1.1 General
5.1.2 Sub-1GHz ZigBee: Specifics
5.1.3 ZigBee Acceptance
5.1.4 Major Features: ZigBee/802.15.4
5.1.5 Device Types
5.1.6 Protocol Stack
5.1.6.1 Physical and MAC Layers - IEEE802.15.4
5.1.6.2 Upper Layers
5.1.7 Security
5.1.8 Power Consumption
5.1.9 ZigBee Technology Benefits and Limitations
5.1.10 Standardization Process
5.1.10.1 Ratifications
5.1.10.2 Alliance
5.1.10.2.1 ZigBee Pro 2017
5.1.11 Applications Specifics - Application Profiles
5.1.11.1 “Green” ZigBee
5.1.11.2 ZigBee Telecom Services
5.1.11.3 Building Automation
5.1.11.4 Smart Energy Profile
5.1.11.4.1 Features
5.1.11.4.2 Smart Energy Profile V.2.0
5.1.11.4.3 ZigBee IP
5.1.11.5 ZigBee Network Devices - IP Gateway
5.1.12 Market
5.1.12.1 Expectations-Technology Stack
5.1.12.2 Segments
5.1.12.3 Forecast
5.1.13 Sub-1GHz ZigBee: Certification
5.1.14 Industry

• Adaptive Networks Solutions (RF Sub-1GHz)
• Microchip Technologies (Modules, Sub-1GHz)
• NXP
• Renesas (Platforms, AMR, Sub-1GHz)
• Silicon Laboratories (Chipsets, Modules, Sub-1GHz)
• TI (Chipsets, Sub-1GHz)

5.2 EnOcean: General
5.2.1 The Company
5.2.2 EnOcean Alliance
5.2.3 Standard
5.2.3.1 Features
5.2.3.2 Drivers
5.2.4 Technology Details
5.2.4.1 Framework
5.2.4.2 Generations
5.2.5 Profiles
5.2.6 Benefits
5.2.7 Market Estimate
5.2.8 Industry

• BSC Magnum
• Beckhoff
• Echoflex
• Illumra
• Leviton
• Thermokon

5.3 Z-Wave
5.3.1 General
5.3.2 Z-Wave Alliance
5.3.3 Benefits
5.3.4 Details
5.3.4.1 General
5.3.4.2 Characteristics
5.3.4.3 ITU G.9959
5.3.5 Advanced Energy Control Framework
5.3.6 Z-Wave and Smart Metering
5.3.7 Selected Vendors

• Aeon Labs-Aeotec
• NorthQ
• Vera Control

5.3.8 Market Estimate
5.3.8.1 Model
5.3.8.2 Results

Figure 1: Regions: Sub-1GHz Band
Figure 2: IoT Environment
Figure 3: Key M2M Elements
Figure 4: ETSI Activity
Figure 5: Use Cases
Figure 6: ETSI-High-level M2M Architecture
Figure 7: oneM2M Layered Model
Figure 8: Service Layer Positioning
Figure 9: Summary - M2M Standardization
Figure 10: M2M Major Applications
Figure 11: Estimate: M2M Traffic Growth (PB/Month)
Figure 12: Estimate-M2M Service Market - Global ($B)
Figure 13: Estimate: Cellular Operators Revenue - M2M Services - Global ($B)
Figure 15: IoT - Layered Structure
Figure 16: Estimate: IoT Technologies and Applications Market - Global ($T)
Figure 17: Estimate - Total Number of Smart Devices in Smart Homes - Global (Bil. Units)
Figure 18: M2M/IoT Spectrum of Applications
Figure 19: Bands - ITU Designation
Figure 20: Range
Figure 21: Power Consumption
Figure 22: Rates
Figure 23: Global Sub-1GHz Frequencies
Figure 24: Sub-1GHz Transmission Characteristics
Figure 25: ZigBee-2.4 GHz vs. 900 MHz
Figure 26: Properties Comparison
Figure 27: SUN Connectivity
Figure 28: 802.15.4g Radio Operating Bands
Figure 29: Estimate: Global Market - Smart Grid SUN ($B)
Figure 30: Estimate: 802.22 Technology- U.S. Market Size ($B)
Figure 31: IEEE 802.22 Usage Scenarios
Figure 32: Major Characteristics: IEEE 802.22
Figure 33: Standardized Frequency Spectrum (sub-1 GHz)
Figure 34: 802.11ah - Channelization Plan in U.S.
Figure 35: 802.11ah Features Summary
Figure 36: 802.11af Network Setup
Figure 37: Comparison
Figure 38: Uplink Frame Format
Figure 39: Downlink Frame Format
Figure 40: ZigBee Characteristics
Figure 41: ZigBee/802.15.4 Protocol Stack
Figure 42: ZigBee/802.15.4 Characteristics
Figure 43: Profiles
Figure 44: ZigBee IP Gateway Protocol Stack
Figure 45: Technology Stack
Figure 46: Estimate - U.S. Market Size - ZigBee Chips Shipped ($B)
Figure 47: Estimate - U.S. Market Size - ZigBee Chips - Sub-1GHz Shipped ($B)
Figure 48: ZigBee Market Segmentation (2022)
Figure 49: ZigBee Market Segmentation (2026)
Figure 50: Functionalities
Figure 51: Major Features
Figure 52: Energy Consumption Requirements
Figure 53: Estimate: EnOcean Equipment Sales - Global ($B)
Figure 54: Estimate: EnOcean Industry Modules Sales - Global (Mil. Units)
Figure 55: Estimate:  U.S. Small SH Z-Wave IC Market Size ($B)
Figure 56: Estimate:  U.S. Large SH Z-Wave IC Market ($B)