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Taiwan IC Packaging and Testing Industry, 2Q 2023

  • Report

  • 8 Pages
  • June 2023
  • Region: Taiwan
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5847325
This research report provides a forecast of the shipment value for the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry in the first half of 2023, along with a review of the recent quarters from 4Q 2020 to 4Q 2023. The report also includes a breakdown of the shipment value by customer origin and service type. The survey conducted for this research involved major OSAT companies in Taiwan, namely ASE, PTI, KYEC, Siguard, and Ardentec. The content of the report is based on primary data collected through onsite research and publicly available information.

Table of Contents

  • Taiwan IC Packaging and Testing Industry Shipment Value, 4Q 2020-3Q 2023
  • Taiwan IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2020-3Q 2023
  • Taiwan IC Packaging Industry Shipment Value, 4Q 2020-3Q 2023
  • Taiwan IC Testing Industry Shipment Value, 4Q 2020-3Q 2023
  • Taiwan IC Packaging Industry Shipment Value Rankings, 4Q 2020-1Q 2023
  • Taiwan IC Packaging Industry Shipment Value by Vendors' Tier, 4Q 2020-1Q 2023
  • Taiwan IC Testing Industry’s Shipment Value Rankings, 4Q 2020-1Q 2023
  • Taiwan IC Testing Industry Shipment Value by Vendors' Tier, 4Q 2020-1Q 2023
  • Taiwan IC Packaging Industry Shipment Value by Customers' Origin, 4Q 2020-1Q 2023
  • Taiwan IC Packaging Industry Shipment Value Share by Customers' Origin, 4Q 2020-1Q 2023
  • Taiwan IC Testing Industry Shipment Value by Customers' Origin, 4Q 2020-1Q 2023
  • Taiwan IC Testing Industry Shipment Value Share by Customers' Origin, 4Q 2020-1Q 2023
  • Exchange Rate, 4Q 2020-4Q 2022

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Ardentec
  • ASE
  • Chipbond
  • ChipMOS
  • FATC
  • KYEC
  • OSE
  • PTI
  • Sigurd
  • Walton
  • Youngtek Electronic

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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