The Latin America, Middle East and Africa Quad-Flat-No-Lead Packaging Market should witness market growth of 12.3% CAGR during the forecast period (2022-2028).
The need for live video broadcasting has recently increased. Events like riots, accidents, conflict, sports, and political meetings draw large crowds who want to see them live. This demand has compelled and tested broadcasters and internet news professionals to explore fresh approaches to provide their audiences with continuous live HD content.
With large TV production trucks, getting to the event places as soon as feasible becomes impossible. Therefore, multiple cameras are needed to record sporting events held in huge stadiums from various perspectives.The solution for these issues as forwarded by the product designers include portable handheld gadgets that transmit real-time video through cellular technology.
These gadgets can take the place of the large TV production truck and lower the risk of equipment and human life loss. To quickly reach the event place or flee, such portable device may be carried on backpacks with ease. A high-end professional camera can be connected using multiple high-speed connections, such as SDI and HDMI, owing to the use of latest generation of GPU andDSP processors.
Given the abundance of electronics manufacturing firms in nations like Brazil, Latin America is projected to be the most alluring market for QFN packages. Consumer electronics consumption has expanded due to the rising desire for high-end, advanced technology-based products and falling prices for gadgets. Additionally, the region's electronic goods consumption is supported by technical advancements like the Internet of Things (IoT) and Long-Term Evolution (LTE), which will assist the region's semiconductor market's growth over the next years. Additionally, the Latin American market would gain from the increased use of cell phones, televisions, and laptops in Brazil. As their discretionary income continues to increase, consumers in this region are spending on expensive electronics. Therefore, this element would contribute to the regional quad-flat-no-leadpackaging marketexpanding more quickly.
The Brazil market dominated the LAMEA Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $12.4 Thousands by 2028. The Argentina market is experiencing a CAGR of 12.9% during (2022-2028). Additionally, The UAE market would display a CAGR of 12% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
The need for live video broadcasting has recently increased. Events like riots, accidents, conflict, sports, and political meetings draw large crowds who want to see them live. This demand has compelled and tested broadcasters and internet news professionals to explore fresh approaches to provide their audiences with continuous live HD content.
With large TV production trucks, getting to the event places as soon as feasible becomes impossible. Therefore, multiple cameras are needed to record sporting events held in huge stadiums from various perspectives.The solution for these issues as forwarded by the product designers include portable handheld gadgets that transmit real-time video through cellular technology.
These gadgets can take the place of the large TV production truck and lower the risk of equipment and human life loss. To quickly reach the event place or flee, such portable device may be carried on backpacks with ease. A high-end professional camera can be connected using multiple high-speed connections, such as SDI and HDMI, owing to the use of latest generation of GPU andDSP processors.
Given the abundance of electronics manufacturing firms in nations like Brazil, Latin America is projected to be the most alluring market for QFN packages. Consumer electronics consumption has expanded due to the rising desire for high-end, advanced technology-based products and falling prices for gadgets. Additionally, the region's electronic goods consumption is supported by technical advancements like the Internet of Things (IoT) and Long-Term Evolution (LTE), which will assist the region's semiconductor market's growth over the next years. Additionally, the Latin American market would gain from the increased use of cell phones, televisions, and laptops in Brazil. As their discretionary income continues to increase, consumers in this region are spending on expensive electronics. Therefore, this element would contribute to the regional quad-flat-no-leadpackaging marketexpanding more quickly.
The Brazil market dominated the LAMEA Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $12.4 Thousands by 2028. The Argentina market is experiencing a CAGR of 12.9% during (2022-2028). Additionally, The UAE market would display a CAGR of 12% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
By Moulding Method
- Punched
- Sawn
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 LAMEA Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 LAMEA Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 LAMEA Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 LAMEA Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 LAMEA Quad-Flat-No-Lead Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. LAMEA Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 LAMEA Punched Market by Country
3.2 LAMEA Sawn Market by Country
Chapter 4. LAMEA Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 LAMEA Fully Exposed Terminal Ends Market by Country
4.2 LAMEA Pull-back Terminal Ends Market by Country
4.3 LAMEA Side Wettable Flank Terminal Ends Market by Country
Chapter 5. LAMEA Quad-Flat-No-Lead Packaging Market by Type
5.1 LAMEA Air Cavity Market by Country
5.2 LAMEA Plastic-moulded Market by Country
5.3 LAMEA Others Market by Country
Chapter 6. LAMEA Quad-Flat-No-Lead Packaging Market by Vertical
6.1 LAMEA Automotive Market by Country
6.2 LAMEA Consumer Electronics Market by Country
6.3 LAMEA Industrial Market by Country
6.4 LAMEA Computing / Networking Market by Country
6.5 LAMEA Communications Market by Country
Chapter 7. LAMEA Quad-Flat-No-Lead Packaging Market by Country
7.1 Brazil Quad-Flat-No-Lead Packaging Market
7.1.1 Brazil Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.2 Brazil Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.3 Brazil Quad-Flat-No-Lead Packaging Market by Type
7.1.4 Brazil Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Argentina Quad-Flat-No-Lead Packaging Market
7.2.1 Argentina Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.2 Argentina Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.3 Argentina Quad-Flat-No-Lead Packaging Market by Type
7.2.4 Argentina Quad-Flat-No-Lead Packaging Market by Vertical
7.3 UAE Quad-Flat-No-Lead Packaging Market
7.3.1 UAE Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.2 UAE Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.3 UAE Quad-Flat-No-Lead Packaging Market by Type
7.3.4 UAE Quad-Flat-No-Lead Packaging Market by Vertical
7.4 Saudi Arabia Quad-Flat-No-Lead Packaging Market
7.4.1 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.2 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.3 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Type
7.4.4 Saudi Arabia Quad-Flat-No-Lead Packaging Market by Vertical
7.5 South Africa Quad-Flat-No-Lead Packaging Market
7.5.1 South Africa Quad-Flat-No-Lead Packaging Market by Moulding Method
7.5.2 South Africa Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.5.3 South Africa Quad-Flat-No-Lead Packaging Market by Type
7.5.4 South Africa Quad-Flat-No-Lead Packaging Market by Vertical
7.6 Nigeria Quad-Flat-No-Lead Packaging Market
7.6.1 Nigeria Quad-Flat-No-Lead Packaging Market by Moulding Method
7.6.2 Nigeria Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.6.3 Nigeria Quad-Flat-No-Lead Packaging Market by Type
7.6.4 Nigeria Quad-Flat-No-Lead Packaging Market by Vertical
7.7 Rest of LAMEA Quad-Flat-No-Lead Packaging Market
7.7.1 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Moulding Method
7.7.2 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.7.3 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Type
7.7.4 Rest of LAMEA Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview
Companies Mentioned
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Methodology
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