The Asia Pacific Silicon on Insulator (SOI) Market should witness market growth of 17.1% CAGR during the forecast period (2022-2028).
Silicon on Insulator (SOI) is a semiconductor wafer technology that creates lower power (dynamics) and higher performing devices than the devices made from traditional bulk silicon techniques. SOI operates by placing a thin, insulating layer, for instance, a silicon oxide, between a thin silicon layer and a silicon substrate. This process helps decrease the junction capacitance, which allows higher speed and lower power consumption.
As a result, SOI chips use 20 percent less power and are up to 15 percent faster when compared to chips based on present-day bulk complementary metal oxide semiconductors (CMOS). In the mixed signal applications and radio frequency (RF) field, SOI provides the benefit of high-quality passives and low noise.
The incorporation of silicide layers like WSi2 enables the SOI to be customized, forming a Ground Plane Silicon on Insulator (GPSOI), further enhancing cross-talk reduction. Keeping a silicide layer between the buried oxide and the top silicon device layer changes the SOI into Silicon on Silicide on Insulator (SSOI). This technique is concentrated primarily at the bipolar transistor with the inclusion of the silicide layer minimizing the resistance of the collector series.
China stands among the top sellers and producers of consumer electronics globally because of the country’s enhanced brand-building and innovation capacity. China is an essential manufacturer of consumer electronic products, attracting the world’s major electronic producers to establish research, development, and manufacturing base. The Ministry will increase the cultivation of pillar and pioneer industries in the sector and promote the development of the virtual reality industry and new-generation audio-visual technology.
The China market dominated the Asia Pacific Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $386.2 million by 2028. The Japan market is estimated to grow a CAGR of 16.4% during (2022-2028). Additionally, The India market would experience a CAGR of 18% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
Silicon on Insulator (SOI) is a semiconductor wafer technology that creates lower power (dynamics) and higher performing devices than the devices made from traditional bulk silicon techniques. SOI operates by placing a thin, insulating layer, for instance, a silicon oxide, between a thin silicon layer and a silicon substrate. This process helps decrease the junction capacitance, which allows higher speed and lower power consumption.
As a result, SOI chips use 20 percent less power and are up to 15 percent faster when compared to chips based on present-day bulk complementary metal oxide semiconductors (CMOS). In the mixed signal applications and radio frequency (RF) field, SOI provides the benefit of high-quality passives and low noise.
The incorporation of silicide layers like WSi2 enables the SOI to be customized, forming a Ground Plane Silicon on Insulator (GPSOI), further enhancing cross-talk reduction. Keeping a silicide layer between the buried oxide and the top silicon device layer changes the SOI into Silicon on Silicide on Insulator (SSOI). This technique is concentrated primarily at the bipolar transistor with the inclusion of the silicide layer minimizing the resistance of the collector series.
China stands among the top sellers and producers of consumer electronics globally because of the country’s enhanced brand-building and innovation capacity. China is an essential manufacturer of consumer electronic products, attracting the world’s major electronic producers to establish research, development, and manufacturing base. The Ministry will increase the cultivation of pillar and pioneer industries in the sector and promote the development of the virtual reality industry and new-generation audio-visual technology.
The China market dominated the Asia Pacific Silicon on Insulator (SOI) Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $386.2 million by 2028. The Japan market is estimated to grow a CAGR of 16.4% during (2022-2028). Additionally, The India market would experience a CAGR of 18% during (2022-2028).
Based on Wafer Size, the market is segmented into 300 mm and 200 mm & less than 200 mm. Based on Wafer Type, the market is segmented into RF SOI, FD SOI, POWER SOI, Emerging SOI and PD SOI. Based on Application, the market is segmented into Consumer Electronics, Automotive, Datacom & Telecom, Industrial and Military, Defense & Aerospace. Based on Technology, the market is segmented into Smart Cut, Bonding SOI and Layer Transfer SOI. Based on Product, the market is segmented into RF FEM Products, Power Products, MEMS Devices, Optical Communication, Image Sensing and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Soitec, Shin-Etsu Chemical Co., Ltd., GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.), SUMCO Corporation, STMicroelectronics N.V., NXP Semiconductors N.V., Murata Manufacturing Co., Ltd., Skyworks Solutions, Inc., Qorvo, Inc., and Sony Corporation.
Scope of the Study
By Wafer Size
- 300 mm
- 200 mm & less than 200 mm
By Wafer Type
- RF SOI
- FD SOI
- POWER SOI
- Emerging SOI
- PD SOI
By Application
- Consumer Electronics
- Automotive
- Datacom & Telecom
- Industrial
- Military, Defense & Aerospace
By Technology
- Smart Cut
- Bonding SOI
- Layer Transfer SOI
By Product
- RF FEM Products
- Power Products
- MEMS Devices
- Optical Communication
- Image Sensing
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Soitec
- Shin-Etsu Chemical Co., Ltd.
- GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
- SUMCO Corporation
- STMicroelectronics N.V.
- NXP Semiconductors N.V.
- Murata Manufacturing Co., Ltd.
- Skyworks Solutions, Inc.
- Qorvo, Inc.
- Sony Corporation
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Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Silicon on Insulator (SOI) Market, by Wafer Size
1.4.2 Asia Pacific Silicon on Insulator (SOI) Market, by Wafer Type
1.4.3 Asia Pacific Silicon on Insulator (SOI) Market, by Application
1.4.4 Asia Pacific Silicon on Insulator (SOI) Market, by Technology
1.4.5 Asia Pacific Silicon on Insulator (SOI) Market, by Product
1.4.6 Asia Pacific Silicon on Insulator (SOI) Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market composition and Scenarios
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in Silicon on Insulator (SOI) Market
Chapter 4. Asia Pacific Silicon on Insulator (SOI) Market by Wafer Size
4.1 Asia Pacific 300 mm Market by Country
4.2 Asia Pacific 200 mm & less than 200 mm Market by Country
Chapter 5. Asia Pacific Silicon on Insulator (SOI) Market by Wafer Type
5.1 Asia Pacific RF SOI Market by Country
5.2 Asia Pacific FD SOI Market by Country
5.3 Asia Pacific POWER SOI Market by Country
5.4 Asia Pacific Emerging SOI Market by Country
5.5 Asia Pacific PD SOI Market by Country
Chapter 6. Asia Pacific Silicon on Insulator (SOI) Market by Application
6.1 Asia Pacific Consumer Electronics Market by Country
6.2 Asia Pacific Automotive Market by Country
6.3 Asia Pacific Datacom & Telecom Market by Country
6.4 Asia Pacific Industrial Market by Country
6.5 Asia Pacific Military, Defense & Aerospace Market by Country
Chapter 7. Asia Pacific Silicon on Insulator (SOI) Market by Technology
7.1 Asia Pacific Smart Cut Market by Country
7.2 Asia Pacific Bonding SOI Market by Country
7.3 Asia Pacific Layer Transfer SOI Market by Country
Chapter 8. Asia Pacific Silicon on Insulator (SOI) Market by Product
8.1 Asia Pacific RF FEM Products Market by Country
8.2 Asia Pacific Power Products Market by Country
8.3 Asia Pacific MEMS Devices Market by Country
8.4 Asia Pacific Optical Communication Market by Country
8.5 Asia Pacific Image Sensing Market by Country
8.6 Asia Pacific Others Market by Country
Chapter 9. Asia Pacific Silicon on Insulator (SOI) Market by Country
9.1 China Silicon on Insulator (SOI) Market
9.1.1 China Silicon on Insulator (SOI) Market by Wafer Size
9.1.2 China Silicon on Insulator (SOI) Market by Wafer Type
9.1.3 China Silicon on Insulator (SOI) Market by Application
9.1.4 China Silicon on Insulator (SOI) Market by Technology
9.1.5 China Silicon on Insulator (SOI) Market by Product
9.2 Japan Silicon on Insulator (SOI) Market
9.2.1 Japan Silicon on Insulator (SOI) Market by Wafer Size
9.2.2 Japan Silicon on Insulator (SOI) Market by Wafer Type
9.2.3 Japan Silicon on Insulator (SOI) Market by Application
9.2.4 Japan Silicon on Insulator (SOI) Market by Technology
9.2.5 Japan Silicon on Insulator (SOI) Market by Product
9.3 India Silicon on Insulator (SOI) Market
9.3.1 India Silicon on Insulator (SOI) Market by Wafer Size
9.3.2 India Silicon on Insulator (SOI) Market by Wafer Type
9.3.3 India Silicon on Insulator (SOI) Market by Application
9.3.4 India Silicon on Insulator (SOI) Market by Technology
9.3.5 India Silicon on Insulator (SOI) Market by Product
9.4 South Korea Silicon on Insulator (SOI) Market
9.4.1 South Korea Silicon on Insulator (SOI) Market by Wafer Size
9.4.2 South Korea Silicon on Insulator (SOI) Market by Wafer Type
9.4.3 South Korea Silicon on Insulator (SOI) Market by Application
9.4.4 South Korea Silicon on Insulator (SOI) Market by Technology
9.4.5 South Korea Silicon on Insulator (SOI) Market by Product
9.5 Singapore Silicon on Insulator (SOI) Market
9.5.1 Singapore Silicon on Insulator (SOI) Market by Wafer Size
9.5.2 Singapore Silicon on Insulator (SOI) Market by Wafer Type
9.5.3 Singapore Silicon on Insulator (SOI) Market by Application
9.5.4 Singapore Silicon on Insulator (SOI) Market by Technology
9.5.5 Singapore Silicon on Insulator (SOI) Market by Product
9.6 Malaysia Silicon on Insulator (SOI) Market
9.6.1 Malaysia Silicon on Insulator (SOI) Market by Wafer Size
9.6.2 Malaysia Silicon on Insulator (SOI) Market by Wafer Type
9.6.3 Malaysia Silicon on Insulator (SOI) Market by Application
9.6.4 Malaysia Silicon on Insulator (SOI) Market by Technology
9.6.5 Malaysia Silicon on Insulator (SOI) Market by Product
9.7 Rest of Asia Pacific Silicon on Insulator (SOI) Market
9.7.1 Rest of Asia Pacific Silicon on Insulator (SOI) Market by Wafer Size
9.7.2 Rest of Asia Pacific Silicon on Insulator (SOI) Market by Wafer Type
9.7.3 Rest of Asia Pacific Silicon on Insulator (SOI) Market by Application
9.7.4 Rest of Asia Pacific Silicon on Insulator (SOI) Market by Technology
9.7.5 Rest of Asia Pacific Silicon on Insulator (SOI) Market by Product
Chapter 10. Company Profiles
10.1 NXP Semiconductors N.V.
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Product Launches and Product Expansions:
10.1.6 SWOT Analysis
10.2 Sony Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expenses
10.2.5 SWOT Analysis
10.3 STMicroelectronics N.V.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Segmental and Regional Analysis
10.3.4 Research & Development Expense
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.5.3 Acquisition and Mergers:
10.3.6 SWOT Analysis
10.4 Shin-Etsu Chemical Co., Ltd.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Regional & Segmental Analysis
10.4.4 Research & Development Expenses
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.5 Sumco Corporation
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Regional Analysis
10.5.4 Research & Development Expenses
10.6 Soitec
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Recent strategies and developments:
10.6.4.1 Acquisition and Mergers:
10.6.4.2 Geographical Expansions:
10.7 Murata Manufacturing Co., Ltd.
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Segmental and Regional Analysis
10.7.4 Research & Development Expense
10.8 Qorvo, Inc.
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Partnerships, Collaborations, and Agreements:
10.9 Skyworks Solutions, Inc.
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Regional Analysis
10.9.4 Research & Development Expenses
10.10. GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
10.10.1 Company Overview
10.10.2 Recent strategies and developments:
10.10.2.1 Partnerships, Collaborations, and Agreements:
Companies Mentioned
- Soitec
- Shin-Etsu Chemical Co., Ltd.
- GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
- SUMCO Corporation
- STMicroelectronics N.V.
- NXP Semiconductors N.V.
- Murata Manufacturing Co., Ltd.
- Skyworks Solutions, Inc.
- Qorvo, Inc.
- Sony Corporation
Methodology
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