The Asia Pacific Quad-Flat-No-Lead Packaging Market should witness market growth of 8.7% CAGR during the forecast period (2022-2028).
Consumers who want to stay connected in the digital environment require smaller, lighter items as international mobility increases. Consumer electronics manufacturers are attempting to make their products smaller to meet this demand. Smaller, thinner, and more insulated containers enable the miniaturization of items.
Multiple studies have shown that QFNpackages surpass dual in-line surface-mount technology (SMT) packages in terms of thermal performance. Compared to typical leaded packages, QFN packages have no external leads, a short board routing area, low inductance, and low capacitance. To achieve product simplification, organizations have chosen QFN packaging as one of the strategies for electronic component manufacturing.
The Asia-Pacific region has a disproportionately high concentration of semiconductor manufacturers and is a major user of the QFN packaging technology. Several government initiatives are also being launched to expand the industry for semiconductor manufacturing technology. For instance, the governments of Asian countries with developing economies are committed to securing FDI for their national economies' growth. The government authorities set up some FDI attraction strategies to achieve this. These significant investments support various businesses, including the semiconductor industry, while enabling the development of new products and services. Therefore, this element would contribute to the regional quad-flat-no-leadpackaging marketexpanding more quickly.
The China market dominated the Asia Pacific Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $82.3 Thousands by 2028. The Japan market is estimated to grow a CAGR of 8% during (2022-2028). Additionally, The India market would experience a CAGR of 9.3% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Consumers who want to stay connected in the digital environment require smaller, lighter items as international mobility increases. Consumer electronics manufacturers are attempting to make their products smaller to meet this demand. Smaller, thinner, and more insulated containers enable the miniaturization of items.
Multiple studies have shown that QFNpackages surpass dual in-line surface-mount technology (SMT) packages in terms of thermal performance. Compared to typical leaded packages, QFN packages have no external leads, a short board routing area, low inductance, and low capacitance. To achieve product simplification, organizations have chosen QFN packaging as one of the strategies for electronic component manufacturing.
The Asia-Pacific region has a disproportionately high concentration of semiconductor manufacturers and is a major user of the QFN packaging technology. Several government initiatives are also being launched to expand the industry for semiconductor manufacturing technology. For instance, the governments of Asian countries with developing economies are committed to securing FDI for their national economies' growth. The government authorities set up some FDI attraction strategies to achieve this. These significant investments support various businesses, including the semiconductor industry, while enabling the development of new products and services. Therefore, this element would contribute to the regional quad-flat-no-leadpackaging marketexpanding more quickly.
The China market dominated the Asia Pacific Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $82.3 Thousands by 2028. The Japan market is estimated to grow a CAGR of 8% during (2022-2028). Additionally, The India market would experience a CAGR of 9.3% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
By Moulding Method
- Punched
- Sawn
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 Asia Pacific Quad-Flat-No-Lead Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 Asia Pacific Punched Market by Country
3.2 Asia Pacific Sawn Market by Country
Chapter 4. Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 Asia Pacific Fully Exposed Terminal Ends Market by Country
4.2 Asia Pacific Pull-back Terminal Ends Market by Country
4.3 Asia Pacific Side Wettable Flank Terminal Ends Market by Country
Chapter 5. Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
5.1 Asia Pacific Air Cavity Market by Country
5.2 Asia Pacific Plastic-moulded Market by Country
5.3 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical
6.1 Asia Pacific Automotive Market by Country
6.2 Asia Pacific Consumer Electronics Market by Country
6.3 Asia Pacific Industrial Market by Country
6.4 Asia Pacific Computing / Networking Market by Country
6.5 Asia Pacific Communications Market by Country
Chapter 7. Asia Pacific Quad-Flat-No-Lead Packaging Market by Country
7.1 China Quad-Flat-No-Lead Packaging Market
7.1.1 China Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.2 China Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.3 China Quad-Flat-No-Lead Packaging Market by Type
7.1.4 China Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Japan Quad-Flat-No-Lead Packaging Market
7.2.1 Japan Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.2 Japan Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.3 Japan Quad-Flat-No-Lead Packaging Market by Type
7.2.4 Japan Quad-Flat-No-Lead Packaging Market by Vertical
7.3 India Quad-Flat-No-Lead Packaging Market
7.3.1 India Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.2 India Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.3 India Quad-Flat-No-Lead Packaging Market by Type
7.3.4 India Quad-Flat-No-Lead Packaging Market by Vertical
7.4 South Korea Quad-Flat-No-Lead Packaging Market
7.4.1 South Korea Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.2 South Korea Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.3 South Korea Quad-Flat-No-Lead Packaging Market by Type
7.4.4 South Korea Quad-Flat-No-Lead Packaging Market by Vertical
7.5 Singapore Quad-Flat-No-Lead Packaging Market
7.5.1 Singapore Quad-Flat-No-Lead Packaging Market by Moulding Method
7.5.2 Singapore Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.5.3 Singapore Quad-Flat-No-Lead Packaging Market by Type
7.5.4 Singapore Quad-Flat-No-Lead Packaging Market by Vertical
7.6 Malaysia Quad-Flat-No-Lead Packaging Market
7.6.1 Malaysia Quad-Flat-No-Lead Packaging Market by Moulding Method
7.6.2 Malaysia Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.6.3 Malaysia Quad-Flat-No-Lead Packaging Market by Type
7.6.4 Malaysia Quad-Flat-No-Lead Packaging Market by Vertical
7.7 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market
7.7.1 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Moulding Method
7.7.2 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.7.3 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Type
7.7.4 Rest of Asia Pacific Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview
Companies Mentioned
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Methodology
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