The Microelectronics Technology Opportunity Engine covers innovation related to quantum heat pump, intelligent storage, wearable bio monitoring devices, AI accelerator, holographic AR, VCSEL for 3D sensing, satellite communication, precision die bonding system, thin layer stacking technology, laser based wireless charging for IoT, RISC-V for SoC, SiC power modules, pseudostatic DRAM, and graphene based UV LEDs.
The Microelectronics Technology Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centered on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Table of Contents
1. Innovations in Microelectronics
- Quantum Heat Pump Aids Detection of Dark Matter
- Value Proposition of Tu Delft’s Quantum Heat Pump
- Intelligent Storage Aids Building On-premise Cloud Environments
- Value Proposition of Softiron Ltd.
- Softiron Ltd. - Investor Dashboard
- Remote Monitoring of Body Vitals Using Wearable Biomedical Devices
- Value Proposition of Terrablue XT
- Terrablue XT - Investor Dashboard
- AI Accelerator for Edge Processing
- Value Proposition of Leapmind Inc.
- Leapmind Inc. - Investor Dashboard
- Holographic Augmented Reality (AR) Headset Enables Interactive Gaming Experience
- Value Proposition of Tilt Five
- Tilt Five - Investor Dashboard
- Vertical-cavity Surface-emitting Laser (VCSEL) for 3D Sensing Applications
- Vertilite’s Value Proposition
- Vertilite - Investor Dashboard
- Satellite Communication Module for Internet of Things (IoT) Communication
- Astrocast’s Value Proposition
- Astrocast - Investor Dashboard
- Precision Die Bonding System for Microelectronics Packaging
- MRSI’s Value Proposition
- MRSI - Investor Dashboard
- Thin-layer Stacking Technology for Semiconductor Packaging
- EV Group’s Value Proposition
- EV Group - Investor Dashboard
- Laser-based Wireless Charging for Internet of Things (Iot) Sensors
- Sejong University’s Value Proposition
- RISC-V System-on-chip (SoC) for Edge Computing Applications
- Leapfive’s Value Proposition
- Leapfive - Investor Dashboard
- Silicon Carbide (SiC) Power Modules for High Power Applications
- STM’s Value Proposition
- STM - Investor Dashboard
- Pseudostatic Dynamic Random-access Memory (DRAM) Technology for Industrial Automation
- Infineon’s Value Proposition
- Infineon - Investor Dashboard
- Graphene-based UV LEDs for Disinfectant Applications
- CrayoNano’s Value Proposition
- CrayoNano - Investor Dashboard
2. Key Contacts
3. Appendix
- Criteria for Rating of Innovations - Explanation
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Astrocast
- CrayoNano
- EV Group
- Infineon
- Leapfive
- Leapmind Inc.
- MRSI
- Softiron Ltd.
- STM
- Terrablue XT
- Tilt Five
- Vertilite
