The Asia Pacific Semiconductor Production Equipment Market would witness market growth of 9.3 % CAGR during the forecast period (2022-2028).
The main areas of concentration for major market players are the fastest manufacturing speed, cutting-edge lithography technology, and nano-imprinting. Additionally, the production of optoelectronic and electronic devices uses this equipment. These particular electronic parts are frequently found in fiber optic networks, 4G, and 5G telecommunication channels.
The equipment has attributes including a high production rate and great accuracy. As a result, manufacturers and suppliers benefit from significant profit margins from these types of machinery. These machines have recently included new technical developments like AI and Industry 4.0 for enhancing production capacity, high precision, and minimizing waste, as well as improving the profitability for major participants, which is predicted to enhance the market growth.
Due to increased investment in developing the semiconductor industry in nations like China and India, which fuels market expansion, Asia-Pacific is predicted to have faster growth. Taiwan, a significant player in the semiconductor fabrication sector, is investing in expanding its capacity. For example, Taiwan Semiconductor Manufacturing Company (TSMC) declared its intention to increase its production capacity significantly over the next three years. Additionally, nations are heavily politicizing the semiconductor industry due to the crucial function that semiconductor chips play in the modern industrial period. China is also making significant investments in the creation of its cutting-edge technologies. Robotics are increasingly being used in the healthcare sector in Japan.
China, South Korea, Japan, and Taiwan have combined to form the Big 4 semiconductor producers in Asia Pacific, retaining four of the leading six positions by overall semiconductor profits and having several semiconductor giants. Government support, a sizable market, and rising R&D spending have fueled this development. Currently, three-quarters of the world's semiconductor manufacturing capacity is in East Asia.
The China market dominated the Asia Pacific Semiconductor Production Equipment Market by Country 2021, achieving a market value of $17,497.1 million by 2028. The Japan market is exhibiting a CAGR of 8.7% during (2022 - 2028). Additionally, The India market would experience a CAGR of 10% during (2022 - 2028).
Based on Dimension, the market is segmented into 3-Dimension, 2.5-Dimension and 2-Dimension. Based on Supply Chain Process, the market is segmented into IDM, OSAT and Others. Based on Product Type, the market is segmented into Front-end Equipment and Back-end Equipment. Based on Function, the market is segmented into Integrated Circuits and OSD. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Alsil Material, ASML Holdings N.V., SCREEN Holdings Co., Ltd., Teradyne, Inc., Applied Materials, Inc., Veeco Instruments, Inc., KLA Corporation, Nikon Corporation, Carl Zeiss AG, and Lam Research Corporation.
The main areas of concentration for major market players are the fastest manufacturing speed, cutting-edge lithography technology, and nano-imprinting. Additionally, the production of optoelectronic and electronic devices uses this equipment. These particular electronic parts are frequently found in fiber optic networks, 4G, and 5G telecommunication channels.
The equipment has attributes including a high production rate and great accuracy. As a result, manufacturers and suppliers benefit from significant profit margins from these types of machinery. These machines have recently included new technical developments like AI and Industry 4.0 for enhancing production capacity, high precision, and minimizing waste, as well as improving the profitability for major participants, which is predicted to enhance the market growth.
Due to increased investment in developing the semiconductor industry in nations like China and India, which fuels market expansion, Asia-Pacific is predicted to have faster growth. Taiwan, a significant player in the semiconductor fabrication sector, is investing in expanding its capacity. For example, Taiwan Semiconductor Manufacturing Company (TSMC) declared its intention to increase its production capacity significantly over the next three years. Additionally, nations are heavily politicizing the semiconductor industry due to the crucial function that semiconductor chips play in the modern industrial period. China is also making significant investments in the creation of its cutting-edge technologies. Robotics are increasingly being used in the healthcare sector in Japan.
China, South Korea, Japan, and Taiwan have combined to form the Big 4 semiconductor producers in Asia Pacific, retaining four of the leading six positions by overall semiconductor profits and having several semiconductor giants. Government support, a sizable market, and rising R&D spending have fueled this development. Currently, three-quarters of the world's semiconductor manufacturing capacity is in East Asia.
The China market dominated the Asia Pacific Semiconductor Production Equipment Market by Country 2021, achieving a market value of $17,497.1 million by 2028. The Japan market is exhibiting a CAGR of 8.7% during (2022 - 2028). Additionally, The India market would experience a CAGR of 10% during (2022 - 2028).
Based on Dimension, the market is segmented into 3-Dimension, 2.5-Dimension and 2-Dimension. Based on Supply Chain Process, the market is segmented into IDM, OSAT and Others. Based on Product Type, the market is segmented into Front-end Equipment and Back-end Equipment. Based on Function, the market is segmented into Integrated Circuits and OSD. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Alsil Material, ASML Holdings N.V., SCREEN Holdings Co., Ltd., Teradyne, Inc., Applied Materials, Inc., Veeco Instruments, Inc., KLA Corporation, Nikon Corporation, Carl Zeiss AG, and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Dimension
- 3-Dimension
- 2.5-Dimension
- 2-Dimension
By Supply Chain Process
- IDM
- OSAT
- Others
By Product Type
- Front-end Equipment
- Back-end Equipment
By Function
- Integrated Circuits
- OSD
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Alsil Material
- ASML Holdings N.V
- SCREEN Holdings Co., Ltd
- Teradyne, Inc
- Applied Materials, Inc
- Veeco Instruments, Inc
- KLA Corporation
- Nikon Corporation
- Carl Zeiss AG
- Lam Research Corporation
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Semiconductor Production Equipment Market, by Dimension
1.4.2 Asia Pacific Semiconductor Production Equipment Market, by Supply Chain Process
1.4.3 Asia Pacific Semiconductor Production Equipment Market, by Product Type Process
1.4.4 Asia Pacific Semiconductor Production Equipment Market, by Function
1.4.5 Asia Pacific Semiconductor Production Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.1 Top Winning Strategies
3.1.1 Key Leading Strategies: Percentage Distribution (2018-2022)
Chapter 4. Asia Pacific Semiconductor Production Equipment Market by Dimension
4.1 Asia Pacific 3-Dimension Market by Country
4.2 Asia Pacific 2.5-Dimension Market by Country
4.3 Asia Pacific 2-Dimension Market by Country
Chapter 5. Asia Pacific Semiconductor Production Equipment Market by Supply Chain Process
5.1 Asia Pacific IDM Market by Country
5.2 Asia Pacific OSAT Market by Country
5.3 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific Semiconductor Production Equipment Market by Product Type
6.1 Asia Pacific Front-end Equipment Market by Country
6.2 Asia Pacific Back-end Equipment Market by Country
Chapter 7. Asia Pacific Semiconductor Production Equipment Market by Function
7.1 Asia Pacific Integrated Circuits Market by Country
7.2 Asia Pacific OSD Market by Country
Chapter 8. Asia Pacific Semiconductor Production Equipment Market by Country
8.1 China Semiconductor Production Equipment Market
8.1.1 China Semiconductor Production Equipment Market by Dimension
8.1.2 China Semiconductor Production Equipment Market by Supply Chain Process
8.1.3 China Semiconductor Production Equipment Market by Product Type
8.1.4 China Semiconductor Production Equipment Market by Function
8.2 Japan Semiconductor Production Equipment Market
8.2.1 Japan Semiconductor Production Equipment Market by Dimension
8.2.2 Japan Semiconductor Production Equipment Market by Supply Chain Process
8.2.3 Japan Semiconductor Production Equipment Market by Product Type
8.2.4 Japan Semiconductor Production Equipment Market by Function
8.3 India Semiconductor Production Equipment Market
8.3.1 India Semiconductor Production Equipment Market by Dimension
8.3.2 India Semiconductor Production Equipment Market by Supply Chain Process
8.3.3 India Semiconductor Production Equipment Market by Product Type
8.3.4 India Semiconductor Production Equipment Market by Function
8.4 South Korea Semiconductor Production Equipment Market
8.4.1 South Korea Semiconductor Production Equipment Market by Dimension
8.4.2 South Korea Semiconductor Production Equipment Market by Supply Chain Process
8.4.3 South Korea Semiconductor Production Equipment Market by Product Type
8.4.4 South Korea Semiconductor Production Equipment Market by Function
8.5 Singapore Semiconductor Production Equipment Market
8.5.1 Singapore Semiconductor Production Equipment Market by Dimension
8.5.2 Singapore Semiconductor Production Equipment Market by Supply Chain Process
8.5.3 Singapore Semiconductor Production Equipment Market by Product Type
8.5.4 Singapore Semiconductor Production Equipment Market by Function
8.6 Malaysia Semiconductor Production Equipment Market
8.6.1 Malaysia Semiconductor Production Equipment Market by Dimension
8.6.2 Malaysia Semiconductor Production Equipment Market by Supply Chain Process
8.6.3 Malaysia Semiconductor Production Equipment Market by Product Type
8.6.4 Malaysia Semiconductor Production Equipment Market by Function
8.7 Rest of Asia Pacific Semiconductor Production Equipment Market
8.7.1 Rest of Asia Pacific Semiconductor Production Equipment Market by Dimension
8.7.2 Rest of Asia Pacific Semiconductor Production Equipment Market by Supply Chain Process
8.7.3 Rest of Asia Pacific Semiconductor Production Equipment Market by Product Type
8.7.4 Rest of Asia Pacific Semiconductor Production Equipment Market by Function
Chapter 9. Company Profiles
9.1 KLA Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.5.2 Acquisition and Mergers:
9.2 Teradyne, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Recent strategies and developments:
9.2.4.1 Product Launches and Product Expansions:
9.2.4.2 Acquisition and Mergers:
9.3 ASML Holding N.V
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent strategies and developments:
9.3.5.1 Partnerships, Collaborations, and Agreements:
9.3.5.2 Acquisition and Mergers:
9.4 Applied Materials, Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Partnerships, Collaborations, and Agreements:
9.4.5.2 Acquisition and Mergers:
9.5 SCREEN Holdings Co., Ltd
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.6 Veeco Instruments, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Partnerships, Collaborations, and Agreements:
9.7 Nikon Corporation
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expense
9.8 Carl Zeiss AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments:
9.8.5.1 Geographical Expansions:
9.9 Lam Research Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments:
9.9.5.1 Acquisition and Mergers:
9.9.5.2 Geographical Expansions:
9.10. Alsil Material
9.10.1 Company Overview
Companies Mentioned
- Alsil Material
- ASML Holdings N.V.
- SCREEN Holdings Co., Ltd
- Teradyne, Inc.
- Applied Materials, Inc.
- Veeco Instruments, Inc.
- KLA Corporation
- Nikon Corporation
- Carl Zeiss AG
- Lam Research Corporation
Methodology
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