The Europe Silicon on Insulator (SOI) Market should witness market growth of 16.0% CAGR during the forecast period (2022-2028).
In FDSOI devices the film is very thin so it covers the depletion region covers the whole channel region. Fewer depletion charges are supported in the FDSOI the front gate (GOX) than the bulk so an increase in inversion charges occurs which results in higher switching speeds. A low-power technology that allows an operating voltage as low as 0.4 V is a Fully Depleted (FD) SOI.
An FD SOI provides significant battery life or battery-less solutions, joined with the lowest per transistor cost for all CMOS technologies, which is very helpful in the Internet of Things (IoT) era with connected wearable electronics, medical devices, home assistants narrow band, short range, and edge computing.
Wearable and IoT devices need shallow leakage current and energy per function. The variability management challenge, which occurs while operating at 0.4 V, is resolved by the back biasing. Many smartwatch manufacturers have adopted FD SOI GPS to increase the watch operations between charging. In addition, FD SOI creates many new opportunities for a wide range of products when joined with a low-power-nonvolatile embedded magnetic random-access memory (eMRAM).
The 5G UK Test networks are being funded by various 5G programs, which has built and integrated three university testbeds (King’s College London, University of Surrey, and the University of Bristol) to establish the UK’s first end-to-end 5G network in early 2018. In the initial stage of these 5G programs, they successfully developed small-scale testbeds and were used to trial numerous technologies.
The Germany market dominated the Europe Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $231.4 million by 2028. The UK market is anticipated to grow at a CAGR of 15% during (2022-2028). Additionally, The France market would exhibit a CAGR of 16.8% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
In FDSOI devices the film is very thin so it covers the depletion region covers the whole channel region. Fewer depletion charges are supported in the FDSOI the front gate (GOX) than the bulk so an increase in inversion charges occurs which results in higher switching speeds. A low-power technology that allows an operating voltage as low as 0.4 V is a Fully Depleted (FD) SOI.
An FD SOI provides significant battery life or battery-less solutions, joined with the lowest per transistor cost for all CMOS technologies, which is very helpful in the Internet of Things (IoT) era with connected wearable electronics, medical devices, home assistants narrow band, short range, and edge computing.
Wearable and IoT devices need shallow leakage current and energy per function. The variability management challenge, which occurs while operating at 0.4 V, is resolved by the back biasing. Many smartwatch manufacturers have adopted FD SOI GPS to increase the watch operations between charging. In addition, FD SOI creates many new opportunities for a wide range of products when joined with a low-power-nonvolatile embedded magnetic random-access memory (eMRAM).
The 5G UK Test networks are being funded by various 5G programs, which has built and integrated three university testbeds (King’s College London, University of Surrey, and the University of Bristol) to establish the UK’s first end-to-end 5G network in early 2018. In the initial stage of these 5G programs, they successfully developed small-scale testbeds and were used to trial numerous technologies.
The Germany market dominated the Europe Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $231.4 million by 2028. The UK market is anticipated to grow at a CAGR of 15% during (2022-2028). Additionally, The France market would exhibit a CAGR of 16.8% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
Scope of the Study
By Wafer Size
- 300 mm
- 200 mm & less than 200 mm
By Wafer Type
- RF SOI
- FD SOI
- POWER SOI
- Emerging SOI
- PD SOI
By Application
- Consumer Electronics
- Automotive
- Datacom & Telecom
- Industrial
- Military, Defense & Aerospace
By Technology
- Smart Cut
- Bonding SOI
- Layer Transfer SOI
By Product
- RF FEM Products
- Power Products
- MEMS Devices
- Optical Communication
- Image Sensing
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Key Market Players
List of Companies Profiled in the Report:
- Soitec
- Shin-Etsu Chemical Co., Ltd.
- GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
- SUMCO Corporation
- STMicroelectronics N.V.
- NXP Semiconductors N.V.
- Murata Manufacturing Co., Ltd.
- Skyworks Solutions, Inc.
- Qorvo, Inc.
- Sony Corporation
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- Exhaustive coverage
- The highest number of Market tables and figures
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Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Silicon on Insulator (SOI) Market, by Wafer Size
1.4.2 Europe Silicon on Insulator (SOI) Market, by Wafer Type
1.4.3 Europe Silicon on Insulator (SOI) Market, by Application
1.4.4 Europe Silicon on Insulator (SOI) Market, by Technology
1.4.5 Europe Silicon on Insulator (SOI) Market, by Product
1.4.6 Europe Silicon on Insulator (SOI) Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market composition and Scenarios
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in Silicon on Insulator (SOI) Market
Chapter 4. Europe Silicon on Insulator (SOI) Market by Wafer Size
4.1 Europe 300 mm Market by Country
4.2 Europe 200 mm & less than 200 mm Market by Country
Chapter 5. Europe Silicon on Insulator (SOI) Market by Wafer Type
5.1 Europe RF SOI Market by Country
5.2 Europe FD SOI Market by Country
5.3 Europe POWER SOI Market by Country
5.4 Europe Emerging SOI Market by Country
5.5 Europe PD SOI Market by Country
Chapter 6. Europe Silicon on Insulator (SOI) Market by Application
6.1 Europe Consumer Electronics Market by Country
6.2 Europe Automotive Market by Country
6.3 Europe Datacom & Telecom Market by Country
6.4 Europe Industrial Market by Country
6.5 Europe Military, Defense & Aerospace Market by Country
Chapter 7. Europe Silicon on Insulator (SOI) Market by Technology
7.1 Europe Smart Cut Market by Country
7.2 Europe Bonding SOI Market by Country
7.3 Europe Layer Transfer SOI Market by Country
Chapter 8. Europe Silicon on Insulator (SOI) Market by Product
8.1 Europe RF FEM Products Market by Country
8.2 Europe Power Products Market by Country
8.3 Europe MEMS Devices Market by Country
8.4 Europe Optical Communication Market by Country
8.5 Europe Image Sensing Market by Country
8.6 Europe Others Market by Country
Chapter 9. Europe Silicon on Insulator (SOI) Market by Country
9.1 Germany Silicon on Insulator (SOI) Market
9.1.1 Germany Silicon on Insulator (SOI) Market by Wafer Size
9.1.2 Germany Silicon on Insulator (SOI) Market by Wafer Type
9.1.3 Germany Silicon on Insulator (SOI) Market by Application
9.1.4 Germany Silicon on Insulator (SOI) Market by Technology
9.1.5 Germany Silicon on Insulator (SOI) Market by Product
9.2 UK Silicon on Insulator (SOI) Market
9.2.1 UK Silicon on Insulator (SOI) Market by Wafer Size
9.2.2 UK Silicon on Insulator (SOI) Market by Wafer Type
9.2.3 UK Silicon on Insulator (SOI) Market by Application
9.2.4 UK Silicon on Insulator (SOI) Market by Technology
9.2.5 UK Silicon on Insulator (SOI) Market by Product
9.3 France Silicon on Insulator (SOI) Market
9.3.1 France Silicon on Insulator (SOI) Market by Wafer Size
9.3.2 France Silicon on Insulator (SOI) Market by Wafer Type
9.3.3 France Silicon on Insulator (SOI) Market by Application
9.3.4 France Silicon on Insulator (SOI) Market by Technology
9.3.5 France Silicon on Insulator (SOI) Market by Product
9.4 Russia Silicon on Insulator (SOI) Market
9.4.1 Russia Silicon on Insulator (SOI) Market by Wafer Size
9.4.2 Russia Silicon on Insulator (SOI) Market by Wafer Type
9.4.3 Russia Silicon on Insulator (SOI) Market by Application
9.4.4 Russia Silicon on Insulator (SOI) Market by Technology
9.4.5 Russia Silicon on Insulator (SOI) Market by Product
9.5 Spain Silicon on Insulator (SOI) Market
9.5.1 Spain Silicon on Insulator (SOI) Market by Wafer Size
9.5.2 Spain Silicon on Insulator (SOI) Market by Wafer Type
9.5.3 Spain Silicon on Insulator (SOI) Market by Application
9.5.4 Spain Silicon on Insulator (SOI) Market by Technology
9.5.5 Spain Silicon on Insulator (SOI) Market by Product
9.6 Italy Silicon on Insulator (SOI) Market
9.6.1 Italy Silicon on Insulator (SOI) Market by Wafer Size
9.6.2 Italy Silicon on Insulator (SOI) Market by Wafer Type
9.6.3 Italy Silicon on Insulator (SOI) Market by Application
9.6.4 Italy Silicon on Insulator (SOI) Market by Technology
9.6.5 Italy Silicon on Insulator (SOI) Market by Product
9.7 Rest of Europe Silicon on Insulator (SOI) Market
9.7.1 Rest of Europe Silicon on Insulator (SOI) Market by Wafer Size
9.7.2 Rest of Europe Silicon on Insulator (SOI) Market by Wafer Type
9.7.3 Rest of Europe Silicon on Insulator (SOI) Market by Application
9.7.4 Rest of Europe Silicon on Insulator (SOI) Market by Technology
9.7.5 Rest of Europe Silicon on Insulator (SOI) Market by Product
Chapter 10. Company Profiles
10.1 NXP Semiconductors N.V.
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Product Launches and Product Expansions:
10.1.6 SWOT Analysis
10.2 Sony Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expenses
10.2.5 SWOT Analysis
10.3 STMicroelectronics N.V.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Segmental and Regional Analysis
10.3.4 Research & Development Expense
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.5.3 Acquisition and Mergers:
10.3.6 SWOT Analysis
10.4 Shin-Etsu Chemical Co., Ltd.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Regional & Segmental Analysis
10.4.4 Research & Development Expenses
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.5 Sumco Corporation
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Regional Analysis
10.5.4 Research & Development Expenses
10.6 Soitec
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Recent strategies and developments:
10.6.4.1 Acquisition and Mergers:
10.6.4.2 Geographical Expansions:
10.7 Murata Manufacturing Co., Ltd.
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Segmental and Regional Analysis
10.7.4 Research & Development Expense
10.8 Qorvo, Inc.
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Partnerships, Collaborations, and Agreements:
10.9 Skyworks Solutions, Inc.
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Regional Analysis
10.9.4 Research & Development Expenses
10.10. GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
10.10.1 Company Overview
10.10.2 Recent strategies and developments:
10.10.2.1 Partnerships, Collaborations, and Agreements:
Companies Mentioned
- Soitec
- Shin-Etsu Chemical Co., Ltd.
- GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
- SUMCO Corporation
- STMicroelectronics N.V.
- NXP Semiconductors N.V.
- Murata Manufacturing Co., Ltd.
- Skyworks Solutions, Inc.
- Qorvo, Inc.
- Sony Corporation
Methodology
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