The Global Active Electronic Component Market size is expected to reach $477.7 billion by 2030, rising at a market growth of 6.4% CAGR during the forecast period. In the year 2022, the market attained a volume of 5,381.6 million units, experiencing a growth of 5.2% (2019-2022).
The trend of urbanization is linked to population growth. As more people move to urban areas, there's often an increased demand for consumer electronics due to the need for connectivity, entertainment, and productivity tools. Therefore, the Consumer Electronics segment would acquire around 30% share in the market by 2030. The rollout of 5G networks worldwide is expected to impact consumer electronics. Devices will need to support faster data speeds and lower latency, requiring components like RF (Radio Frequency) modules and antennas to enable 5G connectivity. The Internet of Things ecosystem is expanding, developing IoT devices for smart homes, wearables, and connected appliances. These devices require a range of electronic components, including sensors, microcontrollers, and wireless communication modules.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In August 2023, Intel Corporation entered into an agreement with Synopsys, Inc., to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation). Additionally, In June 2023, Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp, to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Partnerships & Collaborations.
The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Technologies AG, Advanced Micro Devices, Inc., STMicroelectronics N.V., Microchip Technology, Inc., Analog Devices, Inc., Broadcom Inc., NXP Semiconductors N.V., Intel Corporation, Texas Instruments, Inc., Toshiba Corporation, Skillsoft Corporation.
The trend of urbanization is linked to population growth. As more people move to urban areas, there's often an increased demand for consumer electronics due to the need for connectivity, entertainment, and productivity tools. Therefore, the Consumer Electronics segment would acquire around 30% share in the market by 2030. The rollout of 5G networks worldwide is expected to impact consumer electronics. Devices will need to support faster data speeds and lower latency, requiring components like RF (Radio Frequency) modules and antennas to enable 5G connectivity. The Internet of Things ecosystem is expanding, developing IoT devices for smart homes, wearables, and connected appliances. These devices require a range of electronic components, including sensors, microcontrollers, and wireless communication modules.
The major strategies followed by the market participants are Partnerships as the key developmental strategy to keep pace with the changing demands of end users. For instance, In August 2023, Intel Corporation entered into an agreement with Synopsys, Inc., to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation). Additionally, In June 2023, Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp, to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
Cardinal Matrix - Market Competition Analysis
Based on the Analysis presented in the Cardinal Matrix; Broadcom Inc., Intel Corporation and Texas Instruments, Inc. are the forerunners in the Market. In December, 2022, Broadcom Inc. collaborated with Rohde & Schwarz, to launch the automated test solution for Broadcom Wi-Fi 7 chipsets which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. Companies such as Analog Devices, Inc., NXP Semiconductors N.V., STMicroelectronics N.V. are some of the key innovators in the Market.Market Growth Factors
Rising automation in a wide range of industries
Precision and accuracy are critical in industrial processes. Active components like sensors, encoders, and feedback control systems provide the necessary data and control mechanisms to ensure precise operations. Industrial automation systems, including programmable logic controllers, sensors, and actuators, streamline manufacturing processes, increasing productivity and reducing production time. Active electronic components facilitate the operation and communication of these systems. In addition, for efficiency and responsiveness, remotely monitoring and controlling industrial operations is essential. These factors will pose a lucrative prospect for the market in the coming years.Increasing demand in automotive electronics worldwide
EVs use power electronics components like inverters and converters to manage the flow of electricity between the battery pack and the electric motor. These components control power delivery, regenerative braking, and charging. Battery Management Systems (BMS) components monitor the battery pack's state of charge, health, and temperature. They ensure safe and efficient operation while maximizing battery life. Electric drive systems include electric motors, motor controllers, and sensors. Moreover, autonomous vehicles use a variety of sensors, including radar, LiDAR, cameras, and ultrasonic sensors, to perceive their environment. Autonomous vehicles must communicate with other vehicles, infrastructure, and data centres. Electronic components for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication are integral.Market Restraining Factors
Rising semiconductor supply-demand imbalance
The semiconductor supply-demand imbalance can indeed have a significant impact on the market. As semiconductors become scarcer and more expensive due to supply imbalances, manufacturers of active electronic components may face challenges in sourcing the necessary semiconductor components. This can lead to production delays and reduced availability of active components. The rising prices of semiconductors can drive up manufacturing costs for active electronic components, potentially leading to higher prices for end consumers. This can affect the competitiveness of products and reduce profit margins for manufacturers. Longer lead times for semiconductor components can also extend the lead times for active electronic component manufacturers. Delays in receiving critical semiconductor inputs can disrupt production schedules and customer deliveries.The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Partnerships & Collaborations.
End user Outlook
On the basis of end-user, the market is segmented into consumer electronics, networking & telecommunication, automotive, manufacturing, aerospace & defense, healthcare, and others. The automotive segment witnessed a promising revenue share in the market in 2022. The automotive industry is undergoing a major shift toward electric and hybrid vehicles. These vehicles rely heavily on advanced active electronic components, including power electronics, sensors, and control systems. The demand for components like power inverters, motor drives, and battery management systems is expected to surge as automakers expand their electric vehicle portfolios. ADAS technologies, such as adaptive cruise control, lane-keeping assistance, and automated emergency braking, are becoming standard features in modern vehicles. These systems heavily rely on sensors, radar, LiDAR, and cameras, driving the demand for high-performance sensors.Product Outlook
Based on product type, the market is divided into semiconductor devices, vacuum tube, display devices, and others. In 2022, the display devices segment garnered a considerable revenue share in the market. The consumer electronics industry continues to be a significant driver of demand for display devices, which includes smartphones, tablets, laptops, TVs, gaming consoles, and wearables. As consumers seek higher-resolution screens, faster refresh rates, and innovative form factors, manufacturers are under pressure to develop advanced display technologies to meet these demands. OLED (Organic Light-Emitting Diode) displays have gained popularity for their vibrant colors, deep blacks, and flexibility. Mini-LED and Micro-LED displays are also emerging as alternatives to traditional LCDs, offering improved brightness and contrast. These technologies are likely to witness increased adoption in various applications. All these benefits will help to boost the demand for display devices in the coming years.Semiconductor Devices Outlook
The semiconductor devices segment is sub-segmented into diode, transistors, integrated circuits (ICs), and optoelectronics. In 2022, the transistors subsegment recorded a substantial revenue share in the market. Automobile electronics use transistors for engine control units (ECUs), infotainment systems, and safety features. The demand for transistors may increase as the automotive industry evolves with electric and autonomous vehicles. The rollout of 5G networks and the ongoing expansion of telecommunications infrastructure require a wide range of transistors, including RF transistors and power amplifiers. Transistors are key components in power electronics for voltage regulation and switching tasks.Regional Outlook
Based on region, the market is divided into North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific segment procured the highest revenue share in the market in 2022. Asia Pacific, particularly countries like China, Taiwan, South Korea, and Japan, has long been known as a manufacturing hub for electronic components and devices. Many leading semiconductor manufacturers and electronic component suppliers are based in this region. The Asia Pacific region is home to a significant portion of the world's population, driving high demand for consumer electronics. This includes smartphones, laptops, televisions, and other electronic devices relying on active components. Owing to these factors, the segment will proliferate in the future.The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Technologies AG, Advanced Micro Devices, Inc., STMicroelectronics N.V., Microchip Technology, Inc., Analog Devices, Inc., Broadcom Inc., NXP Semiconductors N.V., Intel Corporation, Texas Instruments, Inc., Toshiba Corporation, Skillsoft Corporation.
Strategies deployed in the Market
» Partnerships, Collaborations, and Agreements:
- Aug-2023: Intel Corporation entered into an agreement with Synopsys, Inc., an American electronic design automation company. Through this agreement, the companies intend to serve the foundry customers of Intel by developing Intel 3 and Intel 18A using IP (intellectual property) and EDA (electronic design automation).
- Jun-2023: Infineon Technologies AG entered into a partnership with Kontrol Technologies Corp., a leader in smart energy solutions. Through this partnership, autonomous driving technology enhanced to develop an algorithm-based solution which controls the legal controls and the boundary settings for vehicles.
- Jun-2023: STMicroelectronics signed an agreement with Sanan Optoelectronics, a compound semiconductor company. Through this agreement, the companies would be releasing a 200mm silicon carbide device in Chongqing, China. The company’s' aim to support the demand for car electrification, industrial power and energy applications.
- Jun-2023: STMicroelectronics came into an agreement with Airbus, a European multinational aerospace corporation. Through this agreement, the companies aimed to construct well-structured power electronics that are lighter and necessary for future hybrid powered aircraft, facilitating electric urban air vehicles.
- May-2023: NXP Semiconductors N.V. teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this collaboration, the companies would impart an automotive embedded MRAM (Magnetic Random Access Memory) involving 16 nm FinFET technology.
- Feb-2023: Advanced Micro Devices, Inc. collaborated with Renesas Electronics Corporation, a Japanese semiconductor manufacturer. With this collaboration, Advanced Micro Devices exhibited a full RF front-end solution for 5G Active Antenna Systems (AAS) radios. The RF front end includes switches, pre-drivers, and low-noise amplifiers when paired with the Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design.
- Dec-2022: Broadcom Inc. collaborated with Rohde &Schwarz, an international electronics group specializing in the fields of electronic test equipment. Under this collaboration, the automated test solution for Broadcom Wi-Fi 7 chipsets was released which supports simultaneous dual-band 2×2 IEEE 802.11be compliant operation. The IEEE 802.11be amendment satisfies the working of Wi-Fi 7 in bands of 2.4 GHz, 5 GHz and 6 GHz and meets the requirements of upgraded applications on mobile handsets.
- Dec-2022: Broadcom Inc. collaborated with Skyworks Solutions, Inc., an American semiconductor company. Through this collaboration, Wi-Fi front-end modules (FEMs) were introduced which enhanced the execution of the needs of the Wi-Fi 6/6E-enabled devices. Additionally, this collaboration has supplied high-speed connectivity to the customers.
- Dec-2022: NXP Semiconductors N.V. signed an agreement with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this agreement, the companies introduced traction inverter and a platform for power conversion for use in electric vehicles.
- Nov-2022: Infineon Technologies AG teamed up with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing and design company. Through this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology was launched and integrated into the AURIX microcontrollers (MCU) of Infineon Technologies. Additionally, RRAM offers the services of immunization against disturbance as well as writing in parts without the needed for erasing.
- Oct-2022: Analog Devices, Inc. teamed up with Keysight Technologies, Inc., an American company. Through this collaboration, the companies promoted the use of their phased array platforms in those communications and sensing solutions involving higher data rate.
- Jul-2022: Infineon Technologies AG extended their collaboration with Delta Electronics, Inc., a Taiwanese electronics manufacturing company. Through this collaboration, the Delta’s 1.4 kW server power supply and a 1.6 kW Titanium gaming power platform was launched. Additionally, Delta's proficiency in electronics and Infineon’s CoolSiC MOSFET technology, helps these products to achieve 96 percent power efficiency.
- May-2022: Analog Devices, Inc. collaborated with Synopsys, Inc., an American electronic design automation company, to offer model libraries for DC/DC ICs and µModule (micromodule) regulators. The new library enables powertrain designers working on products like electric vehicles, avionics, instruments, and supercomputers to conduct precise and speedy multi-domain simulations. This accelerates the design process and reduces time-to-market.
- Apr-2020: Broadcom Inc. extended its collaboration with Synopsys, Inc., an American electronic design automation company. Through this collaboration, the companies manufactured semiconductors using the Fusion Design Platform of Synopsys. Additionally, this collaboration helped Broadcom to take advantage of the silicon-process offerings and better serve their customers.
- Mar-2022: Analog Devices, Inc. joined hands with Gridspertise, an energy transition enabler. Through this collaboration, the quality of smart grids was improved, along with hardware and software were developed that facilitate self-healing and adaptation of distribution grids in the event of changes in energy supply.
» Product Launches and Product Expansions:
- Jun-2023: Analog Devices, Inc. announced to unveil Apollo MxFE, a front-end platform having advanced software, direct Rf sampling and a wideband mixed signal. Apollo MxFE offers next generation applications and instantaneous bandwidths of 10GHz while it synthesizes frequencies up to 18GHz.
- May-2023: STMicroelectronics introduced the STM32 MPUs (microprocessors), which enhance performance and security for applications. The STM32MP2 Series devices help to integrate advanced security features in hardware and for opportunities in secure Industry 4.0, IoT, and rich user-interface applications.
- Mar-2023: Texas Instruments, Inc. launched an active electromagnetic interface (EMI) filter integrated circuits (ICs) which magnifies functionality while reducing costs and maintaining regulatory standards. The active EMI filter ICs solved the designing challenges of the engineers and at the same time bettered performance and power density.
- Oct-2022: NXP Semiconductors N.V. introduced the OrangeBox automotive-grade development platform which helps connection of NXP wireless technologies. The OrangeBox presents a single interface between the wired and wireless technologies of vehicles and thus makes communication of cars with the world outside easier.
- Oct-2022: NXP Semiconductors N.V. launched Matter-enabled development platforms, facilitating Matter devices for smart homes and buildings. The Matter development platforms consist of a range of IoT devices with Thread Border Router and Matter Controller capabilities.
- Oct-2022: Infineon Technologies AG revealed the XENSIV connected sensor kit (CSK), an IoT platform facilitating prototyping and formation of personalized solutions. The CSK is an amalgamation of several XENSIV sensors which offer power efficient and high performance for cases based on PSoC 6 microcontroller.
- Sep-2021: STMicroelectronics unveiled two products, the VN9D30Q100F and VN9D5D20FN. The VN9D30Q100F comprises two 33mΩ and four 90mΩ channels while the VN9D5D20FN consists of two 7.6mΩ and two 20mΩ channels. The six output channels and a 4-wire SPI interface of the two devices reduces the number of microcontroller I/O pins that is required to facilitate interaction with the device.
- Aug-2022: Microchip Technology Inc. added new features to its memory controller portfolio through the SMC 2000 series of Compute Express Link (CXL™)-based Smart Memory Controllers. The two products, SMC 2000 16×32G and SMC 2000 8×32G memory controllers are set to specifications of CXL 1.1 and CXL 2.0, have DDR4 and DDR5 JEDEC standards and support speeds of PCIe 5.0 specifications.
- Jun-2022: Toshiba Corporation released a superconducting motor which satisfies the requirements of the mobility sector. The superconducting motor is of light weight, has high-output density and high-speed rotation.
- May-2021: Analog Devices, Inc. has unveiled an extended range of battery management system (BMS) products, incorporating ASIL-D functional safety and innovative low-power capabilities for continuous battery monitoring. These improvements boost ADI's BMS platform, famous for accuracy and compatibility with various battery types, including zero-Cobalt LFP.
» Acquisitions and Mergers:
- Aug-2021: Analog Devices, Inc. completed the acquisition of Maxim Integrated Products, Inc., an integrated analog and mixed-signal semiconductor provider. With this acquisition, innovations in analog semiconductors were carried out, and better solutions were extended to the customers.
- Apr-2020: Infineon Technologies AG completed the acquisition of Cypress Semiconductor Corporation, an American semiconductor design and manufacturing company. Through this acquisition, Infineon strengthened its structural growth drivers on a wide variety of applications. Additionally, Infineon boosted its hold on the customers across the world through its foothold on U.S. and Japan.
Scope of the Study
Market Segments Covered in the Report:
By Product Type (Volume, Million Units, USD Million, 2019 to 2030)- Semiconductor Devices
- Integrated Circuits (ICs)
- Transistors
- Diode
- Optoelectronics
- Vacuum Tube
- Display Devices
- Others
- Consumer Electronics
- Networking & Telecommunication
- Manufacturing
- Aerospace & Defense
- Automotive
- Healthcare
- Others
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Key Market Players
List of Companies Profiled in the Report:
- Infineon Technologies AG
- Advanced Micro Devices, Inc.
- STMicroelectronics N.V.
- Microchip Technology, Inc.
- Analog Devices, Inc.
- Broadcom Inc.
- NXP Semiconductors N.V.
- Intel Corporation
- Texas Instruments, Inc.
- Toshiba Corporation
- Skillsoft Corporation
Unique Offerings
- Exhaustive coverage
- The highest number of Market tables and figures
- Subscription-based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Global Active Electronic Component Market by Product Type
Chapter 6. Global Active Electronic Component Market by End-user
Chapter 7. Global Active Electronic Component Market by Region
Chapter 8. Company Profiles
Companies Mentioned
- Infineon Technologies AG
- Advanced Micro Devices, Inc.
- STMicroelectronics N.V.
- Microchip Technology, Inc.
- Analog Devices, Inc.
- Broadcom Inc.
- NXP Semiconductors N.V.
- Intel Corporation
- Texas Instruments, Inc.
- Toshiba Corporation
- Skillsoft Corporation
Methodology
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