LAMEA Thin Wafer Market Size, Share & Industry Trends Analysis Report by Wafer Size (300 mm, 200 mm and 125 mm), Technology (Dicing, Polishing and Grinding), Application, Country and Growth Forecast, 2022-2028

The Latin America, Middle East and Africa Thin Wafer Market should witness market growth of 16.8% CAGR during the forecast period (2022-2028).

The so-called stealth dicing procedure uses a laser to cut silicon wafers into small pieces. By scanning the beam along the appropriate cutting lines, fault patches are first created into the wafer, and then an underlying carrier membrane is extended to cause a fracture. The first step uses a pulsed Nd: YAG laser whose wavelength (1064 nm) is well suited to silicon's electronic band gap (1.11 eV or 1117 nm), allowing for the adjustment of maximum absorption by optical focusing. Several laser scans along the proposed dicing lanes, where the beam is focused at various depths of the wafer, inscribe defect zones with a width of around 10 m.

Compare the optical micrograph of the cleavage plane of a split chip that was 150 m thick and subjected to four laser scans in the image. The uppermost flaws are the ones that can be addressed the best, and it is discovered that a single laser pulse can result in a crystal region with flaws that resemble a candle flame. The irradiation region in the laser beam focus, where the temperature of only a few m3 small volumes abruptly jumps to around 1000 K within nanoseconds and falls to ambient temperature again, rapidly melts, and solidifies, giving rise to this structure.

Over the future years, the regional thin wafer market is anticipated to grow due to the enormous demand for various sorts of electronic devices. Nearly all electronic items, including information devices like PCs, cellphones, wearable computers, and tablets, home appliances like air conditioners and TVs, and vehicles like cars and trains, rely on semiconductor technology. Therefore, the industry's expansion would be fueled by a wide range of applications for thin wafers.

The Brazil market dominated the LAMEA Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $407.2 million by 2028. The Argentina market is exhibiting a CAGR of 17.4% during (2022-2028). Additionally, The UAE market would experience a CAGR of 16.4% during (2022-2028).

Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.

Scope of the Study

By Wafer Size

• 300 mm
• 200 mm
• 125 mm

By Technology

• Dicing
• Polishing
• Grinding

By Application

• Memory
• LED
• MEMS
• CIS
• RF Devices
• Interposer
• Logic
• Others

By Country

• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Key Market Players

List of Companies Profiled in the Report:

• Shin-Etsu Chemical Co., Ltd.
• SUMCO Corporation
• GlobalWafers Co., Ltd.
• Siltronic AG
• SK Siltron Co., Ltd.
• SUSS MicroTec SE
• Soitec
• DISCO Corporation
• 3M Company
• Applied Materials, Inc.

Unique Offerings

• Exhaustive coverage
• The highest number of market tables and figures
• Subscription-based model available
• Guaranteed best price
• Assured post sales research support with 10% customization free