The North America Semiconductor Production Equipment Market would witness market growth of 8.8% CAGR during the forecast period (2022-2028).
The equipment used in producing semiconductors is used to create circuits, memory chips, IC chips, semiconductor wafers, and more. Early on in the production process, silicon wafer fabrication equipment is used. Equipment used in wafer processing includes etching equipment, photolithography tools, chemical vapor deposition (CVD) equipment, measuring equipment, and process/quality control tools.
Many applications have progressed due to semiconductors, including computing, communications, healthcare, military systems, transportation, and clean energy. They are also promoting the creation of cutting-edge technologies that have the potential to improve society, such as brain-inspired computing, virtual reality, the Internet of Things, energy-efficient sensors, automated devices, robotics, and artificial intelligence.
Semiconductor packaging is one of the most crucial requirements in the electronics sector worldwide. Due to the escalating demand for semiconductor packaging, die-bonding compounds are in high demand. The United States Army is working on a brand-new technique for integrating Silicon Carbide (SiC)-powered semiconductors into contemporary equipment and weapons. Due to such elements from the consumption side of semiconductor packaging, the necessity for bonding compounds is rising. As a result, manufacturers in North America are becoming increasingly interested in jet wave machines. Jet wave machines can be used for soldering and sintering pastes and have the speed and accuracy needed to fuse components above the circuit.
The US market dominated the North America Semiconductor Production Equipment Market by Country 2021, achieving a market value of $32,339.3 million by 2028. The Canada market is estimated to grow at a CAGR of 11.2% during (2022 - 2028). Additionally, The Mexico market is poised to grow at a CAGR of 10.3% during (2022 - 2028).
Based on Dimension, the market is segmented into 3-Dimension, 2.5-Dimension and 2-Dimension. Based on Supply Chain Process, the market is segmented into IDM, OSAT and Others. Based on Product Type, the market is segmented into Front-end Equipment and Back-end Equipment. Based on Function, the market is segmented into Integrated Circuits and OSD. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Alsil Material, ASML Holdings N.V., SCREEN Holdings Co., Ltd., Teradyne, Inc., Applied Materials, Inc., Veeco Instruments, Inc., KLA Corporation, Nikon Corporation, Carl Zeiss AG, and Lam Research Corporation.
The equipment used in producing semiconductors is used to create circuits, memory chips, IC chips, semiconductor wafers, and more. Early on in the production process, silicon wafer fabrication equipment is used. Equipment used in wafer processing includes etching equipment, photolithography tools, chemical vapor deposition (CVD) equipment, measuring equipment, and process/quality control tools.
Many applications have progressed due to semiconductors, including computing, communications, healthcare, military systems, transportation, and clean energy. They are also promoting the creation of cutting-edge technologies that have the potential to improve society, such as brain-inspired computing, virtual reality, the Internet of Things, energy-efficient sensors, automated devices, robotics, and artificial intelligence.
Semiconductor packaging is one of the most crucial requirements in the electronics sector worldwide. Due to the escalating demand for semiconductor packaging, die-bonding compounds are in high demand. The United States Army is working on a brand-new technique for integrating Silicon Carbide (SiC)-powered semiconductors into contemporary equipment and weapons. Due to such elements from the consumption side of semiconductor packaging, the necessity for bonding compounds is rising. As a result, manufacturers in North America are becoming increasingly interested in jet wave machines. Jet wave machines can be used for soldering and sintering pastes and have the speed and accuracy needed to fuse components above the circuit.
The US market dominated the North America Semiconductor Production Equipment Market by Country 2021, achieving a market value of $32,339.3 million by 2028. The Canada market is estimated to grow at a CAGR of 11.2% during (2022 - 2028). Additionally, The Mexico market is poised to grow at a CAGR of 10.3% during (2022 - 2028).
Based on Dimension, the market is segmented into 3-Dimension, 2.5-Dimension and 2-Dimension. Based on Supply Chain Process, the market is segmented into IDM, OSAT and Others. Based on Product Type, the market is segmented into Front-end Equipment and Back-end Equipment. Based on Function, the market is segmented into Integrated Circuits and OSD. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Alsil Material, ASML Holdings N.V., SCREEN Holdings Co., Ltd., Teradyne, Inc., Applied Materials, Inc., Veeco Instruments, Inc., KLA Corporation, Nikon Corporation, Carl Zeiss AG, and Lam Research Corporation.
Scope of the Study
Market Segments Covered in the Report:
By Dimension
- 3-Dimension
- 2.5-Dimension
- 2-Dimension
By Supply Chain Process
- IDM
- OSAT
- Others
By Product Type
- Front-end Equipment
- Back-end Equipment
By Function
- Integrated Circuits
- OSD
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Alsil Material
- ASML Holdings N.V
- SCREEN Holdings Co., Ltd
- Teradyne, Inc
- Applied Materials, Inc
- Veeco Instruments, Inc
- KLA Corporation
- Nikon Corporation
- Carl Zeiss AG
- Lam Research Corporation
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- The highest number of Market tables and figures
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Semiconductor Production Equipment Market, by Dimension
1.4.2 North America Semiconductor Production Equipment Market, by Supply Chain Process
1.4.3 North America Semiconductor Production Equipment Market, by Product Type Process
1.4.4 North America Semiconductor Production Equipment Market, by Function
1.4.5 North America Semiconductor Production Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 KBV Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Acquisition and Mergers
3.1 Top Winning Strategies
3.1.1 Key Leading Strategies: Percentage Distribution (2018-2022)
Chapter 4. North America Semiconductor Production Equipment Market by Dimension
4.1 North America 3-Dimension Market by Country
4.2 North America 2.5-Dimension Market by Country
4.3 North America 2-Dimension Market by Country
Chapter 5. North America Semiconductor Production Equipment Market by Supply Chain Process
5.1 North America IDM Market by Country
5.2 North America OSAT Market by Country
5.3 North America Others Market by Country
Chapter 6. North America Semiconductor Production Equipment Market by Product Type
6.1 North America Front-end Equipment Market by Country
6.2 North America Back-end Equipment Market by Country
Chapter 7. North America Semiconductor Production Equipment Market by Function
7.1 North America Integrated Circuits Market by Country
7.2 North America OSD Market by Country
Chapter 8. North America Semiconductor Production Equipment Market by Country
8.1 US Semiconductor Production Equipment Market
8.1.1 US Semiconductor Production Equipment Market by Dimension
8.1.2 US Semiconductor Production Equipment Market by Supply Chain Process
8.1.3 US Semiconductor Production Equipment Market by Product Type
8.1.4 US Semiconductor Production Equipment Market by Function
8.2 Canada Semiconductor Production Equipment Market
8.2.1 Canada Semiconductor Production Equipment Market by Dimension
8.2.2 Canada Semiconductor Production Equipment Market by Supply Chain Process
8.2.3 Canada Semiconductor Production Equipment Market by Product Type
8.2.4 Canada Semiconductor Production Equipment Market by Function
8.3 Mexico Semiconductor Production Equipment Market
8.3.1 Mexico Semiconductor Production Equipment Market by Dimension
8.3.2 Mexico Semiconductor Production Equipment Market by Supply Chain Process
8.3.3 Mexico Semiconductor Production Equipment Market by Product Type
8.3.4 Mexico Semiconductor Production Equipment Market by Function
8.4 Rest of North America Semiconductor Production Equipment Market
8.4.1 Rest of North America Semiconductor Production Equipment Market by Dimension
8.4.2 Rest of North America Semiconductor Production Equipment Market by Supply Chain Process
8.4.3 Rest of North America Semiconductor Production Equipment Market by Product Type
8.4.4 Rest of North America Semiconductor Production Equipment Market by Function
Chapter 9. Company Profiles
9.1 KLA Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.5.2 Acquisition and Mergers:
9.2 Teradyne, Inc.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Recent strategies and developments:
9.2.4.1 Product Launches and Product Expansions:
9.2.4.2 Acquisition and Mergers:
9.3 ASML Holding N.V
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 Recent strategies and developments:
9.3.5.1 Partnerships, Collaborations, and Agreements:
9.3.5.2 Acquisition and Mergers:
9.4 Applied Materials, Inc.
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Partnerships, Collaborations, and Agreements:
9.4.5.2 Acquisition and Mergers:
9.5 SCREEN Holdings Co., Ltd
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Segmental and Regional Analysis
9.5.4 Research & Development Expenses
9.6 Veeco Instruments, Inc.
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Partnerships, Collaborations, and Agreements:
9.7 Nikon Corporation
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expense
9.8 Carl Zeiss AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expenses
9.8.5 Recent strategies and developments:
9.8.5.1 Geographical Expansions:
9.9 Lam Research Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Regional Analysis
9.9.4 Research & Development Expenses
9.9.5 Recent strategies and developments:
9.9.5.1 Acquisition and Mergers:
9.9.5.2 Geographical Expansions:
9.10. Alsil Material
9.10.1 Company Overview
Companies Mentioned
- Alsil Material
- ASML Holdings N.V.
- SCREEN Holdings Co., Ltd
- Teradyne, Inc.
- Applied Materials, Inc.
- Veeco Instruments, Inc.
- KLA Corporation
- Nikon Corporation
- Carl Zeiss AG
- Lam Research Corporation
Methodology
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