The chemical mechanical polishing market size is expected to see strong growth in the next few years. It will grow to $9.17 billion in 2030 at a compound annual growth rate (CAGR) of 7.7%. The growth in the forecast period can be attributed to increasing adoption of advanced logic and memory chips, rising demand for compound semiconductors, expansion of emerging semiconductor technologies, growing focus on defect reduction, increasing investments in semiconductor fabs. Major trends in the forecast period include increasing adoption of advanced cmp slurries, rising demand for high-precision planarization, growing use in leading-edge semiconductor nodes, expansion of consumables optimization technologies, enhanced focus on yield improvement.
The expansion in the consumer electronics industry is expected to propel the growth of the chemical mechanical polishing market going forward. Consumer electronics refer to devices such as smartphones, tablets, laptops, TVs, gaming consoles, and wearables that are purchased for personal rather than commercial use. This industry’s expansion is primarily driven by population growth, rising incomes, urbanization, and increasing demand for connectivity and mobility. CMP supports this growth by enabling the production of advanced electronic components with high precision and accuracy. For example, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, total consumer electronic equipment production in Japan reached $209.16 million (¥32,099 million), up from $164.65 million (¥25,268 million) in May 2022. Therefore, the expansion in the consumer electronics industry is driving the growth of the chemical mechanical polishing market.
Major companies operating in the chemical mechanical polishing (CMP) market are focusing on developing advanced slurry formulations, such as bonding CMP slurry introduction, to enhance AI semiconductor integration. Bonding CMP slurry introduction refers to the deployment of a chemical-mechanical planarization slurry specifically designed for polishing and planarizing bonding surfaces in semiconductor hybrid bonding processes. For instance, in September 2025, FUJIFILM Corporation, a Japan-based manufacturer of semiconductor process materials, introduced a CMP slurry for advanced packaging that addresses key challenges in hybrid bonding for AI semiconductors. The slurry features a refined blend of abrasives, additives, and corrosion inhibitors to achieve high-precision planarization of bonding surfaces where copper and oxide films coexist. It supports the integration of multiple semiconductor chips into a single package, ensures exceptionally flat surfaces, reduces defects, and enhances device reliability - making it ideal for improving AI semiconductor performance and enabling advanced packaging applications.
In October 2023, Fujifilm, a Japan-based provider of photographic, imaging, and high-purity chemical solutions for the semiconductor and other high-tech industries, acquired Entegris’s Electronic Chemicals business for US$700 million in cash. This acquisition enables Fujifilm to expand its product portfolio and strengthen its global supply and manufacturing capabilities in high-purity process chemicals for the semiconductor sector. Entegris’s Electronic Chemicals business is a US-based provider of high-purity chemical solutions for semiconductor and high-tech manufacturing processes.
Major companies operating in the chemical mechanical polishing market are Ebara Corporation, Applied Materials Inc., Cabot Microelectronics Corporation, Lapmaster Wolters GmbH, Fujimi Incorporated, CMC Materials Inc., Hitachi Chemical Company Ltd., Badische Anilin- und Sodafabrik SE, Revasum Inc., Versum Materials Inc., Evonik Industries AG, Asahi Glass Corporation, DuPont de Nemours Inc., Ferro Corporation, 3A Composites India Private Limited, HKC Vietnam Company Limited, Logitech International SA, Tianjin Huahaiqingke, Tokyo Seimitsu Co. Ltd., K.C. Tech Co. Ltd., IV Technologies Inc., Merck Group, Solvay S.A., Air Products and Chemicals Inc., Entegris Inc., Okamoto Corporation, Compagnie de Saint-Gobain S.A., Dow Inc., LAM Research Corporation.
Asia-Pacific was the largest region in the chemical mechanical polishing market in 2025. The regions covered in the chemical mechanical polishing market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the chemical mechanical polishing market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The chemical mechanical polishing (CMP) market consists of sales of polishing equipment, slurries, pads, and other related products. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Chemical Mechanical Polishing Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses chemical mechanical polishing market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for chemical mechanical polishing? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The chemical mechanical polishing market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Report Scope
Markets Covered:
1) By Type: CMP Equipment; CMP Consumable; Slurry; PAD; PAD Conditioner; Other Consumable Types2) By Equipment: Polishing and Grinding; Slurry Testing
3) By Technology: Leading Edge; More than Moore's; Emerging
4) By Application: Compound Semiconductors; Integrated Circuits; MEMS (microelectromechanical systems) and NEMS (nanoelectromechanical systems); Other Applications
Subsegments:
1) By CMP Equipment: Single-Station CMP Equipment; Multi-Station CMP Equipment; Inline CMP Equipment2) By CMP Consumable: Slurry Filters; Polishing Pads; CMP Tools
3) By Slurry: Oxide Slurry; Non-Oxide Slurry; Advanced Slurry Systems
4) By PAD: Standard Polishing Pads; Advanced Polishing Pads; Specialized Polishing Pads
5) By PAD Conditioner: Mechanical Pad Conditioners; Chemical Pad Conditioners
6) By Other Consumable Types: Cleaning Agents; Dressing Tools; Other Related Consumables
Companies Mentioned: Ebara Corporation; Applied Materials Inc.; Cabot Microelectronics Corporation; Lapmaster Wolters GmbH; Fujimi Incorporated; CMC Materials Inc.; Hitachi Chemical Company Ltd.; Badische Anilin- und Sodafabrik SE; Revasum Inc.; Versum Materials Inc.; Evonik Industries AG; Asahi Glass Corporation; DuPont de Nemours Inc.; Ferro Corporation; 3A Composites India Private Limited; HKC Vietnam Company Limited; Logitech International SA; Tianjin Huahaiqingke; Tokyo Seimitsu Co. Ltd.; K.C. Tech Co. Ltd.; IV Technologies Inc.; Merck Group; Solvay S.a.; Air Products and Chemicals Inc.; Entegris Inc.; Okamoto Corporation; Compagnie de Saint-Gobain S.a.; Dow Inc.; LAM Research Corporation
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Chemical Mechanical Polishing market report include:- Ebara Corporation
- Applied Materials Inc.
- Cabot Microelectronics Corporation
- Lapmaster Wolters GmbH
- Fujimi Incorporated
- CMC Materials Inc.
- Hitachi Chemical Company Ltd.
- Badische Anilin- und Sodafabrik SE
- Revasum Inc.
- Versum Materials Inc.
- Evonik Industries AG
- Asahi Glass Corporation
- DuPont de Nemours Inc.
- Ferro Corporation
- 3A Composites India Private Limited
- HKC Vietnam Company Limited
- Logitech International SA
- Tianjin Huahaiqingke
- Tokyo Seimitsu Co. Ltd.
- K.C. Tech Co. Ltd.
- IV Technologies Inc.
- Merck Group
- Solvay S.A.
- Air Products and Chemicals Inc.
- Entegris Inc.
- Okamoto Corporation
- Compagnie de Saint-Gobain S.A.
- Dow Inc.
- LAM Research Corporation
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 6.81 Billion |
| Forecasted Market Value ( USD | $ 9.17 Billion |
| Compound Annual Growth Rate | 7.7% |
| Regions Covered | Global |
| No. of Companies Mentioned | 30 |


