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The wafer fab equipment (WFE) market is forecasted to grow by USD 34.7 billion during 2024-2029, accelerating at a CAGR of 6.2% during the forecast period. The report on the wafer fab equipment (WFE) market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.Speak directly to the analyst to clarify any post sales queries you may have.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for consumer electronics, increasing use of semiconductor chips in various industries, and shift from traditional silicon-based technologies to advanced technologies.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market size data, segment with regional analysis and vendor landscape in addition to an analysis of the key companies. Reports have historic and forecast data.
The wafer fab equipment (WFE) market is segmented as below:
By Technology
- Automatic layer deposition
- Chemical vapor diposition
- Etching
- Oxidation
- Others
By End-user
- Foundry
- Memory
- Integrated device manufacturer
By Capacity
- 300 mm wafer size
- 200 mm wafer size
- 150 mm wafer size
By Product Specification
- Node size between 14nm and 28nm
- Node size between 7nm and 14nm
- Node size more than 28nm
- Node size between 5nm and 7nm
- Node size below 5nm
By Geographical Landscape
- APAC
- North America
- Europe
- Middle East and Africa
- South America
The report on the wafer fab equipment (WFE) market covers the following areas:
- Wafer Fab Equipment (WFE) Market sizing
- Wafer Fab Equipment (WFE) Market forecast
- Wafer Fab Equipment (WFE) Market industry analysis
The report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive primary and secondary research. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.
Table of Contents
1 Executive Summary
2 Market Analysis
3 Market Landscape
4 Market Sizing
5 Historic Market Size
6 Qualitative Analysis
7 Five Forces Analysis
8 Market Segmentation by Technology
9 Market Segmentation by End-user
10 Market Segmentation by Capacity
300 mm wafer size - Market size and forecast 2024-2029
200 mm wafer size - Market size and forecast 2024-2029
150 mm wafer size - Market size and forecast 2024-2029
11 Market Segmentation by Product Specification
12 Customer Landscape
13 Geographic Landscape
14 Drivers, Challenges, and Opportunity/Restraints
15 Competitive Landscape
16 Competitive Analysis
17 Appendix
List of Exhibits
Executive Summary
The following companies are recognized as the key players in the global wafer fab equipment (WFE) market: AIXTRON SE, Applied Materials Inc., ASM International NV, ASML, ASMPT Ltd., Baxter International Inc., EV Group, FormFactor Inc., Hanmi Semiconductor Co. Ltd., Hitachi Ltd., HORIBA Ltd., KLA Corp., KOKUSAI ELECTRIC CORP, Lam Research Corp., Nikon Corp., PLASMA THERM, Screen Holdings Co. Ltd, Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., and Tokyo Electron Ltd..Commenting on the report, an analyst from the research team said: "The latest trend gaining momentum in the market is technological advancements in semiconductor industry."
According to the report, one of the major drivers for this market is the growing demand for consumer electronics.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- AIXTRON SE
- Applied Materials Inc.
- ASM International NV
- ASML
- ASMPT Ltd.
- Baxter International Inc.
- EV Group
- FormFactor Inc.
- Hanmi Semiconductor Co. Ltd.
- Hitachi Ltd.
- HORIBA Ltd.
- KLA Corp.
- KOKUSAI ELECTRIC CORP
- Lam Research Corp.
- Nikon Corp.
- PLASMA THERM
- Screen Holdings Co. Ltd
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Teradyne Inc.
- Tokyo Electron Ltd.