Electronic Adhesives Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Electronic Adhesives Market is projected to expand from USD 5.27 Billion in 2025 to USD 8.23 Billion by 2031, registering a CAGR of 7.71%. These specialized adhesives are engineered to establish robust structural bonds within electronic assemblies while delivering essential capabilities such as electrical conductivity, thermal regulation, and environmental protection. Major factors propelling this growth include the continuous miniaturization of consumer electronics, the worldwide rollout of 5G infrastructure, and the electrification of the automotive industry, all of which demand high-performance bonding for densely packed circuits. SEMI reported that global sales of semiconductor packaging materials, which depend heavily on advanced adhesive technologies, increased by 4.7% to reach USD 24.6 billion in 2024, highlighting the strong industrial need for these critical materials.

Despite this upward trajectory, the market faces a substantial hurdle due to fluctuating raw material prices, specifically for silver and epoxy resins, which can cause unpredictable spikes in manufacturing expenses. This financial uncertainty is frequently exacerbated by strict environmental regulations governing volatile organic compounds, compelling manufacturers to allocate significant resources toward compliant reformulations. These requirements can potentially hinder rapid market growth and add complexity to supply chain operations.

Market Drivers

The rapid proliferation of electric vehicles and advanced driver-assistance systems acts as a major driver for the electronic adhesives sector, generating significant demand for materials capable of ensuring thermal control and structural integrity. Manufacturers are increasingly dependent on specific adhesive formulas to bond battery units, seal sensors, and safeguard power electronics against rigorous operating environments while preserving electrical insulation. The transition from internal combustion engines to electrified powertrains necessitates bonding solutions that can endure high voltages and thermal cycling, fundamentally altering material usage within the automotive industry. As noted in the 'Global EV Outlook 2024' by the International Energy Agency in April 2024, global electric car sales were forecast to approach 17 million units in 2024, signaling a substantial increase in production needs for automotive electronic assemblies.

Furthermore, the accelerating trend toward miniaturization in electronic devices and components boosts the market as manufacturers look for adhesives compatible with dense circuitry and heterogeneous integration. With devices becoming smaller yet more potent, the industry requires underfills and conductive adhesives that allow for precise application and efficient heat dissipation in compact semiconductor packaging. The Semiconductor Industry Association reported in its November 2024 update that global semiconductor sales reached USD 55.3 billion in September 2024, reflecting the massive volume of components needing advanced bonding technologies. This industrial scale is mirrored in corporate results, with Henkel reporting that its Adhesive Technologies unit generated sales of 2.8 billion Euros in the third quarter of 2024, emphasizing the enduring commercial importance of bonding agents in contemporary manufacturing.

Market Challenges

The main obstacle hindering the growth of the Global Electronic Adhesives Market is the price instability of raw materials, particularly critical inputs such as silver and epoxy resins. Since these materials are essential for manufacturing high-performance conductive and structural adhesives, unpredictable cost fluctuations place immediate strain on production overheads. This financial volatility interferes with long-term pricing models and reduces profit margins, making it challenging for suppliers to offer consistent pricing to electronics manufacturers. As a result, this uncertainty retards the uptake of advanced bonding solutions within cost-conscious mass production sectors.

This economic difficulty is compounded by a continuing disparity between the intense industrial demand for conductive metals and their available supply. According to the Silver Institute, global industrial demand for silver increased by 4 percent in 2024 to a record 680.5 million ounces, leading to a notable structural deficit in the market. Such a clear shortage of a primary raw material directly limits the scalability of conductive adhesive production. As raw material supplies tighten and prices rise, the market finds it difficult to satisfy the high-volume demands of emerging industries without facing prohibitive costs, which subsequently impedes overall market expansion.

Market Trends

The shift toward sustainable and bio-based adhesive formulations is transforming the market as manufacturers place a higher priority on environmental stewardship. Suppliers are actively substituting fossil-based ingredients with renewable alternatives to decrease carbon footprints while maintaining performance standards. This evolution is propelled by strict ESG goals from OEMs that require greater transparency and lower emissions. In its March 2025 'Sustainability Report 2024', Henkel announced it had reduced CO2 emissions in production per ton of product by 64 percent compared to the 2017 baseline, demonstrating a strong commitment to decarbonizing chemical manufacturing.

Concurrently, the incorporation of adhesives into flexible and foldable electronic devices is generating a need for materials that possess superior mechanical flexibility. In contrast to rigid solutions, these adhesives are required to endure repeated bending and thermal stress while preserving their integrity within OLED displays and foldable smartphones. This trend is spurring investment in the infrastructure needed to produce bendable components. Samsung Electronics revealed in its 'Fourth Quarter and FY 2024 Results' report from January 2025 that the company invested KRW 4.8 trillion in capital expenditures for its Display division throughout 2024, highlighting the financial dedication to progressing high-performance panel technologies.

Key Players Profiled in the Electronic Adhesives Market

• Dymax Corporation
• Henkel AG & Co KGaA
• H.B. Fuller Company
• 3M Company
• Evonik Industries AG
• Dow Corning
• Alent PLC
• BASF SE
• The DOW Chemical Co.
• H.B. Fuller

Report Scope

In this report, the Global Electronic Adhesives Market has been segmented into the following categories:

Electronic Adhesives Market, by Resin Type:

• Epoxy
• Silicone
• Polyurethane
• Acrylic
• Others

Electronic Adhesives Market, by Form:

• Liquid
• Paste
• Solid

Electronic Adhesives Market, by Product Type:

• Electrically Conductive Adhesives
• Thermally Conductive Adhesives
• Others

Electronic Adhesives Market, by End User Industry:

• Consumer Electronics
• Medical
• Industrial
• Transportation
• Aerospace & Defense
• Others

Electronic Adhesives Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Electronic Adhesives Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

This product will be delivered within 1-3 business days.