The semiconductor machinery market size is expected to see strong growth in the next few years. It will grow to $243.39 billion in 2030 at a compound annual growth rate (CAGR) of 6.4%. The growth in the forecast period can be attributed to surging demand for AI and high performance computing chips, expansion of electric vehicle production, government incentives for domestic semiconductor manufacturing, growth of IoT and connected devices, rising adoption of advanced node and packaging technologies. Major trends in the forecast period include rising demand for advanced lithography and EUV equipment, increasing investment in semiconductor fabrication capacity, growing adoption of automation in wafer processing, higher focus on yield optimization and defect reduction, expansion of advanced packaging and heterogeneous integration.
The increasing demand for renewable electricity is also anticipated to drive the growth of the semiconductor machinery market. Renewable electricity refers to power generated from naturally replenishing and environmentally sustainable sources. Semiconductor manufacturing is highly energy-intensive, and adopting renewable electricity sources can greatly reduce the carbon footprint of semiconductor fabrication facilities. These sources offer clean, sustainable energy that helps semiconductor companies achieve environmental goals while also lowering energy costs. For instance, in September 2024, the Northern Ireland Statistics and Research Agency, an Ireland-based government organization, reported that between July 2023 and June 2024, 45.8% of total metered electricity consumption in Northern Ireland came from local renewable energy, a 0.3 percentage point increase compared to the previous year. Therefore, the rising demand for renewable electricity is supporting the expansion of the semiconductor machinery market.
Major companies in the semiconductor machinery market are developing advanced technological solutions such as semiconductor wafer transfer robots to enhance market competitiveness and profitability. These robots are specifically designed for automating the movement of wafers between cassettes, boats, and processing equipment. For example, in August 2023, Nidec Sankyo Corporation, a Japan-based electrical component manufacturer, introduced a new semiconductor wafer transfer robot capable of switching between four cassettes positioned at the front and back. This innovation is intended to improve the efficiency of semiconductor production processes.
In October 2025, Axcelis Technologies, Inc., a US-based manufacturer of semiconductor process equipment, acquired Veeco Instruments Inc. for an undisclosed amount. This acquisition aims to integrate complementary equipment portfolios and technologies, enabling Axcelis to become a more diversified, full-service semiconductor capital equipment provider. The acquisition expands the company’s addressable market and strengthens its competitiveness across front-end and specialty-process segments. Veeco Instruments is a US-based manufacturer of semiconductor machinery and process equipment used in semiconductor fabrication.
Major companies operating in the semiconductor machinery market are ASML Holding N.V., Tokyo Electron Ltd, Lam Research Corp, Applied Materials Inc., KLA-Tencor Corp, SCREEN Holdings Co. Ltd., Teradyne Inc., Toshiba Corporation, Danaher Corporation, Advantest Corporation., ASYS Group, Axcelis Technologies Inc., Brooks Automation Inc., Canon Inc., Disco Corporation, Edwards Limited, Hitachi High-Technologies Corporation, Nikon Corporation, Nova Measuring Instruments Ltd., Onto Innovation Inc., Orbotech Ltd., Plasma-Therm LLC, Rudolph Technologies Inc., SPTS Technologies Ltd., Ultratech Inc., Veeco Instruments Inc., Xcerra Corporation, Yield Engineering Systems Inc., Zygo Corporation, Siconnex Customized Solutions GmbH, SÜSS MicroTec SE.
Asia-Pacific was the largest region in the semiconductor machinery market in 2025. Western Europe was the second-largest region in the global semiconductor machinery market. The regions covered in the semiconductor machinery market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor machinery market report are China, India, Japan, Australia, Indonesia, South Korea, Bangladesh, Thailand, Vietnam, Malaysia, Singapore, Philippines, Hong Kong, Taiwan, New Zealand, UK, Germany, France, Italy, Spain, Austria, Belgium, Denmark, Finland, Ireland, Netherlands, Norway, Portugal, Sweden, Switzerland, Russia, Czech Republic, Poland, Romania, Ukraine, USA, Canada, Mexico, Brazil, Chile, Argentina, Colombia, Peru, Saudi Arabia, Israel, Iran, Turkey, UAE, Egypt, Nigeria, South Africa.
The semiconductor machinery market consists of sales of dicing machines, precision accretech dicing blades, probing machines, polish grinders, and others. Values in this market are factory gate values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Semiconductor Machinery Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses semiconductor machinery market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for semiconductor machinery? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The semiconductor machinery market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Report Scope
Markets Covered:
1) By Semiconductor Device Type: Front-End Equipment; Back-End Equipment; Fab Facility Equipment2) By Product: Memory; Foundry; Logic; MPU; Discrete; Analog; MEMS; Other Products
3) By Supply Chain Participant: OSAT Companies; IDM Firms; Foundries
4) By Application: Integrated Circuit; Discrete Device; Optoelectronic Device; Sensors
Subsegments:
1) By Front-End Equipment: Photolithography Equipment; Etching Equipment; Deposition Equipment; Chemical Mechanical Planarization (CMP) Equipment; Ion Implantation Equipment2) By Back-End Equipment: Wafer Bonders; Die Attach Equipment; Wire Bonding Equipment; Packaging Equipment; Testing Equipment
3) By Fab Facility Equipment: Cleanroom Equipment; Gas and Chemical Delivery Systems; HVAC Systems (Heating, Ventilation, and Air Conditioning); Water Purification Systems; Environmental Monitoring Systems
Companies Mentioned: ASML Holding N.V.; Tokyo Electron Ltd; Lam Research Corp; Applied Materials Inc.; KLA-Tencor Corp; SCREEN Holdings Co. Ltd.; Teradyne Inc.; Toshiba Corporation; Danaher Corporation; Advantest Corporation.; ASYS Group; Axcelis Technologies Inc.; Brooks Automation Inc.; Canon Inc.; Disco Corporation; Edwards Limited; Hitachi High-Technologies Corporation; Nikon Corporation; Nova Measuring Instruments Ltd.; Onto Innovation Inc.; Orbotech Ltd.; Plasma-Therm LLC; Rudolph Technologies Inc.; SPTS Technologies Ltd.; Ultratech Inc.; Veeco Instruments Inc.; Xcerra Corporation; Yield Engineering Systems Inc.; Zygo Corporation; Siconnex Customized Solutions GmbH; SÜSS MicroTec SE
Countries: China; India; Japan; Australia; Indonesia; South Korea; Bangladesh; Thailand; Vietnam; Malaysia; Singapore; Philippines; Hong Kong; Taiwan; New Zealand; UK; Germany; France; Italy; Spain; Austria; Belgium; Denmark; Finland; Ireland; Netherlands; Norway; Portugal; Sweden; Switzerland; Russia; Czech Republic; Poland; Romania; Ukraine; USA; Canada; Mexico; Brazil; Chile; Argentina; Colombia; Peru; Saudi Arabia; Israel; Iran; Turkey; UAE; Egypt; Nigeria; South Africa.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Semiconductor Machinery market report include:- ASML Holding N.V.
- Tokyo Electron Ltd
- Lam Research Corp
- Applied Materials Inc.
- KLA-Tencor Corp
- SCREEN Holdings Co. Ltd.
- Teradyne Inc.
- Toshiba Corporation
- Danaher Corporation
- Advantest Corporation.
- ASYS Group
- Axcelis Technologies Inc.
- Brooks Automation Inc.
- Canon Inc.
- Disco Corporation
- Edwards Limited
- Hitachi High-Technologies Corporation
- Nikon Corporation
- Nova Measuring Instruments Ltd.
- Onto Innovation Inc.
- Orbotech Ltd.
- Plasma-Therm LLC
- Rudolph Technologies Inc.
- SPTS Technologies Ltd.
- Ultratech Inc.
- Veeco Instruments Inc.
- Xcerra Corporation
- Yield Engineering Systems Inc.
- Zygo Corporation
- Siconnex Customized Solutions GmbH
- SÜSS MicroTec SE
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 189.65 Billion |
| Forecasted Market Value ( USD | $ 243.39 Billion |
| Compound Annual Growth Rate | 6.4% |
| Regions Covered | Global |
| No. of Companies Mentioned | 32 |
