Automotive PCB Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Automotive PCB Market is projected to expand from USD 10.59 Billion in 2025 to USD 15.72 Billion by 2031, achieving a CAGR of 6.81%. Acting as the critical mechanical backbone and electrical interconnects for electronic components, automotive Printed Circuit Boards (PCBs) are deployed in systems ranging from sophisticated infotainment and safety features to engine control units. This growth is primarily fueled by the automotive sector's rapid shift toward electrification, which creates a specific need for thermal-resistant and high-power boards suitable for battery management systems and electric vehicle powertrains. Additionally, the widespread incorporation of autonomous driving technologies and Advanced Driver Assistance Systems (ADAS) drives the demand for flexible and high-density interconnect PCBs capable of sustaining complex computing requirements.

According to the Taiwan Printed Circuit Association, the automotive sector comprised approximately 26.9% of the PCB application market in Mainland China in 2024, highlighting the segment's vital role within the world's largest electronics production hub. Despite this strong demand, the market encounters substantial hurdles regarding raw material scarcity and supply chain volatility, particularly involving high-performance laminates and copper. These disruptions, frequently intensified by geopolitical tensions, result in prolonged lead times and rising production costs, which can impede the timely delivery of essential components necessary for modern vehicle assembly.

Market Drivers

The accelerating global transition toward vehicle electrification acts as the main catalyst for market expansion, fundamentally changing the specifications required for printed circuit boards (PCBs). As the industry moves from internal combustion engines to electric powertrains, there is a distinct need for durable, high-voltage PCBs capable of supporting power inverters and battery management systems (BMS). These components require boards with superior thermal management properties and thick copper configurations to effectively handle high currents, a shift reflected in major production hubs. According to the China Passenger Car Association, retail sales of new energy passenger vehicles in China reached 10.98 million units for the full year 2024, marking a 42% year-on-year increase as reported in January 2025, while the European Automobile Manufacturers’ Association noted in November 2025 that battery-electric cars secured 16.4% of the EU market share year-to-date.

Concurrently, the increasing integration of Advanced Driver-Assistance Systems (ADAS) is reshaping the sector’s technological landscape. This trend drives a critical migration toward High-Density Interconnect (HDI) and flexible PCB architectures, which are essential for supporting the miniaturization and high-speed signal transmission required by LIDAR, radar, and camera modules. These advanced boards enable the dense component placement necessary for real-time data processing units within zonal vehicle architectures. Highlighting the industrial impact of this evolution, the Taiwan Printed Circuit Association reported in its March 2025 production update that demand for HDI boards among Taiwanese manufacturers grew by 20.1% in 2024, a surge largely attributed to automotive electronics requirements, demonstrating how safety enhancements are directly translating into higher value-add manufacturing opportunities.

Market Challenges

The instability of the supply chain and the scarcity of essential raw materials, particularly copper and high-performance laminates, serve as a major restraint on the growth of the Global Automotive PCB Market. These disruptions compromise the reliability of production schedules, generating significant bottlenecks that prevent manufacturers from capitalizing on the rising demand for autonomous and electric vehicles. When critical printed circuit boards are unavailable due to material shortages, automotive assemblers are forced to suspend production lines, which directly limits revenue realization and slows the broader adoption of advanced automotive technologies.

This operational pressure is confirmed by recent industrial data indicating persistent challenges with inputs. According to the IPC, 45% of electronics manufacturers reported rising material costs in December 2024, reflecting the ongoing difficulty in securing consistent and affordable resources. Such volatility compels PCB fabricators to extend lead times and increase prices, passing the burden onto automotive OEMs. Consequently, the market struggles to maintain the consistent output levels required to support the rapid pace of vehicle electrification, directly dampening the sector's overall growth potential.

Market Trends

A critical trend distinct from standard computing requirements is the integration of high-frequency substrates designed for 5G and V2X (Vehicle-to-Everything) connectivity. As automakers deploy cooperative intelligent transport systems, there is a surging demand for specialized printed circuit boards capable of minimizing signal loss at millimeter-wave frequencies. These low-loss materials are essential for enabling real-time communication between vehicles and infrastructure, a capability that standard FR-4 laminates cannot reliably support in high-bandwidth environments. The scale of this connectivity shift is immense, necessitating a rapid evolution in material selection; according to the 5G Automotive Association (5GAA) in its December 2024 ‘Roadmap for Advanced Driving Use Cases, Connectivity, and Technologies’, the number of global cellular-connected vehicles has exceeded 300 million, highlighting the immediate need for infrastructure-ready board solutions.

Simultaneously, manufacturing strategies are being reshaped by the development of eco-friendly and recyclable PCB materials to meet strict environmental regulations and corporate sustainability goals. Manufacturers are increasingly moving away from traditional, hard-to-recycle thermoset plastics in favor of thermoplastic materials and biodegradable substrates that allow for easier component reclamation at the end of a vehicle's life cycle. This transition is driven not only by regulatory pressure but also by the potential for long-term operational efficiencies. This strategic pivot is supported by industry sentiment; according to a March 2025 survey by the IPC, 58% of electronics leaders identified operational efficiency and cost savings as key motivators for accelerating their sustainability efforts, confirming that green manufacturing has become a central competitive priority.

Key Players Profiled in the Automotive PCB Market

• Infineon Technologies AG
• Samsung Electro Mechanics
• CMK Corporation
• Amitron Corporation
• KCE Group
• Deaduck Phil. Inc.
• MEIKO ELECTRONICS Co., Ltd.
• CHIN POON Industrial Co., Ltd.
• Unimicron Group
• STMicroelectronics N.V.

Report Scope

In this report, the Global Automotive PCB Market has been segmented into the following categories:

Automotive PCB Market, by Vehicle Type:

• Passenger Car
• Commercial Vehicle

Automotive PCB Market, by Propulsion Type:

• IC Engine
• Electric

Automotive PCB Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Automotive PCB Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

This product will be delivered within 1-3 business days.