The North America Quad-Flat-No-Lead Packaging Market should witness market growth of 7.7% CAGR during the forecast period (2022-2028).
The rapidly growingIC packaging solution currently available is quad-flat no-lead packaging technology. The versatile form factor of QFN packaging lets the technology service all markets while meeting unique dimensions and application requirements. The QFN packaging option is employed in a variety of markets to overcome space and functionality issues. MLF is becoming popular and versatile in microelectromechanical and sensorsystems applications.
The automobile sector continues to rely on QFN technology for improvements in the adoption of vehicle electronics.Automatic windscreen wiper systems,battery control management systems,and sophisticated moisture-sensing systems are examples of QFNapplications. Usually, IC packaging marks the final phase in the fabrication of semiconductor devices. During this crucial stage, the block of the semiconductor is encased in a packaging that shields the integrated circuit from potentially harmful external factors and the destructive effects of time.
The package is an enclosure created to safeguard the block and stimulate the electrical connections that transmit signals to an electronic device's circuit board. Lead frame IC packages are the most prevalent variety. This packaging would be used for wire-bonded linked dies with gold or silver plating. Manufacturers commonly employ copper lead-frame materials for surface-mount plastic containers. Copper is very conductive and highly malleable. Hence it can be advantageous for this application.
The four industries strategically significant to the United States are semiconductors, photovoltaic products, advanced batteries, and pharmaceuticals. All electronic devices require integrated circuits, which are the essential building blocks. These advancements in information technology have greatly increased production in all local businesses. Technology developments in the defense industry depend on American dominance in semiconductors. The fundamental component of solar energy, photovoltaic cells are also a key renewable energy source that can advance American national objectives by reducing reliance on foreign oil and greenhouse gas emissions. These elements significantly impact the regional quad-flat-no-leadmarket's explosive expansion.
The US market dominated the North America Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $155.5 Thousands by 2028. The Canada market is poised to grow at a CAGR of 10.1% during (2022-2028). Additionally, The Mexico market should witness a CAGR of 9.2% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
The rapidly growingIC packaging solution currently available is quad-flat no-lead packaging technology. The versatile form factor of QFN packaging lets the technology service all markets while meeting unique dimensions and application requirements. The QFN packaging option is employed in a variety of markets to overcome space and functionality issues. MLF is becoming popular and versatile in microelectromechanical and sensorsystems applications.
The automobile sector continues to rely on QFN technology for improvements in the adoption of vehicle electronics.Automatic windscreen wiper systems,battery control management systems,and sophisticated moisture-sensing systems are examples of QFNapplications. Usually, IC packaging marks the final phase in the fabrication of semiconductor devices. During this crucial stage, the block of the semiconductor is encased in a packaging that shields the integrated circuit from potentially harmful external factors and the destructive effects of time.
The package is an enclosure created to safeguard the block and stimulate the electrical connections that transmit signals to an electronic device's circuit board. Lead frame IC packages are the most prevalent variety. This packaging would be used for wire-bonded linked dies with gold or silver plating. Manufacturers commonly employ copper lead-frame materials for surface-mount plastic containers. Copper is very conductive and highly malleable. Hence it can be advantageous for this application.
The four industries strategically significant to the United States are semiconductors, photovoltaic products, advanced batteries, and pharmaceuticals. All electronic devices require integrated circuits, which are the essential building blocks. These advancements in information technology have greatly increased production in all local businesses. Technology developments in the defense industry depend on American dominance in semiconductors. The fundamental component of solar energy, photovoltaic cells are also a key renewable energy source that can advance American national objectives by reducing reliance on foreign oil and greenhouse gas emissions. These elements significantly impact the regional quad-flat-no-leadmarket's explosive expansion.
The US market dominated the North America Quad-Flat-No-Lead Packaging Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $155.5 Thousands by 2028. The Canada market is poised to grow at a CAGR of 10.1% during (2022-2028). Additionally, The Mexico market should witness a CAGR of 9.2% during (2022-2028).
Based on Moulding Method, the market is segmented into Punched and Sawn. Based on Terminal Pads, the market is segmented into Fully Exposed Terminal Ends, Pull-back Terminal Ends and Side Wettable Flank Terminal Ends. Based on Type, the market is segmented into Air Cavity, Plastic-moulded and Others. Based on Vertical, the market is segmented into Automotive, Consumer Electronics, Industrial, Computing / Networking and Communications. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd. (Samsung Group), Toshiba Corporation, Panasonic Holdings Corporation, Sony Corporation, Western Digital Corporation, Micron Technology, Inc., Transcend Information, Inc., Kingston Technology Company, Inc., PNY Technologies, and ADATA Technology Co., Ltd.
Scope of the Study
By Moulding Method
- Punched
- Sawn
By Terminal Pads
- Fully Exposed Terminal Ends
- Pull-back Terminal Ends
- Side Wettable Flank Terminal Ends
By Type
- Air Cavity
- Plastic-moulded
- Others
By Vertical
- Automotive
- Consumer Electronics
- Industrial
- Computing / Networking
- Communications
By Country
- US
- Canada
- Mexico
- Rest of North America
Key Market Players
List of Companies Profiled in the Report:
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Quad-Flat-No-Lead Packaging Market, by Moulding Method
1.4.2 North America Quad-Flat-No-Lead Packaging Market, by Terminal Pads
1.4.3 North America Quad-Flat-No-Lead Packaging Market, by Type
1.4.4 North America Quad-Flat-No-Lead Packaging Market, by Vertical
1.4.5 North America Quad-Flat-No-Lead Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. North America Quad-Flat-No-Lead Packaging Market by Moulding Method
3.1 North America Punched Market by Country
3.2 North America Sawn Market by Country
Chapter 4. North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
4.1 North America Fully Exposed Terminal Ends Market by Country
4.2 North America Pull-back Terminal Ends Market by Country
4.3 North America Side Wettable Flank Terminal Ends Market by Country
Chapter 5. North America Quad-Flat-No-Lead Packaging Market by Type
5.1 North America Air Cavity Market by Country
5.2 North America Plastic-moulded Market by Country
5.3 North America Others Market by Country
Chapter 6. North America Quad-Flat-No-Lead Packaging Market by Vertical
6.1 North America Automotive Market by Country
6.2 North America Consumer Electronics Market by Country
6.3 North America Industrial Market by Country
6.4 North America Computing / Networking Market by Country
6.5 North America Communications Market by Country
Chapter 7. North America Quad-Flat-No-Lead Packaging Market by Country
7.1 US Quad-Flat-No-Lead Packaging Market
7.1.1 US Quad-Flat-No-Lead Packaging Market by Moulding Method
7.1.2 US Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.1.3 US Quad-Flat-No-Lead Packaging Market by Type
7.1.4 US Quad-Flat-No-Lead Packaging Market by Vertical
7.2 Canada Quad-Flat-No-Lead Packaging Market
7.2.1 Canada Quad-Flat-No-Lead Packaging Market by Moulding Method
7.2.2 Canada Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.2.3 Canada Quad-Flat-No-Lead Packaging Market by Type
7.2.4 Canada Quad-Flat-No-Lead Packaging Market by Vertical
7.3 Mexico Quad-Flat-No-Lead Packaging Market
7.3.1 Mexico Quad-Flat-No-Lead Packaging Market by Moulding Method
7.3.2 Mexico Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.3.3 Mexico Quad-Flat-No-Lead Packaging Market by Type
7.3.4 Mexico Quad-Flat-No-Lead Packaging Market by Vertical
7.4 Rest of North America Quad-Flat-No-Lead Packaging Market
7.4.1 Rest of North America Quad-Flat-No-Lead Packaging Market by Moulding Method
7.4.2 Rest of North America Quad-Flat-No-Lead Packaging Market by Terminal Pads
7.4.3 Rest of North America Quad-Flat-No-Lead Packaging Market by Type
7.4.4 Rest of North America Quad-Flat-No-Lead Packaging Market by Vertical
Chapter 8. Company Profiles
8.1 Toshiba Corporation
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research and Development Expense
8.1.5 SWOT Analysis
8.2 Fujitsu Limited
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 SWOT Analysis
8.3 NXP Semiconductors N.V.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expense
8.6 Microchip Technology Incorporated
8.6.1 Company overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. Tianshui Huatian Technology Co.,Ltd
8.10.1 Company Overview
Companies Mentioned
- Toshiba Corporation
- Fujitsu Limited
- NXP Semiconductors N.V.
- ASE Group (ASE Technology Holding)
- Amkor Technology, Inc.
- Microchip Technology Incorporated
- Texas Instruments, Inc.
- JCET Group
- Powertech Technology, Inc.
- Tianshui Huatian Technology Co.,Ltd
Methodology
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