The Microelectronics Semiconductor Packaging (MIPAC) Market Report 2022-2032: This report will prove invaluable to leading firms striving for new revenue pockets if they wish to better understand the industry and its underlying dynamics. It will be useful for companies that would like to expand into different industries or to expand their existing operations in a new region.
Wafer-level packaging (WLP), which includes making the package while the chips are still in wafer form and then slicing them to separate them, has lately gained popularity. By creating vias through the material used to physically separate the wafers, wafer-level packaging of stacked wafers connects the stacked chips. In light of this, system packaging at the wafer level is feasible and will enable the blending of many technologies in a single package.
Multi-Chip Packaging (MCP) Connects Several Integrated Circuits (ICs) in A Single Package Structure to Integrate an Electronic System
Multi-chip packaging (MCP), a recent advancement in electronic packaging, connects several integrated circuits (ICs) in a single package structure to integrate an electronic system. Both planar multi-chip modules (MCMs) and the 3D stacked chip packing known as system-in-package (SiP), which includes ICs stacked vertically, are used in MCP technology. To stack chips, one of two methods stacking single-chip packages, stacking many chips in a single package, or combining both methods can be used.Wafer-level packaging (WLP), which includes making the package while the chips are still in wafer form and then slicing them to separate them, has lately gained popularity. By creating vias through the material used to physically separate the wafers, wafer-level packaging of stacked wafers connects the stacked chips. In light of this, system packaging at the wafer level is feasible and will enable the blending of many technologies in a single package.
High Capital Expenditures For Upscale Packaging Options
High capital expenditures are needed by high-end semiconductor packaging and testing enterprises to produce pricey equipment made by a few number of suppliers. Adoption of innovative packaging techniques has become necessary due to rising miniaturisation demands and low thermal ratings. Only a small number of firms are able to offer these solutions because to the high capital requirements, which restrains the market's expansion. Semiconductor technology advances in terms of both performance and economics. The cost per gate and wafer reduction is similar to the earlier trend of the 22nm Si node. To address the increasing demand for greater functionality, miniaturisation, cost reduction, and enhanced performance, semiconductor manufacturers are gradually implementing advanced packaging technologies such as 3D/2.5D integration with TSVs and interposers and fan-out wafer level packaging (FOWLP).What Questions Should You Ask before Buying a Market Research Report?
- How is the microelectronics semiconductor packaging (MIPAC) market evolving?
- What is driving and restraining the microelectronics semiconductor packaging (MIPAC) market?
- How will each microelectronics semiconductor packaging (MIPAC) submarket segment grow over the forecast period and how much revenue will these submarkets account for in 2032?
- How will the market shares for each microelectronics semiconductor packaging (MIPAC) submarket develop from 2022 to 2032?
- What will be the main driver for the overall market from 2022 to 2032?
- Will leading microelectronics semiconductor packaging (MIPAC) markets broadly follow the macroeconomic dynamics, or will individual national markets outperform others?
- How will the market shares of the national markets change by 2032 and which geographical region will lead the market in 2032?
- Who are the leading players and what are their prospects over the forecast period?
- What are the microelectronics semiconductor packaging (MIPAC) projects for these leading companies?
- How will the industry evolve during the period between 2020 and 2032? What are the implications of microelectronics semiconductor packaging (MIPAC) projects taking place now and over the next 10 years?
- Is there a greater need for product commercialisation to further scale the microelectronics semiconductor packaging (MIPAC) market?
- Where is the microelectronics semiconductor packaging (MIPAC) market heading and how can you ensure you are at the forefront of the market?
- What are the best investment options for new product and service lines?
- What are the key prospects for moving companies into a new growth path and C-suite?
You need to discover how this will impact the microelectronics semiconductor packaging (MIPAC) market today, and over the next 10 years:
- Our 316-page report provides 182 tables and 164 charts/graphs exclusively to you.
- The report highlights key lucrative areas in the industry so you can target them - NOW.
- It contains in-depth analysis of global, regional and national sales and growth.
- It highlights for you the key successful trends, changes and revenue projections made by your competitors.
Forecasts to 2032 and other analyses reveal commercial prospects
- In addition to revenue forecasting to 2032, the new study provides you with recent results, growth rates, and market shares.
- You will find original analyses, with business outlooks and developments.
- Discover qualitative analyses (including market dynamics, drivers, opportunities, restraints and challenges), cost structure, impact of rising microelectronics semiconductor packaging (MIPAC) prices and recent developments.
Segments Covered in the Report
Market Segment by Material
- Simple Semiconductor Material
- Compound Semiconductor Material
- Other Semiconductor Material
Market Segment by Type
- Flip Chip
- Embedded DIE
- Fan-in WLP
- Fan-out WLP
Market Segment by End-User
- Consumer Electronics
- IT & Telecommunications
- Automotive
- Industrial
- Other End-Users
Market Segment by Technology
- Grid Array
- Small Outline Package
- Dual-flat no-leads (DFN)
- Quad-flat no-leads (QFN)
- Plastic Dual Inline Package (PDIP)
- Ceramic Dual Inline Package (CDIP)
North America
- U.S.
- Canada
Europe
- Germany
- Spain
- United Kingdom
- France
- Italy
- Rest of Europe
Asia Pacific
- China
- Japan
- Singapore
- Taiwan
- South Korea
- Rest of Asia Pacific
Middle East & Africa
- Turkey
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
South America
- Brazil
- Mexico
- Rest of South America
Leading companies and the potential for market growth
- Amkor Technology, Inc.
- ASE Group
- Chipbond Technology Corporation
- Chipmos Technologies, Inc.
- Fujitsu Ltd
- Intel Corporation
- Interconnect Systems, Inc. (ISI)
- Jcet/Stats Chippac Ltd
- Murata Electronics
- Powertech Technology, Inc.
- Samsung Electronics Co. Ltd
- Siliconware Precision Industries Co. Ltd (Spil)
- Tianshui Huatian Technology Co. Ltd
- Unisem (M) Berhad
- UTAC Group
How will the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 report help you?
In summary, this 310+ page report provides you with the following knowledge:- Revenue forecasts to 2032 for Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 Market, with forecasts for technology, material, end-user, type and company size, each forecast at a global and regional level - discover the industry’s prospects, finding the most lucrative places for investments and revenues.
- Revenue forecasts to 2032 for four regional and 20 key national markets - See forecasts for the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 market in North America, Europe, Asia-Pacific and LAMEA. Also forecasted is the market in the US, Canada, Taiwan, Brazil, Germany, France, UK, Italy, China, Singapore, Japan, and Australia among other prominent economies.
- Prospects for established firms and those seeking to enter the market - including company profiles for 15 of the major companies involved in the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032.
Information found nowhere else
With this new report, you are less likely to fall behind in knowledge or miss out on opportunities. See how this work could benefit your research, analyses, and decisions. The study is for everybody needing commercial analyses for the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032, market-leading companies. You will find data, trends and predictions.Table of Contents
1 Report Overview
3 Premium Insights
4 Market Overview
5 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Material
6 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Type
7 Global Microelectronics Semiconductor Packaging (MIPAC) Market by Technology
8 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by End User
9 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Region
10 North America Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
11 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
12 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
13 South America Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
14 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
15 Competitive Landscape
16 Company Profiles
17 Conclusion and Recommendations
List of Tables
List of Figures
Companies Mentioned
- Amkor Technology, Inc.
- ASE Group
- Chipbond Technology Corporation
- Chipmos Technologies, Inc.
- Fujitsu Ltd
- Intel Corporation
- Interconnect Systems, Inc. (ISI)
- Jcet/Stats Chippac Ltd
- Murata Electronics
- Powertech Technology, Inc.
- Samsung Electronics Co. Ltd
- Siliconware Precision Industries Co. Ltd (Spil)
- Tianshui Huatian Technology Co. Ltd
- Unisem (M) Berhad
- UTAC Group
- A and D Precision Inc.
- A2e Technologies
- Amarula Electronics
- AMS-JRC
- Argus Systems
- Arira Design
- Ascenten
- Asha Electronics Pvt. Ltd.
- Axiom Manufacturing Services
- Benchmark Electronics, Inc.
- Beyonics Technology
- Celestica, Inc.
- Circuitsify
- Compal Electronics, Inc.
- Creating Technologies LP
- Dexigner
- East India Technologies Pvt. Ltd
- Einfochips
- Elcoteq
- Fabrinet
- Flex Ltd
- Flextronics International, Ltd
- Haughton Design
- Hon Hai Precision Industry Co., Ltd
- Inditronics
- Jabil Circuit, Inc.
- Kemsys
- Mack Technologies
- NEO Tech Inc.
- New Kinpo Group
- Opitmatech
- Pivot International
- Plexus Corporation
- Pramura
- Rayming
- Rioshtech
- Sanmina Corporation
- Shenzhen Kaifa Technology
- SIIX
- Sparqtron Corporation
- Streamline Electronics Manufacturing, Inc.
- Syrma Technology
- Texas Instruments
- Tri-Star Design, Inc.
- Universal Scientific Industrial Co Ltd.
- Venture Corporation Limited
- Vexos
- VSE.COM
- Wipro
- Zollner Elektronik
- American Design Drafting Association
- Association of Electrical and Mechanical Trades (AEMT)
- Consumer Electronics Association (CEA)
- Contract Packaging Association
- Custom Electronic Design & Installation Association
- Electrical Contractors' Association
- Electronic Components Industry Association (ECIA)
- Electronic Industries Association of India
- Electronic Product Development Center (EPDC)
- Electronic System Design & Manufacturing (ESDM)
- Electronic System Design Alliance (ESD Alliance)
- India Cellular and Electronics Association (ICEA)
- India Electronics and Semiconductor Association (IESA)
- Indian Electrical & Electronics Manufacturers' Association (IEEMA)
- Institute of Design for Electrical Measuring Instruments
- National Electrical Manufacturers Association
- National Institute of Electronics and Information
- Oregon Electronics Manufacturers Association
- Software & Information Industry Association (SIIA)
- Taiwan Electrical and Electronic Manufacturers' Association
