Envelope Tracking Chip Global Market Report 2024

The envelope tracking chip market has grown rapidly in recent years. It will grow from $2.06 billion in 2023 to $2.29 billion in 2024 at a compound annual growth rate (CAGR) of 11.0%. The expansion witnessed in the historical period can be attributed to the widespread adoption of mobile devices, advancements in network technologies, increasing consumer demand for extended battery life, ongoing trends in miniaturization, and the escalating challenges related to power consumption.

The envelope tracking chip market is expected to see strong growth in the next few years. It will grow to $3.34 billion in 2028 at a compound annual growth rate (CAGR) of 9.8%. The anticipated expansion in the forecast period can be attributed to the widespread adoption of mobile devices, advancements in network technologies, increasing consumer demand for extended battery life, ongoing trends in miniaturization, and the escalating challenges related to power consumption. Major trends expected in the forecast period include the emergence of Gan technology, the emphasis on compact and lightweight designs, a focus on energy-efficient networks, research and development for advanced semiconductor materials, and a competitive market landscape driving innovation.

Anticipated significant growth in the electronics industry is poised to drive the envelope tracking chip market forward. The electronics industry encompasses the design, development, production, and sale of electronic components, devices, and systems, including consumer electronics, telecommunications equipment, computers, semiconductors, and industrial electronics. Envelope tracking chips play a crucial role in electronic devices such as mobile devices, wearables, and IoT devices. They extend battery life and enhance overall performance by optimizing power amplifiers in mobile devices for maximum efficiency, reducing energy waste, and improving battery life. For instance, as of March 2023, Australia's electrical and electronic equipment exports totaled $3.56 billion in 2022, according to the United Nations COMTRADE database. Additionally, India's electronic goods exports surged by almost 88% from $6600 million in 2013-14 to $12,400 million in 2021-22, as reported in February 2022. Therefore, the growth in the electronics industry is a driving force behind the envelope tracking chip market.

The burgeoning defense industry is expected to fuel the growth of the advanced materials market. Envelope tracking chips are integral in enhancing the efficiency and performance of communication systems in electronic warfare and radar applications within the defense sector. The defense sector is responsible for the planning, development, procurement, deployment, and maintenance of military capabilities. For instance, in November 2022, the Airspace Industries Association (AIA), a US-based trade association, reported that the aerospace and defense (A&D) industry generated $892 billion in combined sales in 2021, reflecting a 2.1 percent increase over the previous year. Additionally, exports from the A&D sector experienced an 11.2 percent increase, reaching $100.4 billion, according to the same source. Therefore, the growing defense industry is a key driver for the growth of the advanced materials market.

Technological advancements stand out as a prominent trend gaining traction in the envelope tracking chip market. Leading companies within the envelope tracking chip market are actively engaged in developing cutting-edge technological solutions to fortify their market positions. For instance, in November 2022, MediaTek, a Taiwan-based manufacturer of fabless semiconductor products, introduced a 4nm T800 chipset designed to deliver ultra-fast 5G speeds for both sub-6 GHz and mm-Wave 5G networks. This innovative chipset utilizes 5G UltraSave power-efficiency technology, optimizing battery life across all 5G connections. The T800 chipset integrates a thin modem, 3GPP Release-16 5G cellular modem, FR1 transceivers, an envelope tracking (ET) chip, an MLNA, a GNSS receiver, and associated PMICs.

Prominent companies operating in the envelope tracking chip market are actively involved in creating groundbreaking solutions, such as the Snapdragon X35 5G Modem-RF System featuring Qualcomm QET5100 Envelope Tracking, to drive the global expansion of 5G RedCap. Qualcomm QET5100 Envelope Tracking is a power management technology that enhances the efficiency of the power amplifier in a mobile device by dynamically adjusting the voltage supplied to the power amplifier based on the instantaneous signal envelope. For example, in February 2023, Qualcomm Incorporated, a US-based semiconductor manufacturer, integrated the QET5100 envelope tracking technology into Qualcomm's Snapdragon X35 5G modem-RF system, marking the world's first 5G NR-Light modem-RF system. The QET5100 envelope tracking technology collaborates with the modem to deliver power-efficient performance while upholding high RF performance.

In September 2021, Murata Manufacturing Co. Ltd., a Japan-based manufacturer of electronic components and modules, acquired Eta Wireless Inc. for an undisclosed amount. Through this acquisition, Murata Manufacturing Co. Ltd. aims to provide superior RF products by combining its electronic components and design techniques with Eta Wireless' Digital Envelope Tracking Technology. This strategic combination addresses critical power and thermal challenges for 5G and extends battery life for the next generation of mobile devices. Eta Wireless, based in the US, specializes in manufacturing power management ICs.

Major companies operating in the envelope tracking chip market report are Analog Devices Inc., Broadcom Inc., Efficient Power Conversion Corporation, Keysight Technologies Inc., MediaTek Inc., Qorvo Inc., Qualcomm Incorporated., R2 Semiconductor Inc., Skyworks Solutions Inc., Texas Instruments Incorporated., Maxim Integrated Products Inc., Linear Technology Corporation, Artesyn Embedded Technologies Inc., TriQuint Semiconductor Inc., Nujira Ltd., Samsung Electronics Co. Ltd., NXP Semiconductors N.V., Infineon Technologies AG, STMicroelectronics N.V., MACOM Technology Solutions Holdings Inc., Murata Manufacturing Co. Ltd., TDK Corporation, Taiyo Yuden Co. Ltd., Integrated Device Technology Inc., Microchip Technology Inc., Renesas Electronics Corporation, Toshiba Corporation, Fujitsu Limited, ROHM Semiconductor, ON Semiconductor Corporation.

North America was the largest region in the envelope tracking chip market in 2023. Asia-Pacific is expected to be the fastest-growing region in the global envelope tracking chip market report during the forecast period. The regions covered in the envelope tracking chip market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the envelope tracking chip market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The primary technology types of envelope tracking chips include cellular communications, wireless communications, and satellite communications. Cellular communications pertain to the technology enabling the use of mobile phones for communication purposes. Various applications encompass smartphones, wearable devices, and others, spanning industries such as telecommunications, healthcare, consumer electronics, defense, automotive, among others.

The envelope tracking chip market research report provides envelope tracking chip market statistics, including envelope tracking chip industry global market size, regional shares, competitors with an envelope tracking chip market share, detailed envelope tracking chip market segments, market trends and opportunities, and any further data you may need to thrive in the envelope tracking chip industry. This envelope tracking chip market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The envelope tracking chip market consists of revenues earned by entities by providing power management services to improve energy efficiency, extend battery life, and enhance overall device performance. The market value includes the value of related goods sold by the service provider or included within the service offering. The envelope tracking chip market also includes sales of standalone ET chips, integrated ET modules, and multi-mode ET chips. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.


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