5G PCB Market - Forecasts from 2023 to 2028

The 5G PCB market is expected to grow at a CAGR of 8.63%, from US$27.189 billion in 2022 to US$44.670 billion in 2028.

GROWTH DRIVERS

The 5G PCB industry is the market for printed circuit boards (PCBs) utilized in 5G applications. PCBs are the essential carriers/circuit boards to transport and link components and integrated circuits (ICs) in all electronic goods. The frequency and data rates of 5G PCBs are higher than those of earlier generations of PCBs. The rising need for connected devices like tablets and smartphones, cloud applications, automotive electronics, and communication systems are some of the major drivers propelling the development of the 5G PCB market.

For instance, according to the insights released by the Ministry of Finance, Japan, the exports value of industrial electronic equipment in Japan was 96,068 million yen in 2019, 108,647 million yen in 2020, 113,109 million yen in 2021, 116,091 million yen in 2022, and 148,213 million yen in 2023. The increasing export value of industrial electronic equipment in Japan, specifically in the years mentioned, indicates a positive trend, and it indicates potential progress for the 5G PCB (Printed Circuit Board) market. As 5G technology expands globally, the demand for electronic equipment, including PCBs, that support high-speed and reliable communication increases. The rising export value suggests that Japanese manufacturers are experiencing growth in supplying industrial electronic equipment, including PCBs, to meet the demand for 5G infrastructure and devices. This indicates a promising outlook for the 5G PCB market, as it aligns with the increasing adoption and implementation of 5G technology worldwide.

EMERGING OPPORTUNITIES IN THE GLOBAL 5G PCB MARKET

TELECOMMUNICATION AND CONSUMER ELECTRONICS

The 5G technology has played a major role in boosting the telecommunication sector across the globe. The commercialization of 5G, the growth of end-use industries like consumer electronics, telecommunication, automotive, and industrial, the rise in demand for communication systems and connected devices, and the introduction of new substrate materials and HDI PCBs are all growth drivers for the 5G PCB market. Active efforts by various market players can be seen as a result of their recognition of smarter and more flexible technologies.

By application, the 5G PCB market is segmented into automotive, telecommunication, consumer electronics, industrial, and others. The telecommunication and consumer electronics segments are anticipated to benefit from the increasing demand for connected devices and from the commercialization of 5G networks and the expansion of communication infrastructure that requires 5G PCBs for applications. For instance,

• In June 2021, Cadence introduced the Allegro X Design Platform, the industry's first system design engineering platform that combines schematic, layout, analysis, design collaboration, and data management for 5G PCBs. The 5G PCB market will gain from Cadence's Allegro X Design Platform by allowing quicker and more effective design cycles, better quality and dependability, and decreased costs and risks for complex 5G PCBs. Cadence will support 5G PCB designers by integrating schematic, layout, analysis, design collaboration, and data management into a single platform to optimize performance, power, and signal integrity across many domains and technologies.
• In April 2020, Shin-Etsu Chemical introduced the SQX Series, an innovative product line for 5G communications. 5G PCBs necessitate a larger layer count, finer line standard, higher-performance HDI PCBs, and innovative substrate materials such as quartz cloth. The SQX Series properties make it suited as a basis material for 5G PCBs that demand high-speed and low-latency data transmission. As a result, the introduction of Quartz Cloth (SQX Series) products could help the 5G PCB industry by giving 5G PCB manufacturers a competitive edge and addressing the rising need for high-quality and highly-reliable 5G PCBs.

GEOGRAPHICAL PRESENCE

The global 5G PCB market consists of some major countries undertaking various measures to secure their 5G network across their respective nations. The United States is expected to have a higher CAGR during the forecasted period. In addition to it, a few of the major countries include Japan, South Korea, China, and Germany. The nations have undertaken various measures which have complemented the overall market growth. For instance,

• In January 2022, in the United States, Altium LLC and MacroFab, Inc. announced the launch of Altimade, the first "design WITH manufacturing" application for the electronics sector. Ultimate will facilitate quicker and more effective innovation and optimization of 5G PCBs through the integration of elastic manufacturing capabilities and real-time supply chain data on the Altium 365 cloud platform. The 5G PCB market will gain from Altimade by lowering the time and expense associated with developing and testing fresh designs that call for high-density and high-frequency components.
• In August 2021, in Japan, Hitachi Chemical announced the mass production of "MCL-HS200" printed wiring board material that is 5G compatible. Hitachi Chemical's introduction of 5G compatible MCL-HS200 will promote the 5G PCB market by giving a competitive advantage in the global market for 5G-compatible printed circuit board materials. MCL-HS200 is a low transmission loss, low warpage material capable of supporting greater frequencies and data rates, as well as complicated antenna designs and beamforming techniques required for 5G communication.

MAJOR PLAYERS IN THE MARKET

Some of the leading players in the market include PCBMay, Epec, and Jagrat RF Solutions, among others. The product offerings of the major corporation include the following:

• PCBMay's 20 layer PCBs are a dependable and affordable choice for customers who require complicated circuit boards with good performance for a variety of applications. 20-layer PCBs' attributes, advantages, and services, such as their thickness, tolerance, suitability, quality, delivery, and customization.
• The Teflon Rogers CTLE-AT (9-LAYER) is a premium PCB that combines Rogers material with ENIG finishing to deliver the best performance and dependability for RF and microwave applications. The product comprises nine layers of TeflonTM and copper that together offer good dimensional stability, great thermal stability, and low loss. The product can be used in a variety of fields that need sophisticated PCBs, including telecommunications, defense, space, and medical equipment.
• HDI Boards by Epec is a PCB that achieves high wiring density and high pad density through the utilization of micro-vias and thin gaps. For a variety of applications that call for high speed, high frequency, high density, and high reliability, the device can provide advantages such as improved electrical performance, decreased weight and space, and increased reliability. Depending on the quantity and complexity of the layers, the product may have different types of via structures.
• PCB Trace Technologies Inc offers Smart Card. The smart card is a PCB that achieves high-density connections by using thin and flexible material and small vias. The product employs ENIG for gold plating and features two layers of copper and a solder mask on each side. It features a very thin 0.09T thickness and a tiny 0.1 drill size. The product is employed in numerous tiny applications, including camera modules and earphone jacks.

SEGMENTATION

The global 5G PCB market has been analyzed through the following segments:

By Type

• Single-sided
• Double-sided
• Multi-layered
• High-density Interconnect (HDI)
• Others

By Substrate

• Rigid
• Flexible
• Rigid-Flexible

By End Use Industry

• Automotive
• Telecommunication
• Consumer Electronics
• Industrial
• Others

By Geography

• Americas
• USA
• Others
• EMEA
• Germany
• UK
• Others
• APAC
• China
• Japan
• South Korea
• Others