The Asia Pacific High-Density Interconnect (HDI) PCB Market should witness market growth of 11.3% CAGR during the forecast period (2023-2030).
The value of commerce in the international importation of information and communications technology (ICT) items was driven by the demand for electronic components used in Internet of Things (IoT) devices. HDI technology is used by a lot of this sophisticated equipment. Businesses now track inventory and track the functioning of their equipment using electronic technologies. More and more modern machinery is equipped with smart sensors that gather usage statistics, connect to the Internet, and communicate or interact with other smart devices as well as with management to help improve operations.
Smart sensors are rapidly being installed in machines to gather usage information, communicate with smart devices, send information to management, and help optimize operations. Automobiles are advancing in connectivity and computerization, just like the rest of society. New capabilities are being added every day to the 5G technology, which is constantly developing. Therefore, it's critical for PCB makers to comprehend both the requirements for raw materials and the upgrading of equipment. It can also have a huge potential for growth to invest in the research and development of PCB assembly procedures to fulfil 5G specifications.
Several countries, including Japan, South Korea, China, and India, are notably advancing in the market due to their significant influence in technology, medical research, and power. With the ability to incorporate HDIs into diverse electrical gadgets, this region can proudly point to a booming consumer electronics industry. According to a report by the China Academy of Information and Communications Technology, China's electronics manufacturing sector expanded steadily during the first two months of 2023. The growing emphasis on healthcare and the increasing demand for cutting-edge medical technologies both contribute to the market's expansion in this region. The region's strong semiconductor sector and current R&D programs both contribute to the development and commercialization of HDIs.
The China market dominated the Asia Pacific High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,138.8 million by 2029. The Japan market is registering a CAGR of 10.6% during (2023-2030). Additionally, The India market would showcase a CAGR of 12% during (2023-2030).
Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
The value of commerce in the international importation of information and communications technology (ICT) items was driven by the demand for electronic components used in Internet of Things (IoT) devices. HDI technology is used by a lot of this sophisticated equipment. Businesses now track inventory and track the functioning of their equipment using electronic technologies. More and more modern machinery is equipped with smart sensors that gather usage statistics, connect to the Internet, and communicate or interact with other smart devices as well as with management to help improve operations.
Smart sensors are rapidly being installed in machines to gather usage information, communicate with smart devices, send information to management, and help optimize operations. Automobiles are advancing in connectivity and computerization, just like the rest of society. New capabilities are being added every day to the 5G technology, which is constantly developing. Therefore, it's critical for PCB makers to comprehend both the requirements for raw materials and the upgrading of equipment. It can also have a huge potential for growth to invest in the research and development of PCB assembly procedures to fulfil 5G specifications.
Several countries, including Japan, South Korea, China, and India, are notably advancing in the market due to their significant influence in technology, medical research, and power. With the ability to incorporate HDIs into diverse electrical gadgets, this region can proudly point to a booming consumer electronics industry. According to a report by the China Academy of Information and Communications Technology, China's electronics manufacturing sector expanded steadily during the first two months of 2023. The growing emphasis on healthcare and the increasing demand for cutting-edge medical technologies both contribute to the market's expansion in this region. The region's strong semiconductor sector and current R&D programs both contribute to the development and commercialization of HDIs.
The China market dominated the Asia Pacific High-Density Interconnect (HDI) PCB Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,138.8 million by 2029. The Japan market is registering a CAGR of 10.6% during (2023-2030). Additionally, The India market would showcase a CAGR of 12% during (2023-2030).
Based on End-user, the market is segmented into Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications and Others. Based on Application, the market is segmented into Smartphone & Tablet, PC & Laptop, Smart Wearables and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include MEIKO ELECTRONICS CO., LTD., DAP CORPORATION, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Unitech Printed Circuit Board Corp., FICT LIMITED (Fujitsu Limited), TTM Technologies, Inc., UNIMICRON TECHNOLOGY CORP., NCAB Group AB, Ibiden Co., Ltd. and Sierra Circuits, Inc.
Scope of the Study
By End-user
- Consumer Electronics
- Automotive
- Industrial Electronics
- IT & Telecommunications
- Others
By Application
- Smartphone & Tablet
- PC & Laptop
- Smart Wearables
- Others
By Country
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
Key Market Players
List of Companies Profiled in the Report:
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
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- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Asia Pacific High-Density Interconnect (HDI) PCB Market by End User
Chapter 5. Asia Pacific High-Density Interconnect (HDI) PCB Market by Application
Chapter 6. Asia Pacific High-Density Interconnect (HDI) PCB Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- MEIKO ELECTRONICS CO., LTD.
- DAP CORPORATION
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Unitech Printed Circuit Board Corp.
- FICT LIMITED (Fujitsu Limited)
- TTM Technologies, Inc.
- UNIMICRON TECHNOLOGY CORP.
- NCAB Group AB
- Ibiden Co., Ltd.
- Sierra Circuits, Inc.
Methodology
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