1h Free Analyst Time
The wafer fab equipment (wfe) market is forecasted to grow by USD 31.6 billion during 2023-2028, accelerating at a CAGR of 6.03% during the forecast period. The report on the wafer fab equipment (wfe) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for consumer electronics, increasing use of semiconductor chips in various industries, and shift from traditional silicon-based technologies to advanced technologies.
The wafer fab equipment (wfe) market is segmented as below:
By Technology
- Automatic layer deposition
- Chemical vapor diposition
- Etching
- Oxidation
- Others
By End-user
- Foundry
- Memory
- Integrated device manufacturer
By Geographical Landscape
- APAC
- North America
- Europe
- Middle East and Africa
- South America
The report on the wafer fab equipment (wfe) market covers the following areas:
- Wafer fab equipment (wfe) market sizing
- Wafer fab equipment (wfe) market forecast
- Wafer fab equipment (wfe) market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.
Table of Contents
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Technology
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Opportunity/Restraints
11 Competitive Landscape
12 Competitive Analysis
13 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global wafer fab equipment (wfe) market: AIXTRON SE, Applied Materials Inc., ASM International NV, ASML, ASMPT Ltd., Baxter International Inc., EV Group, FormFactor Inc., Hanmi Semiconductor Co. Ltd., Hitachi Ltd., HORIBA Ltd., KLA Corp., KOKUSAI ELECTRIC CORP., Lam Research Corp., Nikon Corp., PLASMA THERM, Screen Holdings Co. Ltd, Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., and Tokyo Electron Ltd..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is technological advancements in semiconductor industry."
According to the report, one of the major drivers for this market is the growing demand for consumer electronics.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AIXTRON SE
- Applied Materials Inc.
- ASM International NV
- ASML
- ASMPT Ltd.
- Baxter International Inc.
- EV Group
- FormFactor Inc.
- Hanmi Semiconductor Co. Ltd.
- Hitachi Ltd.
- HORIBA Ltd.
- KLA Corp.
- KOKUSAI ELECTRIC CORP.
- Lam Research Corp.
- Nikon Corp.
- PLASMA THERM
- Screen Holdings Co. Ltd
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Teradyne Inc.
- Tokyo Electron Ltd.