The global thin wafer processing and dicing equipment market was valued at $643.78 million in 2021, and is projected to reach $1,196.49 million by 2031, registering a CAGR of 6.67% from 2022 to 2031.
A wafer is a thin slice of semiconductor material and dicing is the process which is used to cut or groove semiconductors, glass crystal and many other types of materials. Instrument used during this process is known as dicing equipment. Wafer dicing is the process of separating the dies from a semiconductor wafer after the wafer has been processed. The need for miniaturization towards small, powerful, and inexpensive device configurations has created the need for thin wafers. Most of these have reached 100 µm or even less than 50 µm for applications such as memory and power devices. Wafers below 390 µm are considered thin wafers. These thin wafers are expected to be in high demand for applications in Radio Frequency Identification (RFID), Micro Electro Mechanical Systems (MEMS), and power devices.
The thin wafer processing and dicing equipment market is segmented on the basis of equipment type, application, wafer size, and region. On the basis of equipment type, the market is divided into thinning equipment and dicing equipment. On the basis of application, it is divided into memory and logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID). On the basis of wafer size, the market is divided into less than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch. Region-wise, thin wafer processing and dicing equipment market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific) and LAMEA (Latin America, the Middle East, and Africa).
The key thin wafer processing and dicing equipment market leaders profiled in the report include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. These key players adopt several Strategies such as new product launch and development, acquisition, partnership and collaboration and business expansion to increase the thin wafer processing and dicing equipment market share during the forecast period.
A wafer is a thin slice of semiconductor material and dicing is the process which is used to cut or groove semiconductors, glass crystal and many other types of materials. Instrument used during this process is known as dicing equipment. Wafer dicing is the process of separating the dies from a semiconductor wafer after the wafer has been processed. The need for miniaturization towards small, powerful, and inexpensive device configurations has created the need for thin wafers. Most of these have reached 100 µm or even less than 50 µm for applications such as memory and power devices. Wafers below 390 µm are considered thin wafers. These thin wafers are expected to be in high demand for applications in Radio Frequency Identification (RFID), Micro Electro Mechanical Systems (MEMS), and power devices.
The thin wafer processing and dicing equipment market is segmented on the basis of equipment type, application, wafer size, and region. On the basis of equipment type, the market is divided into thinning equipment and dicing equipment. On the basis of application, it is divided into memory and logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID). On the basis of wafer size, the market is divided into less than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch. Region-wise, thin wafer processing and dicing equipment market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific) and LAMEA (Latin America, the Middle East, and Africa).
The key thin wafer processing and dicing equipment market leaders profiled in the report include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. These key players adopt several Strategies such as new product launch and development, acquisition, partnership and collaboration and business expansion to increase the thin wafer processing and dicing equipment market share during the forecast period.
Key Benefits For Stakeholders
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thin wafer processing and dicing equipment market analysis from 2021 to 2031 to identify the prevailing thin wafer processing and dicing equipment market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's Five Forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the thin wafer processing and dicing equipment market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes an analysis of the regional as well as global thin wafer processing and dicing equipment market trends, key players, market segments, application areas, and market growth Strategies.
Key Market Segments
By Wafer Size
- Less than 4 inch
- 5 inch and 6 inch
- 8 inch
- 12 inch
By Equipment Type
- Thinning Equipment
- Dicing Equipment
By Application
- Memory and Logic
- MEMS Devices
- CMOS Image Sensors
- Power Devices
- RFID
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Market Players
- Synova SA
- Plasma-Therm
- Disco Corporation
- Panasonic
- EV Group (EVG)
- SPTS Technologies Ltd.
- UTAC Holding, Ltd
- Neon Tech Co. Ltd.
- Lam Research Corp.
- Suzhou Delphi Laser Co., Ltd.
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Table of Contents
CHAPTER 1: INTRODUCTION1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
1.4.1.Secondary research
1.4.2.Primary research
1.4.3.Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1.Key findings of the study
2.2.CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top investment pockets
3.3.Porter’s five forces analysis
3.4.Market dynamics
3.4.1.Drivers
3.4.1.1. Growing demand for high-performance integrated circuits and developments in semiconductor technology
3.4.1.2. Increasing adoption of Radio Frequency Identification (RFID) tags
3.4.2.Restraints
3.4.2.1. High expenses associated with fabrication, maintenance, and manufacturing processes
3.4.3.Opportunities
3.4.3.1. Investment in wafer enhancement could provide profitable opportunities
3.5.COVID-19 Impact Analysis on the market
CHAPTER 4: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE
4.1 Overview
4.1.1 Market size and forecast
4.2. Thinning Equipment
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market share analysis by country
4.3. Dicing Equipment
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market share analysis by country
CHAPTER 5: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE
5.1 Overview
5.1.1 Market size and forecast
5.2. Less than 4 inch
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market share analysis by country
5.3. 5 inch and 6 inch
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market share analysis by country
5.4. 8 inch
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market share analysis by country
5.5. 12 inch
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market share analysis by country
CHAPTER 6: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION
6.1 Overview
6.1.1 Market size and forecast
6.2. Memory and Logic
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market share analysis by country
6.3. MEMS Devices
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market share analysis by country
6.4. CMOS Image Sensors
6.4.1 Key market trends, growth factors and opportunities
6.4.2 Market size and forecast, by region
6.4.3 Market share analysis by country
6.5. Power Devices
6.5.1 Key market trends, growth factors and opportunities
6.5.2 Market size and forecast, by region
6.5.3 Market share analysis by country
6.6. RFID
6.6.1 Key market trends, growth factors and opportunities
6.6.2 Market size and forecast, by region
6.6.3 Market share analysis by country
CHAPTER 7: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY REGION
7.1 Overview
7.1.1 Market size and forecast
7.2 North America
7.2.1 Key trends and opportunities
7.2.2 North America Market size and forecast, by Equipment Type
7.2.3 North America Market size and forecast, by Wafer Size
7.2.4 North America Market size and forecast, by Application
7.2.5 North America Market size and forecast, by country
7.2.5.1 U.S.
7.2.5.1.1 Key market trends, growth factors and opportunities
7.2.5.1.2 Market size and forecast, by Equipment Type
7.2.5.1.3 Market size and forecast, by Wafer Size
7.2.5.1.4 Market size and forecast, by Application
7.2.5.2 Canada
7.2.5.2.1 Key market trends, growth factors and opportunities
7.2.5.2.2 Market size and forecast, by Equipment Type
7.2.5.2.3 Market size and forecast, by Wafer Size
7.2.5.2.4 Market size and forecast, by Application
7.2.5.3 Mexico
7.2.5.3.1 Key market trends, growth factors and opportunities
7.2.5.3.2 Market size and forecast, by Equipment Type
7.2.5.3.3 Market size and forecast, by Wafer Size
7.2.5.3.4 Market size and forecast, by Application
7.3 Europe
7.3.1 Key trends and opportunities
7.3.2 Europe Market size and forecast, by Equipment Type
7.3.3 Europe Market size and forecast, by Wafer Size
7.3.4 Europe Market size and forecast, by Application
7.3.5 Europe Market size and forecast, by country
7.3.5.1 UK
7.3.5.1.1 Key market trends, growth factors and opportunities
7.3.5.1.2 Market size and forecast, by Equipment Type
7.3.5.1.3 Market size and forecast, by Wafer Size
7.3.5.1.4 Market size and forecast, by Application
7.3.5.2 Germany
7.3.5.2.1 Key market trends, growth factors and opportunities
7.3.5.2.2 Market size and forecast, by Equipment Type
7.3.5.2.3 Market size and forecast, by Wafer Size
7.3.5.2.4 Market size and forecast, by Application
7.3.5.3 France
7.3.5.3.1 Key market trends, growth factors and opportunities
7.3.5.3.2 Market size and forecast, by Equipment Type
7.3.5.3.3 Market size and forecast, by Wafer Size
7.3.5.3.4 Market size and forecast, by Application
7.3.5.4 Rest of Europe
7.3.5.4.1 Key market trends, growth factors and opportunities
7.3.5.4.2 Market size and forecast, by Equipment Type
7.3.5.4.3 Market size and forecast, by Wafer Size
7.3.5.4.4 Market size and forecast, by Application
7.4 Asia-Pacific
7.4.1 Key trends and opportunities
7.4.2 Asia-Pacific Market size and forecast, by Equipment Type
7.4.3 Asia-Pacific Market size and forecast, by Wafer Size
7.4.4 Asia-Pacific Market size and forecast, by Application
7.4.5 Asia-Pacific Market size and forecast, by country
7.4.5.1 China
7.4.5.1.1 Key market trends, growth factors and opportunities
7.4.5.1.2 Market size and forecast, by Equipment Type
7.4.5.1.3 Market size and forecast, by Wafer Size
7.4.5.1.4 Market size and forecast, by Application
7.4.5.2 Japan
7.4.5.2.1 Key market trends, growth factors and opportunities
7.4.5.2.2 Market size and forecast, by Equipment Type
7.4.5.2.3 Market size and forecast, by Wafer Size
7.4.5.2.4 Market size and forecast, by Application
7.4.5.3 India
7.4.5.3.1 Key market trends, growth factors and opportunities
7.4.5.3.2 Market size and forecast, by Equipment Type
7.4.5.3.3 Market size and forecast, by Wafer Size
7.4.5.3.4 Market size and forecast, by Application
7.4.5.4 South Korea
7.4.5.4.1 Key market trends, growth factors and opportunities
7.4.5.4.2 Market size and forecast, by Equipment Type
7.4.5.4.3 Market size and forecast, by Wafer Size
7.4.5.4.4 Market size and forecast, by Application
7.4.5.5 Rest of Asia-Pacific
7.4.5.5.1 Key market trends, growth factors and opportunities
7.4.5.5.2 Market size and forecast, by Equipment Type
7.4.5.5.3 Market size and forecast, by Wafer Size
7.4.5.5.4 Market size and forecast, by Application
7.5 LAMEA
7.5.1 Key trends and opportunities
7.5.2 LAMEA Market size and forecast, by Equipment Type
7.5.3 LAMEA Market size and forecast, by Wafer Size
7.5.4 LAMEA Market size and forecast, by Application
7.5.5 LAMEA Market size and forecast, by country
7.5.5.1 Latin America
7.5.5.1.1 Key market trends, growth factors and opportunities
7.5.5.1.2 Market size and forecast, by Equipment Type
7.5.5.1.3 Market size and forecast, by Wafer Size
7.5.5.1.4 Market size and forecast, by Application
7.5.5.2 Middle East
7.5.5.2.1 Key market trends, growth factors and opportunities
7.5.5.2.2 Market size and forecast, by Equipment Type
7.5.5.2.3 Market size and forecast, by Wafer Size
7.5.5.2.4 Market size and forecast, by Application
7.5.5.3 Africa
7.5.5.3.1 Key market trends, growth factors and opportunities
7.5.5.3.2 Market size and forecast, by Equipment Type
7.5.5.3.3 Market size and forecast, by Wafer Size
7.5.5.3.4 Market size and forecast, by Application
CHAPTER 8: COMPETITIVE LANDSCAPE
8.1. Introduction
8.2. Top winning Strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Top player positioning, 2021
CHAPTER 9: COMPANY PROFILES
9.1 Synova SA
9.1.1 Company overview
9.1.2 Key Executives
9.1.3 Company snapshot
9.1.4 Operating business segments
9.1.5 Product portfolio
9.1.6 Business performance
9.1.7 Key strategic moves and developments
9.2 Plasma-Therm
9.2.1 Company overview
9.2.2 Key Executives
9.2.3 Company snapshot
9.2.4 Operating business segments
9.2.5 Product portfolio
9.2.6 Business performance
9.2.7 Key strategic moves and developments
9.3 Disco Corporation
9.3.1 Company overview
9.3.2 Key Executives
9.3.3 Company snapshot
9.3.4 Operating business segments
9.3.5 Product portfolio
9.3.6 Business performance
9.3.7 Key strategic moves and developments
9.4 Panasonic
9.4.1 Company overview
9.4.2 Key Executives
9.4.3 Company snapshot
9.4.4 Operating business segments
9.4.5 Product portfolio
9.4.6 Business performance
9.4.7 Key strategic moves and developments
9.5 EV Group (EVG)
9.5.1 Company overview
9.5.2 Key Executives
9.5.3 Company snapshot
9.5.4 Operating business segments
9.5.5 Product portfolio
9.5.6 Business performance
9.5.7 Key strategic moves and developments
9.6 SPTS Technologies Ltd.
9.6.1 Company overview
9.6.2 Key Executives
9.6.3 Company snapshot
9.6.4 Operating business segments
9.6.5 Product portfolio
9.6.6 Business performance
9.6.7 Key strategic moves and developments
9.7 UTAC Holding, Ltd
9.7.1 Company overview
9.7.2 Key Executives
9.7.3 Company snapshot
9.7.4 Operating business segments
9.7.5 Product portfolio
9.7.6 Business performance
9.7.7 Key strategic moves and developments
9.8 Neon Tech Co. Ltd.
9.8.1 Company overview
9.8.2 Key Executives
9.8.3 Company snapshot
9.8.4 Operating business segments
9.8.5 Product portfolio
9.8.6 Business performance
9.8.7 Key strategic moves and developments
9.9 Lam Research Corp.
9.9.1 Company overview
9.9.2 Key Executives
9.9.3 Company snapshot
9.9.4 Operating business segments
9.9.5 Product portfolio
9.9.6 Business performance
9.9.7 Key strategic moves and developments
9.10 Suzhou Delphi Laser Co., Ltd.
9.10.1 Company overview
9.10.2 Key Executives
9.10.3 Company snapshot
9.10.4 Operating business segments
9.10.5 Product portfolio
9.10.6 Business performance
9.10.7 Key strategic moves and developments
List of Tables
Table 1. Global Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 2. Thin Wafer Processing and Dicing Equipment Market for Thinning Equipment, by Region, 2021-2031 (Revenue, $Million)
Table 3. Thin Wafer Processing and Dicing Equipment Market for Dicing Equipment, by Region, 2021-2031 (Revenue, $Million)
Table 4. Global Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 5. Thin Wafer Processing and Dicing Equipment Market for Less Than 4 Inch, by Region, 2021-2031 (Revenue, $Million)
Table 6. Thin Wafer Processing and Dicing Equipment Market for 5 Inch and 6 Inch, by Region, 2021-2031 (Revenue, $Million)
Table 7. Thin Wafer Processing and Dicing Equipment Market for 8 Inch, by Region, 2021-2031 (Revenue, $Million)
Table 8. Thin Wafer Processing and Dicing Equipment Market for 12 Inch, by Region, 2021-2031 (Revenue, $Million)
Table 9. Global Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 10. Thin Wafer Processing and Dicing Equipment Market for Memory and Logic, by Region, 2021-2031 (Revenue, $Million)
Table 11. Thin Wafer Processing and Dicing Equipment Market for Mems Devices, by Region, 2021-2031 (Revenue, $Million)
Table 12. Thin Wafer Processing and Dicing Equipment Market for Cmos Image Sensors, by Region, 2021-2031 (Revenue, $Million)
Table 13. Thin Wafer Processing and Dicing Equipment Market for Power Devices, by Region, 2021-2031 (Revenue, $Million)
Table 14. Thin Wafer Processing and Dicing Equipment Market for RFID, by Region, 2021-2031 (Revenue, $Million)
Table 15. Thin Wafer Processing and Dicing Equipment Market, by Region, 2021-2031 (Revenue, $Million)
Table 16. North America Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 17. North America Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 18. North America Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 19. North America Thin Wafer Processing and Dicing Equipment Market, by Country, 2021-2031 (Revenue, $Million)
Table 20. U.S. Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 21. U.S. Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 22. U.S. Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 23. Canada Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 24. Canada Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 25. Canada Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 26. Mexico Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 27. Mexico Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 28. Mexico Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 29. Europe Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 30. Europe Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 31. Europe Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 32. Europe Thin Wafer Processing and Dicing Equipment Market, by Country, 2021-2031 (Revenue, $Million)
Table 33. UK Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 34. UK Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 35. UK Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 36. Germany Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 37. Germany Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 38. Germany Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 39. France Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 40. France Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 41. France Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 42. Rest of Europe Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 43. Rest of Europe Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 44. Rest of Europe Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 45. Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 46. Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 47. Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 48. Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Country, 2021-2031 (Revenue, $Million)
Table 49. China Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 50. China Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 51. China Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 52. Japan Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 53. Japan Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 54. Japan Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 55. India Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 56. India Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 57. India Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 58. South Korea Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 59. South Korea Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 60. South Korea Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 61. Rest of Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 62. Rest of Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 63. Rest of Asia-Pacific Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 64. LAMEA Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 65. LAMEA Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 66. LAMEA Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 67. LAMEA Thin Wafer Processing and Dicing Equipment Market, by Country, 2021-2031 (Revenue, $Million)
Table 68. Latin America Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 69. Latin America Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 70. Latin America Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 71. Middle East Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 72. Middle East Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 73. Middle East Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 74. Africa Thin Wafer Processing and Dicing Equipment Market, by Equipment Type, 2021-2031 (Revenue, $Million)
Table 75. Africa Thin Wafer Processing and Dicing Equipment Market, by Wafer Size, 2021-2031 (Revenue, $Million)
Table 76. Africa Thin Wafer Processing and Dicing Equipment Market, by Application, 2021-2031 (Revenue, $Million)
Table 77. Synova SA: Key Executives
Table 78. Synova SA: Company Snapshot
Table 79. Synova SA: Operating Segments
Table 80. Synova SA: Product Portfolio
Table 81. Synova SA: Net Sales
Table 82. Synova SA: Key Strategies
Table 83. Plasma-Therm: Key Executives
Table 84. Plasma-Therm: Company Snapshot
Table 85. Plasma-Therm: Operating Segments
Table 86. Plasma-Therm: Product Portfolio
Table 87. Plasma-Therm: Net Sales
Table 88. Plasma-Therm: Key Strategies
Table 89. Disco Corporation: Key Executives
Table 90. Disco Corporation: Company Snapshot
Table 91. Disco Corporation: Operating Segments
Table 92. Disco Corporation: Product Portfolio
Table 93. Disco Corporation: Net Sales
Table 94. Disco Corporation: Key Strategies
Table 95. Panasonic: Key Executives
Table 96. Panasonic: Company Snapshot
Table 97. Panasonic: Operating Segments
Table 98. Panasonic: Product Portfolio
Table 99. Panasonic: Net Sales
Table 100. Panasonic: Key Strategies
Table 101. EV Group (Evg): Key Executives
Table 102. EV Group (Evg): Company Snapshot
Table 103. EV Group (Evg): Operating Segments
Table 104. EV Group (Evg): Product Portfolio
Table 105. EV Group (Evg): Net Sales
Table 106. EV Group (Evg): Key Strategies
Table 107. Spts Technologies Ltd.: Key Executives
Table 108. Spts Technologies Ltd.: Company Snapshot
Table 109. Spts Technologies Ltd.: Operating Segments
Table 110. Spts Technologies Ltd.: Product Portfolio
Table 111. Spts Technologies Ltd.: Net Sales
Table 112. Spts Technologies Ltd.: Key Strategies
Table 113. Utac Holding, Ltd.: Key Executives
Table 114. Utac Holding, Ltd.: Company Snapshot
Table 115. Utac Holding, Ltd.: Operating Segments
Table 116. Utac Holding, Ltd.: Product Portfolio
Table 117. Utac Holding, Ltd.: Net Sales
Table 118. Utac Holding, Ltd.: Key Strategies
Table 119. Neon Tech Co. Ltd.: Key Executives
Table 120. Neon Tech Co. Ltd.: Company Snapshot
Table 121. Neon Tech Co. Ltd.: Operating Segments
Table 122. Neon Tech Co. Ltd.: Product Portfolio
Table 123. Neon Tech Co. Ltd.: Net Sales
Table 124. Neon Tech Co. Ltd.: Key Strategies
Table 125. Lam Research Corp.: Key Executives
Table 126. Lam Research Corp.: Company Snapshot
Table 127. Lam Research Corp.: Operating Segments
Table 128. Lam Research Corp.: Product Portfolio
Table 129. Lam Research Corp.: Net Sales
Table 130. Lam Research Corp.: Key Strategies
Table 131. Suzhou Delphi Laser Co. Ltd.: Key Executives
Table 132. Suzhou Delphi Laser Co. Ltd.: Company Snapshot
Table 133. Suzhou Delphi Laser Co. Ltd.: Operating Segments
Table 134. Suzhou Delphi Laser Co. Ltd.: Product Portfolio
Table 135. Suzhou Delphi Laser Co. Ltd.: Net Sales
Table 136. Suzhou Delphi Laser Co. Ltd.: Key Strategies
List of Figures
Figure 1. Segmentation of Thin Wafer Processing and Dicing Equipment Market,2021-2031
Figure 2. Thin Wafer Processing and Dicing Equipment Market,2021-2031
Figure 3. Top Investment Pockets, by Region
Figure 4. Porter Five-1
Figure 5. Porter Five-2
Figure 6. Porter Five-3
Figure 7. Porter Five-4
Figure 8. Porter Five-5
Figure 9. Thin Wafer Processing and Dicing Equipment Market:Drivers, Restraints and Opportunities
Figure 10. Thin Wafer Processing and Dicing Equipment Market,By Equipment Type,2021(%)
Figure 11. Comparative Share Analysis of Thinning Equipment Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 12. Comparative Share Analysis of Dicing Equipment Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 13. Thin Wafer Processing and Dicing Equipment Market,By Wafer Size,2021(%)
Figure 14. Comparative Share Analysis of Less Than 4 Inch Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 15. Comparative Share Analysis of 5 Inch and 6 Inch Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 16. Comparative Share Analysis of 8 Inch Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 17. Comparative Share Analysis of 12 Inch Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 18. Thin Wafer Processing and Dicing Equipment Market,By Application,2021(%)
Figure 19. Comparative Share Analysis of Memory and Logic Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 20. Comparative Share Analysis of Mems Devices Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 21. Comparative Share Analysis of Cmos Image Sensors Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 22. Comparative Share Analysis of Power Devices Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 23. Comparative Share Analysis of RFID Thin Wafer Processing and Dicing Equipment Market, 2021 and 2031(%)
Figure 24. Thin Wafer Processing and Dicing Equipment Market by Region,2021
Figure 25. U.S. Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 26. Canada Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 27. Mexico Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 28. UK Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 29. Germany Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 30. France Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 31. Rest of Europe Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 32. China Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 33. Japan Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 34. India Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 35. South Korea Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 36. Rest of Asia-Pacific Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 37. Latin America Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 38. Middle East Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 39. Africa Thin Wafer Processing and Dicing Equipment Market,2021-2031($Million)
Figure 40. Top Winning Strategies, by Year
Figure 41. Top Winning Strategies, by Development
Figure 42. Top Winning Strategies, by Company
Figure 43. Product Mapping of Top 10 Players
Figure 44. Competitive Dashboard
Figure 45. Competitive Heatmap of Top 10 Key Players
Figure 46. Top Player Positioning, 2021
Figure 47. Synova SA.: Net Sales ($Million)
Figure 48. Plasma-Therm.: Net Sales ($Million)
Figure 49. Disco Corporation.: Net Sales ($Million)
Figure 50. Panasonic.: Net Sales ($Million)
Figure 51. EV Group (Evg).: Net Sales ($Million)
Figure 52. Spts Technologies Ltd..: Net Sales ($Million)
Figure 53. Utac Holding, Ltd.: Net Sales ($Million)
Figure 54. Neon Tech Co. Ltd..: Net Sales ($Million)
Figure 55. Lam Research Corp..: Net Sales ($Million)
Figure 56. Suzhou Delphi Laser Co. Ltd..: Net Sales ($Million)
Executive Summary
According to the report titled, 'Thin Wafer Processing and Dicing Equipment Market,' the thin wafer processing and dicing equipment market was valued at $643.78 million in 2021, and is estimated to reach $1.2 billion by 2031, growing at a CAGR of 6.7% from 2022 to 2031.In electronics, a wafer (also called wafer or substrate) is a thin semiconductor, such as crystalline silicon (c-Si), used to produce integrated circuits and solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. These wafers are very thin and flat. At the same time, miniaturization has created a need to integrate multiple functions into a single chip. There is a new trend in wafer technology with large format wafers (up to 1- inch diameter). The equipment utilized for the manufacturing of thin wafers is the thin wafer processing and dicing equipment.
Key factors propelling the growth of the thin wafer processing and dicing equipment market include the increased demand for consumer applications like smartphones, smart cards, and stacked packages is the reason the demand for thinned wafers has increased over the past few years. In addition, industrialization in the Asian economy, global urbanization, and the proliferation of artificial intelligence, IoT, and connected devices across diverse industries provide many growth opportunities for players operating in the thin wafer processing and dicing equipment market.
The Thin Wafer Processing & Dicing Equipment Market grows in size as a result of the rising demand for thinner wafers and more substantial die. Blade dicing, laser dicing, plasma dicing, and other dicing technologies are also seeing increased demand as a result of expanding applications in a variety of industry verticals for Logic and Memory, Power Devices, Radio Frequency Identification (RFID), and CMOS Image Sensors. During the forecast period, the Thin Wafer Processing & Dicing Equipment industry's outlook would be positively impacted by the aforementioned factors.
The thin wafer processing and dicing equipment market is segmented on the basis of equipment type, application, wafer size, and region. On the basis of equipment type, the market is divided into thinning equipment and dicing equipment. On the basis of application, it is divided into memory and logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID). On the basis of wafer size, the market is divided into less than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch. Region wise, it is analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and Rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The key players profiled in the study include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. The players in the market have been actively engaged in the adoption of various Strategies such as acquisition, product launch and expansion to remain competitive and gain an advantage over the competitors in the market. For instance, In May 2021, with the invention of the first chip using 2 nanometer (nm) nanosheet technology, IBM announced a breakthrough in semiconductor design and process.
Key Market Insights
In 2021, by equipment type, the dicing equipment segment was the highest revenue contributor to the market. However, the thinning equipment segment is estimated to be the fastest growing segment during the forecast period.By application, the memory and logic segment generated the largest share and is expected to follow the same trend during the forecast period.
By wafer size, the 5-inch and 6-inch segment was the highest revenue contributor to the thin wafer processing and dicing equipment market and is estimated to reach $468.96 million by 2031.
Based on region, Asia-Pacific was the highest revenue contributor, accounting for $56.09 million in 2021, and is estimated to reach $119.08 million by 2031, with a CAGR of 8.07%.
Companies Mentioned
- Synova SA
- Plasma-Therm
- Disco Corporation
- Panasonic
- EV Group (EVG)
- SPTS Technologies Ltd.
- UTAC Holding, Ltd
- Neon Tech Co. Ltd.
- Lam Research Corp.
- Suzhou Delphi Laser Co., Ltd.
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 19 |
| Published | January 2023 |
| Forecast Period | 2021 - 2031 |
| Estimated Market Value ( USD | $ 643.78 million |
| Forecasted Market Value ( USD | $ 1196.49 million |
| Compound Annual Growth Rate | 6.4% |
| Regions Covered | Global |
| No. of Companies Mentioned | 10 |
