3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS)

The 3D stacking market is projected to reach USD 3.1 billion by 2028 from USD 1.2 billion in 2023, at a CAGR of 20.4% from 2023 to 2028. The major opportunities that are expected to drive the market growth of the 3D stacking market include growing adoption of high-bandwidth memory (HBM) devices and integration of advanced electronics within the automotive industry

Increasing demand for high-performance computing and energy-efficient Logics ICs

Logic Integrated Circuits (ICs) are an integral component of digital electronics, facilitating computational operations and decision-making processes within electronic devices. In 3D stacking, Logic ICs play a crucial role in enhancing computational efficiency and reducing footprint. The increasing demand for high-performance computing and energy-efficient devices has fueled the growth of 3D stacking in logic ICs. As consumer expectations for faster and more reliable electronic devices continue to rise, 3D stacking enables a significant increase in computational capabilities within a smaller physical footprint.

Need for enhanced performance and miniaturization in electronic applications to drive market growth for hybrid bonding

The process of hybrid bonding involves several key steps, starting with the preparation and creation of pre-bonding layers. These layers are crucial to ensuring a successful bond. The bonding process itself, characterized by the fusion of semiconductor wafers, is followed by a post-bond annealing step to enhance the bond's strength and reliability. Throughout these processes, rigorous inspection and metrology measures are in place to guarantee the quality and integrity of the bonded structures.

Rising need for advanced and compact packaging solutions in high-performance computing applications to drive market growth for wafer-to-wafer 3D Stacking

Wafer-on-Wafer (WoW) is a 3D integration method that involves bonding and stacking two or more complete wafers, each containing semiconductor devices or chips, to create a vertically integrated structure. This method facilitates the integration of different functionalities from separate wafers, enabling enhanced performance, reduced interconnect lengths, and increased system density.

North America is expected to account for the second largest market share during the forecast period

Being home to some of the leading semiconductor companies, such as Intel Corporation (US), Texas Instruments Inc. (US), Qualcomm Incorporated (US), and Advanced Micro Devices, Inc. (US), makes the region technologically advanced. Semiconductor organizations such as Global Semiconductor Alliance (GSA) (US) and International Microelectronics and Packaging Society (IMAPS) (US) are dedicated associations for the advancement and growth of microelectronics and packaging in North America.

The break-up of the profile of primary participants in the 3D stacking market:

By Company Type: Tier 1 - 38%, Tier 2 - 28%, Tier 3 - 34%
By Designation Type: C Level - 40%, Director Level - 30% , Others - 30%
By Region Type: North America - 35%, Europe - 20%, Asia Pacific - 35%, Rest of the World - 10%

The major players of 3D stacking market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.

Research Coverage

The report segments the 3D stacking market and forecasts its size based on method, interconnecting technology, device type, end user and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall 3D stacking market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

Analysis of key drivers (Increasing focus on miniaturization and efficient space utilization in electronic devices; Cost advantage offered by 3D stacking technology is increasing its adoption; Growing demand for consumer electronics and gaming devices; Heterogeneous integration and component optimization to improve manufacturing of electronic components; 3D stacking technology to provide shorter interconnect and reduced power consumption boosting its adoption), restraints (High cost of 3D stacking technology to limit adoption; Lack of standardization governing 3D stacking technology), opportunities (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries; The integration of advanced electronics within the automotive industry), and challenges (Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries).
Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the 3D stacking market
Market Development: Comprehensive information about lucrative markets - the report analyses the 3D stacking market across varied regions
Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the 3D stacking market
Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Intel Corporation (US), Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), Amkor Technology (US) and ASE Technology Holding Co., Ltd. (Taiwan).

1 Introduction

1.1 Study Objectives
1.2 Market Definition
1.2.1 Inclusions and Exclusions
1.3 Study Scope
Figure 1 3D Stacking Market: Market Segmentation
1.3.1 Regional Scope
1.3.2 Years Considered
1.4 Currency Considered
1.5 Limitations
1.6 Stakeholders
1.7 Recession Impact

2 Research Methodology

2.1 Research Data
Figure 2 3D Stacking Market: Research Design
2.1.1 Secondary & Primary Research
2.1.2 Secondary Data
2.1.2.1 Major Secondary Sources
2.1.2.2 Secondary Sources
2.1.3 Primary Data
2.1.4 Breakdown of Primaries
2.1.4.1 Key Data from Primary Sources
2.2 Market Size Estimation
Figure 3 Process Flow of Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.1.1 Approach to Estimate Market Share by Bottom-Up Analysis (Demand Side)
Figure 4 Market Size Estimation: Bottom-Up Approach
2.2.2 Top-Down Approach
2.2.2.1 Approach to Estimate Market Share by Top-Down Analysis (Supply Side)
Figure 5 Market Size Estimation: Top-Down Approach
Figure 6 Market Size Estimation: Top-Down Approach (Supply Side) - Revenue Generated from 3D Stacking Solutions and Services
2.3 Data Triangulation
Figure 7 Data Triangulation
2.4 Research Assumptions
Table 1 Research Assumptions
2.5 Risk Assessment
2.6 Recession Impact Analysis: Parameters Considered

3 Executive Summary

Figure 8 Consumer Electronics Segment to Capture Largest Share of Market in 2028
Figure 9 Memory Devices Segment to Hold Largest Share of Market in 2028
Figure 10 3D Tsv Segment to Lead Market During Forecast Period
Figure 11 3D Stacking Market to Exhibit Highest CAGR in Asia-Pacific During Forecast Period

4 Premium Insights

4.1 Attractive Opportunities for Players in Market
Figure 12 Increasing Focus on Miniaturization and Efficient Space Utilization in Electronic Devices to Boost Market Growth
4.2 3D Stacking Market, by Method
Figure 13 Die-To-Die Segment to Hold Largest Share of Market in 2028
4.3 3D Stacking Market, by End-user
Figure 14 Automotive Segment to Register Highest CAGR from 2023 to 2028
4.4 Market, by Packaging Technology
Figure 15 3D Tsv Segment to Account for Largest Share of Market from 2023 to 2028
4.5 Market, by Device Type
Figure 16 Memory Devices Segment to Hold Largest Share of Market from 2023 to 2028
4.6 Asia-Pacific: Market, by End-user and Country
Figure 17 Consumer Electronics Segment and China Held Largest Share of Market in Asia-Pacific in 2022
4.7 3D Stacking Market, by Country
Figure 18 Taiwan to be Fastest-Growing Country-Level Market for 3D Stacking During Forecast Period

5 Market Overview

5.1 Introduction
5.2 Market Dynamics
Figure 19 3D Stacking Market: Drivers, Restraints, Opportunities, and Challenges
5.2.1 Drivers
Figure 20 Analysis of Impact of Drivers on 3D Stacking Market
5.2.1.1 Increasing Focus on Miniaturization and Efficient Space Utilization in Electronic Devices
5.2.1.2 Cost Advantage Offered by 3D Stacking Technology
5.2.1.3 Growing Demand for Consumer Electronics and Gaming Devices
Figure 21 Number of Smartphone and Mobile Phone Users Globally, 2020-2025
5.2.1.4 Unparalleled Flexibility and Customization Benefits Offered by 3D Stacking in Electronic Component Manufacturing
5.2.1.5 Reduced Power Consumption and Operational Costs Over 2D Stacking
5.2.2 Restraints
Figure 22 Analysis of Impact of Restraints on Market
5.2.2.1 Need for Substantial Upfront Investment
5.2.2.2 Lack of Standardization Governing 3D Stacking Technology
5.2.3 Opportunities
Figure 23 Analysis of Impact of Opportunities on Market
5.2.3.1 Growing Adoption of High-Bandwidth Memory (Hbm) Devices
5.2.3.2 Rapid Expansion of Semiconductor Applications Across Various Industries
5.2.3.3 Integration of Advanced Electronics into Automobiles
5.2.4 Challenges
Figure 24 Analysis of Impact of Challenges on 3D Stacking Market
5.2.4.1 Maintaining Effective Supply Chain in 3D Stacking
5.2.4.2 Designing Complexities Associated with 3D Stacking Technology
5.3 Supply Chain Analysis
Figure 25 3D Stacking Market: Supply Chain Analysis
5.4 Ecosystem Mapping
Figure 26 3D Stacking Ecosystem
5.5 Trends/Disruptions Impacting Customer Business
Figure 27 Revenue Shifts and New Revenue Pockets for Players in Market
5.6 Pricing Analysis
Table 2 Average Selling Price of 12-Inch Equivalent Wafers, 2022 (USD)
5.6.1 Average Selling Price of 12-Inch Equivalent Wafers Offered by Key Players
Figure 28 Average Selling Price of 12-Inch Wafers Equivalent Offered by Key Players
5.6.2 Average Selling Price Trend
Table 3 Average Selling Price of 12-Inch Equivalent Wafers, 2018-2022 (Usd/Thousand Units)
Figure 29 Average Selling Price of Wafers, 2018-2022
5.7 Technology Trends
5.7.1 Fan-Out Wafer-Level Packaging
5.7.2 Fan-Out Panel-Level Packaging
5.7.3 Advanced Materials
5.7.4 Monolithic 3D Integration
5.8 Porter's Five Forces Analysis
Table 4 3D Stacking Market: Porter's Five Forces Analysis
Figure 30 Porter's Five Forces Analysis
5.8.1 Threat of New Entrants
5.8.2 Threat of Substitutes
5.8.3 Bargaining Power of Suppliers
5.8.4 Bargaining Power of Buyers
5.8.5 Intensity of Competitive Rivalry
5.9 Key Stakeholders and Buying Criteria
5.9.1 Key Stakeholders in Buying Process
Figure 31 Influence of Stakeholders on Buying Process for Top Three End-users
Table 5 Influence of Stakeholders on Buying Process, by End-user (%)
5.9.2 Buying Criteria
Figure 32 Key Buying Criteria for Top Three End-users
Table 6 Key Buying Criteria, by End-user
5.10 Case Study Analysis
5.10.1 Semiconductor Wafer Producer Reduced Wafer Rejections Through Closed-Loop Monitoring
5.10.2 Spts's Drie Technology Strengthened Imec's Silicon Etch Platform
5.11 Trade Analysis
5.11.1 Import Scenario
Table 7 Import Data for Products Covered Under Hs Code 381800, by Country, 2018-2022 (USD Million)
5.11.2 Export Scenario
Table 8 Export Data for Products Covered Under Hs Code 381800, by Country, 2018-2022 (USD Million)
5.12 Patent Analysis
Table 9 Patents Related to 3D Stacking Market, 2020-2023
Figure 33 Number of Patents Granted Per Year from 2013 to 2022
Table 10 Number of Patents Related to 3D Stacking Registered in Last 10 Years
Figure 34 Top 10 Companies with Highest Number of Patent Applications in Last 10 Years
5.13 Key Conferences and Events, 2023-2025
Table 11 3D Stacking Market: Detailed List of Conferences and Events
5.14 Standards and Regulatory Landscape
5.14.1 Regulatory Bodies, Government Agencies, and Other Organizations
Table 12 North America: Regulatory Bodies, Government Agencies, and Other Organizations
Table 13 Europe: Regulatory Bodies, Government Agencies, and Other Organizations
Table 14 Asia-Pacific: Regulatory Bodies, Government Agencies, and Other Organizations
5.14.2 Key Regulations and Standards
5.14.2.1 Regulations
5.14.2.2 Standards

6 3D Stacking Market, by Packaging Methodology

6.1 Introduction
6.2 3D Package-On-Package (Pop)
6.2.1 Growing Demand for Compact and Feature-Rich Electronic Devices to Propel Segmental Growth
6.3 3D System-In-Package (Sip)
6.3.1 Need for Miniaturized and Power-Efficient Devices Across Diverse Applications to Drive Segment
6.4 3D Chip-On-Chip (Coc)
6.4.1 Need for Compact Solutions in High-Performance Computing Applications to Fuel Segmental Growth
6.5 Wafer Level Chip Scale Packaging (Wlcsp)
6.5.1 Need to Reduce Consumption of Packaging Material to Propel Adoption of Wlcsp Technology

7 3D Stacking Market, by Method

7.1 Introduction
Figure 35 Wafer-To-Chip Segment to Register Highest CAGR in Market During Forecast Period
Table 15 Market, by Method, 2019-2022 (USD Million)
Table 16 Market, by Method, 2023-2028 (USD Million)
7.2 Die-To-Die
7.2.1 Rising Need for Compact and Efficient Device Structures to Boost Adoption of Die-To-Die Stacking
Table 17 Die-To-Die: Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 18 Die-To-Die: Market, by Interconnecting Technology, 2023-2028 (USD Million)
7.3 Die-To-Wafer
7.3.1 Increasing Focus on Device Performance Enhancement to Fuel Adoption of Die-To-Wafer Integration in 3D Stacking
Table 19 Die-To-Wafer: Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 20 Die-To-Wafer: Market, by Interconnecting Technology, 2023-2028 (USD Million)
7.4 Wafer-To-Wafer
7.4.1 Growing Demand for Advanced Compact Packaging Solutions to Fuel Segmental Growth
Table 21 Wafer-To-Wafer: Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 22 Wafer-To-Wafer: Market, by Interconnecting Technology, 2023-2028 (USD Million)
7.5 Wafer-To-Chip
7.5.1 Rising Need for Compact and Efficient Packaging Solutions in Automotive Electronics to Drive Segment
Table 23 Wafer-To-Chip: Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 24 Wafer-To-Chip: Market, by Interconnecting Technology, 2023-2028 (USD Million)
7.6 Chip-To-Chip
7.6.1 Growing Need for High-Performance and Power-Efficient Electronic Devices to Propel Segmental Growth
Table 25 Chip-To-Chip: Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 26 Chip-To-Chip: 3D Stacking Market, by Interconnecting Technology, 2023-2028 (USD Million)

8 3D Stacking Market, by Interconnecting Technology

8.1 Introduction
Figure 36 3D Tsv Segment to Capture Largest Share of Market During Forecast Period
Table 27 Market, by Interconnecting Technology, 2019-2022 (USD Million)
Table 28 Market, by Interconnecting Technology, 2023-2028 (USD Million)
8.2 3D Hybrid Bonding
8.2.1 Adoption of 3D Hybrid Bonding in High-Performance Computing and Data-Intensive Applications to Drive Market
Table 29 3D Hybrid Bonding: Market, by Method, 2019-2022 (USD Million)
Table 30 3D Hybrid Bonding: 3D Stacking Market, by Method, 2023-2028 (USD Million)
8.3 3D Through-Silicon Via (Tsv)
Table 31 3D Tsv: Market, by Method, 2019-2022 (USD Million)
Table 32 3D Tsv: Market, by Method, 2023-2028 (USD Million)
8.3.1 Via-First Tsv
8.3.1.1 Increasing Adoption of Via-First Tsv in Applications Requiring Early-Stage Integration to Drive Market
8.3.2 Via-Middle Tsv
8.3.2.1 Need for Flexibility in Vertical Connections in Semiconductor Design to Increase Demand for Via-Middle Tsv Technology
8.3.3 Via-Last Tsv
8.3.3.1 Growing Adoption of Via-Last Tsv Technology in Applications Requiring Late-Stage Interconnection to Drive Market
8.3.4 Hybrid Tsv
8.3.4.1 Ability to Meet Specific Design and Performance Requirements to Fuel Adoption of Hybrid Tsv
8.3.5 Deep Trench Tsv
8.3.5.1 Rising Demand for Enhanced Electrical Performance in Advanced Microprocessors and Memory Devices to Drive Market
8.3.6 Microbump Tsv
8.3.6.1 Rising Demand for Miniaturized and Densely Interconnected Semiconductor Devices to Fuel Market Growth
8.3.7 Through Glass Via (Tgv)
8.3.7.1 Rising Adoption of Tgv Technique in Applications Requiring Transparent and Hermetic Packaging to Drive Market
8.4 Monolithic 3D
8.4.1 Ability to Address Limitations of Advanced Cmos Scaling to Fuel Demand for Monolithic 3D Integration
Table 33 Monolithic 3D Integration: Market, by Method, 2019-2022 (USD Million)
Table 34 Monolithic 3D Integration: Market, by Method, 2023-2028 (USD Million)

9 3D Stacking Market, by Device Type

9.1 Introduction
Figure 37 Mems/Sensors Segment to Register Highest CAGR in 3D Stacking Market During Forecast Period
Table 35 Market, by Device Type, 2019-2022 (USD Million)
Table 36 Market, by Device Type, 2023-2028 (USD Million)
9.2 Logic Ics
9.2.1 Rising Need for High Computational Efficiency to Induce Demand for Logic Ics
Table 37 Logic Ics: Market, by End-user, 2019-2022 (USD Million)
Table 38 Logic Ics: Market, by End-user, 2023-2028 (USD Million)
9.3 Imaging & Optoelectronics
9.3.1 Potential to Improve Image Processing and Optical Functionalities to Spur Adoption of 3D Stacking
Table 39 Imaging & Optoelectronics: Market, by End-user, 2019-2022 (USD Million)
Table 40 Imaging & Optoelectronics: Market, by End-user, 2023-2028 (USD Million)
9.4 Memory Devices
9.4.1 Surging Demand for High-Bandwidth Memory to Foster Market Growth
Table 41 Memory Devices: Market, by End-user, 2019-2022 (USD Million)
Table 42 Memory Devices: Market, by End-user, 2023-2028 (USD Million)
9.5 Mems/Sensors
9.5.1 Growing Requirement for Compact and Accurate Sensing Technologies to Fuel Uptake of 3D Stacking
Table 43 Mems/Sensors: Market, by End-user, 2019-2022 (USD Million)
Table 44 Mems/Sensors: Market, by End-user, 2023-2028 (USD Million)
9.6 Light Emitting Diodes (Leds)
9.6.1 Rising Demand for Innovative Designs and Improved Luminosity in Leds to Fuel Segmental Growth
Table 45 Leds: Market, by End-user, 2019-2022 (USD Million)
Table 46 Leds: Market, by End-user, 2023-2028 (USD Million)
9.7 Others
Table 47 Others: Market, by End-user, 2019-2022 (USD Million)
Table 48 Others: Market, by End-user, 2023-2028 (USD Million)

10 3D Stacking Market, by End-user

10.1 Introduction
Figure 38 Automotive Segment to Record Highest CAGR in Market During Forecast Period
Table 49 Market, by End-user, 2019-2022 (USD Million)
Table 50 Market, by End-user, 2023-2028 (USD Million)
10.2 Consumer Electronics
10.2.1 Increasing Technological Advancements in Consumer Electronics to Drive Adoption of 3D Stacking
Table 51 Consumer Electronics: 3D Stacking Market, by Device Type, 2019-2022 (USD Million)
Table 52 Consumer Electronics: Market, by Device Type, 2023-2028 (USD Million)
Table 53 Consumer Electronics: Market, by Region, 2019-2022 (USD Million)
Table 54 Consumer Electronics: Market, by Region, 2023-2028 (USD Million)
10.3 Manufacturing
10.3.1 Increasing Shift Toward Smart Factories and Industry 4.0 to Fuel Adoption of 3D Stacking
Table 55 Manufacturing: 3D Stacking Market, by Device Type, 2019-2022 (USD Million)
Table 56 Manufacturing: Market, by Device Type, 2023-2028 (USD Million)
Table 57 Manufacturing: Market, by Region, 2019-2022 (USD Million)
Table 58 Manufacturing: Market, by Region, 2023-2028 (USD Million)
10.4 Communications
10.4.1 Integration of Advanced Functionalities in High-Performance Computing Applications to Drive Market
Table 59 Communications: Market, by Device Type, 2019-2022 (USD Million)
Table 60 Communications: Market, by Device Type, 2023-2028 (USD Million)
Table 61 Communications: Market, by Region, 2019-2022 (USD Million)
Table 62 Communications: Market, by Region, 2023-2028 (USD Million)
10.5 Automotive
10.5.1 Rising Demand for Compact and Powerful Automotive Electronic Systems to Propel Market Growth
Table 63 Automotive: Market, by Device Type, 2019-2022 (USD Million)
Table 64 Automotive: Market, by Device Type, 2023-2028 (USD Million)
Table 65 Automotive: Market, by Region, 2019-2022 (USD Million)
Table 66 Automotive: Market, by Region, 2023-2028 (USD Million)
10.6 Healthcare
10.6.1 Surging Demand for Advanced Medical Equipment for High Performance and Efficiency to Fuel Market Growth
Table 67 Healthcare: Market, by Device Type, 2019-2022 (USD Million)
Table 68 Healthcare: Market, by Device Type, 2023-2028 (USD Million)
Table 69 Healthcare: Market, by Region, 2019-2022 (USD Million)
Table 70 Healthcare: 3D Stacking Market, by Region, 2023-2028 (USD Million)
10.7 Others
Table 71 Others: 3D Stacking Market, by Device Type, 2019-2022 (USD Million)
Table 72 Others: Market, by Device Type, 2023-2028 (USD Million)
Table 73 Others: Market, by Region, 2019-2022 (USD Million)
Table 74 Others: Market, by Region, 2023-2028 (USD Million)

11 3D Stacking Market, by Region

11.1 Introduction
Figure 39 Asia-Pacific to Record Highest CAGR in Market During Forecast Period
Table 75 Market, by Region, 2019-2022 (USD Million)
Table 76 Market, by Region, 2023-2028 (USD Million)
11.2 North America
Figure 40 North America: 3D Stacking Market Snapshot
Table 77 North America: Market, by Country, 2019-2022 (USD Million)
Table 78 North America: Market, by Country, 2023-2028 (USD Million)
Table 79 North America: Market, by End-user, 2019-2022 (USD Million)
Table 80 North America: Market, by End-user, 2023-2028 (USD Million)
11.2.1 US
11.2.1.1 Presence of Fabrication Business Giants to Support Market Growth
Table 81 US: Market, by End-user, 2019-2022 (USD Million)
Table 82 US: Market, by End-user, 2023-2028 (USD Million)
11.2.2 Canada
11.2.2.1 Increasing Focus on Innovation and Technological Advancements to Foster Market Growth
Table 83 Canada: Market, by End-user, 2019-2022 (USD Million)
Table 84 Canada: Market, by End-user, 2023-2028 (USD Million)
11.2.3 Mexico
11.2.3.1 Government-Led Initiatives to Develop Semiconductor Industry to Fuel Market Growth
Table 85 Mexico: Market, by End-user, 2019-2022 (USD Million)
Table 86 Mexico: Market, by End-user, 2023-2028 (USD Million)
11.2.4 North America: Recession Impact
11.3 Europe
Figure 41 Europe: 3D Stacking Market Snapshot
Table 87 Europe: Market, by Country, 2019-2022 (USD Million)
Table 88 Europe: Market, by Country, 2023-2028 (USD Million)
Table 89 Europe: Market, by End-user, 2019-2022 (USD Million)
Table 90 Europe: Market, by End-user, 2023-2028 (USD Million)
11.3.1 Germany
11.3.1.1 Growing Production of Automobiles to Create Demand for 3D Stacking
Table 91 Germany: Market, by End-user, 2019-2022 (USD Million)
Table 92 Germany: Market, by End-user, 2023-2028 (USD Million)
11.3.2 France
11.3.2.1 Increasing R&D in 3D Stacking to Drive Market
Table 93 France: Market, by End-user, 2019-2022 (USD Million)
Table 94 France: Market, by End-user, 2023-2028 (USD Million)
11.3.3 UK
11.3.3.1 5G Implementation to Create Conducive Environment for Market Growth
Table 95 UK: Market, by End-user, 2019-2022 (USD Million)
Table 96 UK: Market, by End-user, 2023-2028 (USD Million)
11.3.4 Rest of Europe
Table 97 Rest of Europe: Market, by End-user, 2019-2022 (USD Million)
Table 98 Rest of Europe: Market, by End-user, 2023-2028 (USD Million)
11.3.5 Europe: Recession Impact
11.4 Asia-Pacific
Figure 42 Asia-Pacific: 3D Stacking Market Snapshot
Table 99 Asia-Pacific: Market, by Country, 2019-2022 (USD Million)
Table 100 Asia-Pacific: Market, by Country, 2023-2028 (USD Million)
Table 101 Asia-Pacific: Market, by End-user, 2019-2022 (USD Million)
Table 102 Asia-Pacific: Market, by End-user, 2023-2028 (USD Million)
11.4.1 China
11.4.1.1 Increasing Investments in Semiconductor Industry to Drive Market
Table 103 China: Market, by End-user, 2019-2022 (USD Million)
Table 104 China: Market, by End-user, 2023-2028 (USD Million)
11.4.2 Japan
11.4.2.1 Increasing Focus on Precision Engineering to Boost Adoption of 3D Stacking
Table 105 Japan: Market, by End-user, 2019-2022 (USD Million)
Table 106 Japan: Market, by End-user, 2023-2028 (USD Million)
11.4.3 South Korea
11.4.3.1 Growing Focus on Innovation and Research to Contribute to Market Growth
Table 107 South Korea: Market, by End-user, 2019-2022 (USD Million)
Table 108 South Korea: Market, by End-user, 2023-2028 (USD Million)
11.4.4 Taiwan
11.4.4.1 Rising Demand for Compact, Efficient, and High-Performing Chips to Support Market Growth
Table 109 Taiwan: Market, by End-user, 2019-2022 (USD Million)
Table 110 Taiwan: Market, by End-user, 2023-2028 (USD Million)
11.4.5 Rest of Asia-Pacific
Table 111 Rest of Asia-Pacific: Market, by End-user, 2019-2022 (USD Million)
Table 112 Rest of Asia-Pacific: Market, by End-user, 2023-2028 (USD Million)
11.4.6 Asia-Pacific: Recession Impact
11.5 Rest of the World (Row)
Table 113 RoW: 3D Stacking Market, by Region, 2019-2022 (USD Million)
Table 114 RoW: Market, by Region, 2023-2028 (USD Million)
Table 115 RoW: Market, by End-user, 2019-2022 (USD Million)
Table 116 RoW: Market, by End-user, 2023-2028 (USD Million)
11.5.1 Middle East & Africa
11.5.1.1 Government Initiatives to Strengthen Semiconductor Industry to Favor Market Growth
Table 117 Middle East & Africa: Market, by End-user, 2019-2022 (USD Million)
Table 118 Middle East & Africa: Market, by End-user, 2023-2028 (USD Million)
11.5.2 South America
11.5.2.1 Growing Demand for Advanced Architecture and High-End Computing to Contribute to Market Growth
Table 119 South America: Market, by End-user, 2019-2022 (USD Million)
Table 120 South America: Market, by End-user, 2023-2028 (USD Million)
11.5.3 RoW: Recession Impact

12 Competitive Landscape

12.1 Introduction
12.2 Strategies Adopted by Key Players
Table 121 Overview of Strategies Adopted by Key Players in 3D Stacking Market
12.2.1 Product Portfolio
12.2.2 Regional Focus
12.2.3 Organic/Inorganic Growth Strategies
12.3 Market Share Analysis, 2022
Table 122 3D Stacking Market: Market Share Analysis, 2022
12.4 Revenue Analysis of Key Players in 3D Stacking Market
Figure 43 Five-Year Revenue Analysis of Key Players in 3D Stacking Market
12.5 Key Company Evaluation Matrix, 2022
12.5.1 Stars
12.5.2 Pervasive Players
12.5.3 Emerging Leaders
12.5.4 Participants
Figure 44 3D Stacking Market (Global): Key Company Evaluation Matrix, 2022
12.6 Competitive Benchmarking
12.6.1 Company Footprint, by Interconnecting Method
12.6.2 Company Footprint, by Device Type
12.6.3 Company Footprint, by End-user
12.6.4 Company Footprint, by Region
12.6.5 Overall Company Footprint
12.7 Startups/Small and Medium-Sized Enterprises (Smes) Evaluation Matrix, 2022
Table 123 3D Stacking Market: Detailed List of Key Startups/Smes
12.7.1 Competitive Benchmarking of Key Startups/Smes
Table 124 Company Footprint, by Interconnecting Methods
Table 125 Company Footprint, by Device Type
Table 126 Company Footprint, by End-user Industry
Table 127 Company Footprint, by Region
12.7.2 Progressive Companies
12.7.3 Responsive Companies
12.7.4 Dynamic Companies
12.7.5 Starting Blocks
Figure 45 3D Stacking Market (Global): Startups/Smes Evaluation Matrix, 2022
12.8 Competitive Scenarios and Trends
12.8.1 Product Launches & Developments
Table 128 3D Stacking Market: Product Launches/Developments, 2020-2023
12.8.2 Deals
Table 129 3D Stacking Market: Deals, 2020-2023

13 Company Profiles

13.1 Introduction
13.2 Key Players
(Business Overview, Products/Solutions/Services Offered, Recent Developments, Product Launches, Deals, Analyst's View, Key Strengths/Right to Win, Strategic Choices, and Weaknesses/Competitive Threats)*
13.2.1 Taiwan Semiconductor Manufacturing Company Limited
Table 130 Taiwan Semiconductor Manufacturing Company Limited: Company Overview
Figure 46 Taiwan Semiconductor Manufacturing Co Ltd: Company Snapshot
Table 131 Taiwan Semiconductor Manufacturing Company Limited: Products/Services/Solutions Offered
Table 132 Taiwan Semiconductor Manufacturing Company Limited: Product Launches
Table 133 Taiwan Semiconductor Manufacturing Company Limited: Deals
Table 134 Taiwan Semiconductor Manufacturing Company Limited: Others
13.2.2 Samsung
Table 135 Samsung: Company Overview
Figure 47 Samsung: Company Snapshot
Table 136 Samsung: Products/Services/Solutions Offered
Table 137 Samsung: Product Launches
Table 138 Samsung: Deals
13.2.3 Intel Corporation
Table 139 Intel Corporation: Company Overview
Figure 48 Intel Corporation: Company Snapshot
Table 140 Intel Corporation: Products/Services/Solutions Offered
13.2.4 Sk Hynix Inc.
Table 141 Sk Hynix Inc.: Company Overview
Figure 49 Sk Hynix Inc.: Company Snapshot
Table 142 Sk Hynix Inc.: Products/Services/Solutions Offered
Table 143 Sk Hynix Inc.: Deals
13.2.5 Advanced Micro Devices, Inc.
Table 144 Advanced Micro Devices, Inc.: Company Overview
Figure 50 Advanced Micro Devices, Inc.: Company Snapshot
Table 145 Advanced Micro Devices, Inc.: Products/Services/Solutions Offered
Table 146 Advanced Micro Devices, Inc.: Deals
13.2.6 Ase Technology Holding Co., Ltd.
Table 147 Ase Technology Holding Co., Ltd.: Company Overview
Figure 51 Ase Technology Holding Co., Ltd.: Company Snapshot
Table 148 Ase Technology Holding Co., Ltd.: Products/Services/Solutions Offered
Table 149 Ase Technology Holding Co., Ltd.: Product Launches
13.2.7 Amkor Technology
Table 150 Amkor Technology: Company Overview
Figure 52 Amkor Technology: Company Snapshot
Table 151 Amkor Technology: Products/Services/Solutions Offered
Table 152 Amkor Technology: Deals
13.2.8 Jiangsu Changdian Technology Co., Ltd.
Table 153 Jiangsu Changdian Technology Co., Ltd.: Company Overview
Figure 53 Jiangsu Changdian Technology Co., Ltd.: Company Snapshot
Table 154 Jiangsu Changdian Technology Co., Ltd.: Products/Services/Solutions Offered
Table 155 Jiangsu Changdian Technology Co., Ltd.: Product Launches
Table 156 Jiangsu Changdian Technology Co., Ltd.: Deals
13.2.9 Texas Instruments Incorporated
Table 157 Texas Instruments Incorporated: Company Overview
Figure 54 Texas Instruments Incorporated: Company Snapshot
Table 158 Texas Instruments Incorporated: Products/Services/Solutions Offered
Table 159 Texas Instruments Incorporated: Deals
13.2.10 United Microelectronics Corporation
Table 160 United Microelectronics Corporation: Company Overview
Figure 55 United Microelectronics Corporation: Company Snapshot
Table 161 United Microelectronics Corporation: Products/Services/Solutions Offered
Table 162 United Microelectronics Corporation: Deals
13.2.11 Powertech Technology Inc
Table 163 Powertech Technology Inc: Company Overview
Figure 56 Powertech Technology Inc: Company Snapshot
Table 164 Powertech Technology Inc: Products/Services/Solutions Offered
13.2.12 Cadence Design Systems, Inc.
Table 165 Cadence Design Systems, Inc.: Company Overview
Figure 57 Cadence Design Systems, Inc.: Company Snapshot
Table 166 Cadence Design Systems, Inc.: Products/Services/Solutions Offered
Table 167 Cadence Design Systems, Inc.: Deals
13.2.13 Broadcom
Table 168 Broadcom: Company Overview
Figure 58 Broadcom: Company Snapshot
Table 169 Broadcom: Products/Services/Solutions Offered
Table 170 Broadcom: Deals
13.2.14 Tower Semiconductor
Table 171 Tower Semiconductor: Company Overview
Figure 59 Tower Semiconductor: Company Snapshot
Table 172 Tower Semiconductor: Products/Services/Solutions Offered
Table 173 Tower Semiconductor: Deals
13.2.15 Ibm
Table 174 Ibm: Company Overview
Figure 60 Ibm: Company Snapshot
Table 175 Ibm: Products/Services/Solutions Offered
Table 176 Ibm: Product Launches
13.2.16 Tokyo Electron Limited
Table 177 Tokyo Electron Limited: Company Overview
Figure 61 Tokyo Electron Limited: Company Snapshot
Table 178 Tokyo Electron Limited: Products/Services/Solutions Offered
Table 179 Tokyo Electron Limited: Product Launches
13.2.17 Cea-Leti
Table 180 Cea-Leti: Company Overview
Table 181 Cea-Leti: Products/Services/Solutions Offered
*Details on Business Overview, Products/Solutions/Services Offered, Recent Developments, Product Launches, Deals, Analyst's View, Key Strengths/Right to Win, Strategic Choices, and Weaknesses/Competitive Threats Might Not be Captured in Case of Unlisted Companies.
13.3 Other Players
13.3.1 Siliconware Precision Industries Co., Ltd.
13.3.2 Globalfoundries Inc.
13.3.3 Nhanced Semiconductors
13.3.4 Deca Technologies
13.3.5 Tezzaron
13.3.6 Teledyne Technologies Incorporated
13.3.7 Huawei Technologies Co. Ltd.
13.3.8 Qualcomm Technologies, Inc.
13.3.9 3M
13.3.10 Ayar Labs, Inc.
13.3.11 Applied Materials, Inc.
13.3.12 Monolithic 3D Inc.
13.3.13 Moldex3D
13.3.14 Cerebras
13.3.15 Xperi Inc.

14 Appendix

14.1 Discussion Guide
14.2 Knowledgestore: The Subscription Portal
14.3 Customization Options

Companies Mentioned

3M
Advanced Micro Devices, Inc.
Amkor Technology
Applied Materials, Inc.
Ase Technology Holding Co., Ltd.
Ayar Labs, Inc.
Broadcom
Cadence Design Systems, Inc.
Cea-Leti
Cerebras
Deca Technologies
Globalfoundries Inc.
Huawei Technologies Co. Ltd.
Ibm
Intel Corporation
Jiangsu Changdian Technology Co., Ltd.
Moldex3D
Monolithic 3D Inc.
Nhanced Semiconductors
Powertech Technology Inc
Qualcomm Technologies, Inc.
Samsung
Siliconware Precision Industries Co., Ltd.
Sk Hynix Inc.
Taiwan Semiconductor Manufacturing Company Limited
Teledyne Technologies Incorporated
Texas Instruments Incorporated
Tezzaron
Tokyo Electron Limited
Tower Semiconductor
United Microelectronics Corporation
Xperi Inc.

Methodology

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Table Information

Report Attribute	Details
No. of Pages	237
Published	October 2023
Forecast Period	2023 - 2028
Estimated Market Value ( USD ) in 2023	$ 1.2 Billion
Forecasted Market Value ( USD ) by 2028	$ 3.1 Billion
Compound Annual Growth Rate	20.4%
Regions Covered	Global
No. of Companies Mentioned	32

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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Forecast to 2028

Increasing demand for high-performance computing and energy-efficient Logics ICs

Need for enhanced performance and miniaturization in electronic applications to drive market growth for hybrid bonding

Rising need for advanced and compact packaging solutions in high-performance computing applications to drive market growth for wafer-to-wafer 3D Stacking

North America is expected to account for the second largest market share during the forecast period

The break-up of the profile of primary participants in the 3D stacking market:

Research Coverage

Reasons to buy the report:

The report provides insights on the following pointers:

Table of Contents

Companies Mentioned

Methodology

Table Information

Increasing demand for high-performance computing and energy-efficient Logics ICs

Need for enhanced performance and miniaturization in electronic applications to drive market growth for hybrid bonding

Rising need for advanced and compact packaging solutions in high-performance computing applications to drive market growth for wafer-to-wafer 3D Stacking

North America is expected to account for the second largest market share during the forecast period

The break-up of the profile of primary participants in the 3D stacking market:

Research Coverage

Reasons to buy the report:

The report provides insights on the following pointers:

Table of Contents

Companies Mentioned

Methodology

Table Information

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