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Asia Pacific High-Density Interconnect (HDI) PCB Market Size, Share & Industry Trends Analysis Report By End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications), By Application, By Country and Growth Forecast, 2023 - 2030

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    Report

  • 109 Pages
  • July 2023
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5868831
The Asia Pacific High-Density Interconnect (HDI) PCB Market should witness market growth of 11.3% CAGR during the forecast period (2023-2030).

The value of commerce in the international importation of information and communications technology (ICT) items was driven by the demand for electronic components used in Internet of Things (IoT) devices. HDI technology is used by a lot of this sophisticated equipment. Businesses now track inventory and track the functioning of their equipment using electronic technologies. More and more modern machinery is equipped with smart sensors that gather usage statistics, connect to the Internet, and communicate or interact with other smart devices as well as with management to help improve operations.

Smart sensors are rapidly being installed in machines to gather usage information, communicate with smart devices, send information to management, and help optimize operations. Automobiles are advancing in connectivity and computerization, just like the rest of society. New capabilities are being added every day to the 5G technology, which is constantly developing. Therefore, it's critical for PCB makers to comprehend both the requirements for raw materials and the upgrading of equipment. It can also have a huge potential for growth to invest in the research and development of PCB assembly procedures to fulfil 5G specifications.

Several countries, including Japan, South Korea, China, and India, are notably advancing in the market due to their significant influence in technology, medical research, and power. With the ability to incorporate HDIs into diverse electrical gadgets, this region can proudly point to a booming consumer electronics industry. According to a report by the China Academy of Information and Communications Technology, China's electronics manufacturing sector expanded steadily during the first two months of 2023. The growing emphasis on healthcare and the increasing demand for cutting-edge medical technologies both contribute to the market's expansion in this region. The region's strong semiconductor sector and current R&D programs both contribute to the development and commercialization of HDIs.

The China market dominated the Asia Pacific High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,138.8 million by 2029. The Japan market is registering a CAGR of 10.6% during (2023-2030). Additionally, The India market would showcase a CAGR of 12% during (2023-2030).

Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.

Scope of the Study

By End-user

  • Consumer Electronics
  • Automotive
  • Industrial Electronics
  • IT & Telecommunications
  • Others

By Application

  • Smartphone & Tablet
  • PC & Laptop
  • Smart Wearables
  • Others

By Country

  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Key Market Players

List of Companies Profiled in the Report:

  • MEIKO ELECTRONICS CO., LTD.
  • DAP CORPORATION
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Unitech Printed Circuit Board Corp.
  • FICT LIMITED (Fujitsu Limited)
  • TTM Technologies, Inc.
  • UNIMICRON TECHNOLOGY CORP.
  • NCAB Group AB
  • Ibiden Co., Ltd.
  • Sierra Circuits, Inc.

Unique Offerings

  • Exhaustive coverage
  • The highest number of Market tables and figures
  • Subscription-based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific High-Density Interconnect (HDI) PCB Market, by End User
1.4.2 Asia Pacific High-Density Interconnect (HDI) PCB Market, by Application
1.4.3 Asia Pacific High-Density Interconnect (HDI) PCB Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.3 Porter Five Forces Analysis
Chapter 4. Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
4.1 Asia Pacific Consumer Electronics Market by Country
4.2 Asia Pacific Automotive Market by Country
4.3 Asia Pacific Industrial Electronics Market by Country
4.4 Asia Pacific IT & Telecommunications Market by Country
4.5 Asia Pacific Others Market by Country
Chapter 5. Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
5.1 Asia Pacific Smartphone & Tablet Market by Country
5.2 Asia Pacific PC & Laptop Market by Country
5.3 Asia Pacific Smart Wearables Market by Country
5.4 Asia Pacific Others Market by Country
Chapter 6. Asia Pacific High-Density Interconnect (HDI) PCB Market by Country
6.1 China High-Density Interconnect (HDI) PCB Market
6.1.1 China High-Density Interconnect (HDI) PCB Market by End User
6.1.2 China High-Density Interconnect (HDI) PCB Market by Application
6.2 Japan High-Density Interconnect (HDI) PCB Market
6.2.1 Japan High-Density Interconnect (HDI) PCB Market by End User
6.2.2 Japan High-Density Interconnect (HDI) PCB Market by Application
6.3 India High-Density Interconnect (HDI) PCB Market
6.3.1 India High-Density Interconnect (HDI) PCB Market by End User
6.3.2 India High-Density Interconnect (HDI) PCB Market by Application
6.4 South Korea High-Density Interconnect (HDI) PCB Market
6.4.1 South Korea High-Density Interconnect (HDI) PCB Market by End User
6.4.2 South Korea High-Density Interconnect (HDI) PCB Market by Application
6.5 Singapore High-Density Interconnect (HDI) PCB Market
6.5.1 Singapore High-Density Interconnect (HDI) PCB Market by End User
6.5.2 Singapore High-Density Interconnect (HDI) PCB Market by Application
6.6 Malaysia High-Density Interconnect (HDI) PCB Market
6.6.1 Malaysia High-Density Interconnect (HDI) PCB Market by End User
6.6.2 Malaysia High-Density Interconnect (HDI) PCB Market by Application
6.7 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market
6.7.1 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
6.7.2 Rest of Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
Chapter 7. Company Profiles
7.1 MEIKO ELECTRONICS CO., LTD.
7.1.1 Company Overview
7.1.2 SWOT Analysis
7.2 DAP CORPORATION
7.2.1 Company Overview
7.2.2 SWOT Analysis
7.3 Unitech Printed Circuit Board Corp.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 SWOT Analysis
7.4 FICT LIMITED (Fujitsu Limited)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expenses
7.4.5 SWOT Analysis
7.5 UNIMICRON TECHNOLOGY CORP.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 SWOT Analysis
7.6 NCAB Group AB
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 SWOT Analysis
7.7 Ibiden Co., Ltd.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental Analysis
7.7.4 Research & Development Expenses
7.7.5 SWOT Analysis
7.8 Sierra Circuits, Inc.
7.8.1 Company Overview
7.8.2 SWOT Analysis
7.9 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 SWOT Analysis
7.10. TTM Technologies, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 SWOT Analysis

Companies Mentioned

  • MEIKO ELECTRONICS CO., LTD.
  • DAP CORPORATION
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Unitech Printed Circuit Board Corp.
  • FICT LIMITED (Fujitsu Limited)
  • TTM Technologies, Inc.
  • UNIMICRON TECHNOLOGY CORP.
  • NCAB Group AB
  • Ibiden Co., Ltd.
  • Sierra Circuits, Inc.

Methodology

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