In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches.
The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Table of Contents
Preface xv
1 Fan-Out Wafer and Panel Level Packaging Market and Technology Trends 1
Santosh Kumar, Favier Shoo, and Stephane Elisabeth
1.1 Introduction to Fan-Out Packaging 1
1.1.1 Historical Perspective 1
1.1.2 Key Drivers: Why Fan-Out Packaging? 6
1.1.3 FO-WLP vs. FO-PLP 8
1.1.4 Future of Fan-Out Packaging for Heterogeneous Integration 8
1.2 Market Overview and Applications 10
1.2.1 Fan-Out Packaging Definition 10
1.2.2 Market Segmentation: Core FO vs. HD FO vs. UHD FO 11
1.2.3 Market Valuation: Forecast of Revenue and Volume 12
1.2.4 Current and Future Target Markets 12
1.2.5 Applications of Fan-Out Packaging 14
1.3 Technology Trends and Supply Chain 19
1.3.1 Fan-Out Packaging Technology Roadmaps 19
1.3.2 Fan-Out Packaging Technology by Manufacturer 19
1.3.2.1 Amkor 19
1.3.2.2 JCET 20
1.3.2.3 NXP 21
1.3.2.4 DECA Technologies 21
1.3.2.5 ASE 22
1.3.2.6 TSMC 22
1.3.2.7 PTI 24
1.3.2.8 Samsung Electronics 25
1.3.2.9 Huatian 25
1.3.3 Supply Chain Overview 25
1.3.4 Analysis of the Latest Developments in the Supply Chain 26
1.4 Fan-Out Panel-Level Packaging (FO-PLP) 29
1.4.1 Motivation and Challenges for FO-PLP 29
1.4.2 FO-PLP Market and Applications 30
1.4.3 FO-PLP Supplier Overview 31
1.5 SystemDevice Teardowns 34
1.5.1 Teardown of End-Systems with Fan-Out Packaging 34
1.5.2 Technology Comparison 38
1.5.2.1 Radar IC: eWLB vs. RCP 38
1.5.2.2 MCM/SiP: RCP-SiP vs. eWLB 39
1.5.2.3 PMIC: eWLB vs. M-Series 40
1.5.3 Cost Comparison 41
1.6 Conclusion 42
References 45
2 Cost Comparison of FO-WLP with Other Technologies 47
Amy Palesko Lujan
2.1 Introduction 47
2.2 Activity-Based Cost Modeling 47
2.3 Cost Analysis of FO-WLP Variations 49
2.3.1 Process Segment Costs 50
2.3.1.1 Die Preparation 50
2.3.1.2 Carrier 50
2.3.1.3 Die Bond 51
2.3.1.4 Mold 51
2.3.1.5 Backgrinding 51
2.3.1.6 RDL 51
2.3.1.7 UBM 52
2.3.1.8 Flux and Ball Attach 52
2.3.1.9 Singulation 52
2.3.2 FO-WLP Variations 52
2.3.2.1 Carrier 54
2.3.2.2 Die Cost and Preparation 54
2.3.2.3 Die Bond 54
2.3.2.4 Mold/Mold+CUF 54
2.3.2.5 Backgrind/Post-mold Grind 54
2.3.2.6 Scrap 55
2.4 Cost of FO-WLP versus Wire Bond and Flip Chip 55
2.5 Package-on-Package Cost Analysis 61
2.5.1.1 Substrate/RDLs 63
2.5.1.2 Die Bond 63
2.5.1.3 CUF and Mold Cost 63
2.5.1.4 Ball Attach 64
2.5.1.5 Singulation 64
2.5.1.6 TMV 64
2.5.1.7 Die Bond 66
2.5.1.8 CUF and Mold Cost 66
2.5.1.9 TMV/Large Copper Pillars 66
2.6 Conclusions 66
References 67
3 Integrated Fan-Out (InFO) for Mobile Computing 69
Doug C.H. Yu, John Yeh, Kuo-Chung Yee, and Chih Hang Tung
3.1 Introduction 69
3.2 Fan-InWafer-Level Packaging 70
3.2.1 Dielectric and Redistribution Layers (RDL) 71
3.2.2 Under Bump Metallization (UBM) 71
3.2.3 Reliability and Challenges 72
3.2.4 Large Die WLP 72
3.3 Fan-OutWafer-Level System Integration 73
3.3.1 Chip-First vs. Chip-Last 74
3.3.2 Molding and Planarization 75
3.3.3 Redistribution Layer (RDL) 77
3.3.4 Through Via and Vertical Interconnection 80
3.4 Integrated Passive Devices (IPDs) 81
3.4.1 High Q-Factor 3D Solenoid Inductor 81
3.4.2 Antenna in Package (AiP) and 5G Communication 81
3.4.3 Passive Devices for MillimeterWave System Integration 82
3.5 Power, Performance, Form Factor, and Cost 85
3.5.1 Signal and Power Integrity 87
3.5.2 Heat Dissipation and Thermal Performance 88
3.5.3 Form Factor and Thickness 91
3.5.4 Cycle Time to Market and Cost 91
3.6 Summary 91
References 92
4 Integrated Fan-Out (InFO) for High Performance Computing 95
Doug C.H. Yu, John Yeh, Kuo-Chung Yee, and Chih Hang Tung
4.1 Introduction 95
4.2 3DFabric and System-on-Integrated-Chip (SoIC) 97
4.3 CoWoS-R, CoWoS-S, and CoWoS-L 99
4.4 InFO-L and InFO-R 100
4.5 Info Ultra-High-Density Interconnect (InFO-UHD) 100
4.6 Multi-Stack System Integration (MUST) and Must-in-Must (MiM) 106
4.7 InFO on Substate (InFO-oS) and InFO Local Silicon Interconnect (InFO-L) 108
4.8 InFO with Memory on Substrate (InFO-MS) 110
4.9 InFO 3D Multi-Silicon (InFO-3DMS) and CoWoS-L 111
4.10 InFO System onWafer (InFO_SoW) 112
4.11 System on Integrated Substrate (SoIS) 116
4.12 Immersion Memory Compute (ImMC) 116
4.13 Summary 121
References 122
5 Adaptive Patterning and M-Series for High Density Integration 125
Benedict San Jose, Cliff Sandstrom, Jan Kellar, Craig Bishop, and Tim Olson
5.1 Technology Description 125
5.2 Applications and Markets 127
5.3 Basic Package Construction 127
5.4 Manufacturing Process Flow and BOM 131
5.5 Design Features and System Integration Capability 134
5.6 Adaptive Patterning 137
5.7 Manufacturing Format and Scalability 144
5.8 Package Performance 149
5.9 Robustness and Reliability Data 151
5.10 Electrical Test Considerations 152
5.11 Summary 153
References 153
6 Panel-Level Packaging for Heterogenous Integration 155
M. Töpper, T. Braun, M. Billaud, and L. Stobbe
6.1 Introduction 155
6.2 Fan-Out Panel-Level Packaging 157
6.3 Economic Efficiency Analysis of PLP 161
6.4 Summary 165
References 166
7 Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs 169
Vikas Gupta, Kay Essig, C.T. Chiu, and Mark Gerber
7.1 Technology Description 169
7.2 Basic Package Construction 172
7.3 Applications and Markets (HPC, SiP) 176
7.4 Manufacturing Process Flow and BOM 177
7.5 Design Features 180
7.6 System Integration Capability 182
7.7 Package Performance 183
7.8 Robustness and Reliability Data 186
7.9 Electrical Test Considerations 190
7.10 Summary 191
References 192
8 Die Integration Technologies on Advanced Substrates Including Embedding and Cavities 193
Markus Leitgeb and Christian Vockenberger
8.1 Introduction 193
8.2 Heterogeneous Integration by Use of Embedded Chip Packaging (ECP®) 194
8.3 Embedding Process 196
8.4 Component Selection 198
8.5 Design Technology 199
8.6 Testing 200
8.7 Applications for ECP Technology 201
8.8 Heterogeneous Integration Using Cavities in PCB 206
8.9 Package Performance, Robustness, and Reliability 208
8.10 Conclusion 215
References 215
9 Advanced Embedded Trace Substrate - A Flexible Alternative to Fan-Out Wafer Level Packaging 217
Shih Ping Hsu, Byron Hsu, and Adan Chou
9.1 Technology Description 217
9.1.1 C2iM Technology 217
9.1.2 C2iM-PLP Technology 218
9.2 Applications and Markets 219
9.3 Basic Package Construction 219
9.3.1 C2iM-PLP Experience 219
9.3.2 C2iM-PLP Advantages and Disadvantages Compared to Wirebond Quad Flat No Lead (WB-QFN) and Flip-Chip QFN (FC-QFN) Packages 219
9.3.3 C2iM-PLP Advantages and Disadvantages Compared to WLP and FO-WLP 220
9.3.4 Future Applications 222
9.3.5 Limitations of C2iM-PLP 222
9.4 Manufacturing Process Flow and BOM 223
9.5 Design Features 224
9.5.1 Package Design Rules 224
9.5.2 Design Rules for Die UBM 224
9.5.3 Design Rules for Die Side by Side 225
9.5.4 Design Rules for Cu Pillar 226
9.6 System Integration Capability 227
9.7 Manufacturing Format and Scalability 228
9.8 Package Performance 228
9.8.1 Electrical Performance 228
9.8.2 Thermal Performance 229
9.9 Robustness and Reliability Data 229
9.9.1 Automotive Reliability Certification Pass 229
9.9.2 Board Level Reliability Verification Pass 230
9.10 Electrical Test Considerations 230
9.11 Summary 231
References 231
10 Flexible Hybrid Electronics Using Fan-Out Wafer-Level Packaging 233
Subramanian S. Iyer and Arsalan Alam
10.1 Introduction 233
10.2 Recent Trends in Packaging 239
10.3 FHE Using FO-WLP - FlexTrateTM 242
10.4 Applications on FlexTrateTM 250
Acknowledgments 256
References 256
11 Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations 261
Ting Zheng, Ankit Kaul, Sreejith Kochupurackal Rajan, and Muhannad S. Bakir
11.1 Introduction 261
11.2 Heterogeneous Interconnect Stitching Technology (HIST) 262
11.3 Thermal Evaluation of 2.5D Integration Using Bridge-Chip Technology 270
11.3.1 2.5D and 3D Benchmark Architectures 270
11.3.1.1 2.5D Integration 270
11.3.1.2 3D Integration 271
11.3.2 Thermal Modeling and Specifications 272
11.3.3 Comparison of Different 2.5D Integration Schemes 273
11.3.4 Thermal Comparison between 2.5D and 3D Integration 273
11.3.5 Thermal Study of Bridge-Chip 2.5D Integration 274
11.3.5.1 Impact of TIM conductivity 274
11.3.5.2 Die Thickness 275
11.3.5.3 Die Spacing 275
11.3.6 Polylithic 3D Integration 275
11.4 Monolithic Microfluidic Cooling of High-Power Electronics 276
11.4.1 Experimental Demonstration and Characterization on Single Die Systems 277
11.4.2 Microfluidic Cooling of 2.5D Devices: Experimental Demonstration 279
11.4.3 Monolithic Microfluidic Cooling of 3D Integration: Modelling Electrical Implications for I/Os 281
11.5 Conclusion 283
Acknowledgments 283
References 283
Index 289
