Copper Clad Laminate Market Report 2026

The copper clad laminate market size has grown strongly in recent years. It will grow from $14.51 billion in 2025 to $15.67 billion in 2026 at a compound annual growth rate (CAGR) of 8%. The growth in the historic period can be attributed to expansion of consumer electronics manufacturing, growth in printed circuit board production, increasing penetration of electronic devices, advancements in resin formulation technologies, availability of glass fiber reinforced substrates.

The copper clad laminate market size is expected to see strong growth in the next few years. It will grow to $21.5 billion in 2030 at a compound annual growth rate (CAGR) of 8.2%. The growth in the forecast period can be attributed to growing demand from electric vehicles and charging infrastructure, rising adoption of 5g communication systems, increasing use in high-speed data transmission, expansion of advanced semiconductor packaging, higher focus on lightweight electronic components. Major trends in the forecast period include increasing adoption of high-frequency copper clad laminates, rising demand for low-loss pcb materials, growing use of flexible copper clad laminates, expansion of miniaturized electronic devices, enhanced focus on thermal stability performance.

The rising demand for consumer electronics is expected to drive the growth of the copper-clad laminates market in the coming years. Consumer electronics include electronic devices designed for everyday personal use. Copper-clad laminates act as a core material for printed circuit boards (PCBs), enabling the development of complex circuitry that is essential for the operation of a wide range of consumer electronic products. For example, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade organization, Japan’s electronic equipment output reached 771.45 billion yen (approximately USD 5.6 billion). During the same period, consumer electronics production increased to 32.09 billion yen (around USD 233 million), up from 25.26 billion yen (about USD 183 million) in May 2022. Therefore, growing demand for consumer electronics is fueling the expansion of the copper-clad laminates market.

Leading companies operating in the copper-clad laminates market are launching innovative products, including advanced metal alloys and Kapton all-polyimide dielectric technologies, to enhance performance, improve durability, and address evolving requirements across industries such as electronics and telecommunications. Kapton all-polyimide dielectric technology refers to a specialized dielectric material used in copper-clad laminates, particularly for flexible printed circuit boards. For instance, in April 2024, DuPont, a US-based materials and solutions company, introduced the DuPont™ Pyralux ML Series. This new range of double-sided metal-clad laminates is designed to support high thermal management in extreme operating environments. The Pyralux ML series delivers strong performance under demanding conditions, offering a versatile and advanced solution for a broad range of applications.

In March 2023, MBK Partners, a South Korea-based private equity firm, acquired NexFlex Co. for an undisclosed amount. This acquisition is expected to offer significant growth opportunities, supported by strong demand for smartphone materials and the increasing adoption of 5G technology. NexFlex Co. is a South Korea-based manufacturer specializing in copper-clad laminates.

Major companies operating in the copper clad laminate market are Nan Ya Plastics Corporation, Panasonic Holding Corporation, Taiwan Union Technology Corporation, Grace Electron Corp., Isola Group Ltd., ITEQ Corporation, Kingboard Laminates Holding Ltd., Shengyi Technology Co. Ltd., Guangdong Chaohua Technology Co. Ltd., Sytech Technology Co. Ltd., Fineline Ltd., Taiwan Elite Material Co. Ltd., Taiwan Taiflex Scientific Co. Ltd., Goldenmax International Technology Ltd., Rogers Corporation, Ventec International Group, Nikkan Industries Co. Ltd., Hitachi Chemical Co. Ltd., Sumitomo Bakelite Co. Ltd., Jiangsu Jiuwu High-Tech Co. Ltd., Arlon Electronic Materials, Risho Kogyo Co. Ltd., Taiflex Scientific Co. Ltd., Elite Material Co. Ltd., Zhejiang Huazheng New Material Co. Ltd., Amitron Corporation, DuPont de Nemours Inc.

Asia-Pacific was the largest region in the copper clad laminate market in 2025.Asia-Pacific is expected to be the fastest-growing region in the global copper clad laminate market report during the forecast period. The regions covered in the copper clad laminate market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the copper clad laminate market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The copper clad laminate market consists of sales of organic resin copper clad laminates, metal-core copper clad laminates, and ceramic base copper clad laminates. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

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