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2023 Semiconductor Industry Research Value Pack

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    Report

  • 157 Pages
  • November 2023
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5918214

In-Depth Analysis of the Global Semiconductor Landscape 2022-2026, Focusing on IC Design, Manufacturing, and OSAT Sectors Amidst Economic Challenges

This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.

Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.

List of Topics

  • Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.
  • Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.
  • Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.

Table of Contents

2022 Recap and 2023 Development of the Global IC Design Industry
1. Development of the Global IC Design Industry in 2022
1.1 Ranking of Global Top Ten IC Design Companies in 2022
1.2 IC Design Industry's Overall Performance in 2022

2. Major IC Design Companies' Business Operations in 2022
2.1 Qualcomm & MediaTek
2.2 Nvidia & AMD
2.3 Broadcom & Marvell

3. Development of the Global IC Design Industry in 2023
3.1 Uncertain Outlook for 2H23 Due to Slow Recovery in the Smartphone and PC Markets
3.2 Rise of AI Applications Driving Opportunities for Cloud Server and Edge Computing Chips

Appendix

List of Companies

Table 1 Ranking of Global Top Ten IC Design Companies in 2022

Figure 1 Leading IC Design Companies' Changes in Inventory Turnover Days, 1Q21 - 1Q23
Figure 2 Leading IC Design Companies' Revenue Changes, 1Q22 - 1Q23
Figure 3 Qualcomm's 2022 Revenue by Product Line
Figure 4 MediaTek's 2022 Revenue by Product Line
Figure 5 Nvidia's 2022 Revenue by Product Line
Figure 6 AMD's 2022 Revenue by Product Line
Figure 7 Broadcom's 2022 Revenue by Semiconductor Solutions Product Line
Figure 8 Marvell's 2022 Revenue by Product Line

2022 Recap and 2023 Development of the Worldwide Semiconductor Foundry Industry
1. Global Foundry Industry Recap 2022
1.1 Global Semiconductor Foundry Market Size in 2022
1.2 Top Ten Global Semiconductor Foundry Rankings in 2022
1.3 Overall Performance of the Semiconductor Foundry Industry in 2022

2. Development Trends of Major Semiconductor Foundries in 2022
2.1 TSMC
2.2 Samsung
2.3 UMC, PSMC, Vanguard
2.4 SMIC
2.5 GlobalFoundries

3. Global Semiconductor Foundry Industry Development in 2023
3.1 Foundry Operations Expected to Bottom Out in 1H23, Recovery Pace Remains Uncertain in 2H23
3.2 Intel's New IFS Business Model to Change the Global Semiconductor Foundry Landscape

Appendix

List of Companies

Table 1: Top Ten Global Semiconductor Foundry Rankings in 2022

Figure 1 Comparison of Major Foundries' Gross Margin Changes, 2021 - 2022
Figure 2 TSMC's Revenue Changes by Product Applications, 2021-2022
Figure 3 Samsung's Revenue Changes by Business Segments, 2021-2022
Figure 4 UMC's Revenue Changes by Product Applications, 2021-2022
Figure 5 PSMC's Revenue Changes by Product Applications, 2021-2022
Figure 6 Vanguard's Revenue Changes by Product Applications, 2020-2021
Figure 7 SMIC's Revenue Changes by Product Applications, 2021-2022
Figure 8 GlobalFoundries' Revenue Changes by Product Applications, 2021-2022
Figure 9 Intel's IDM 2.0 Business Model

2022 Recap and 2023 Development of the Global IC Packaging and Testing Industry
1. Recap of the Global IC Packaging and Testing Industry in 2022
1.1 Market Size and Top Ten OSAT Rankings in the Global IC Packaging and Testing Industry in 2022
1.2 Overall Performance of the Global IC Packaging and Testing Industry in 2022

2. Operational Performance of Major OSAT Companies in 2022
2.1 ASE Holdings, PTI, KYEC
2.2 Amkor, JCET

3. Outlook for the Global IC Packaging and Testing Industry
3.1 OSATs Shifting Focus to Automotive Chips While Consumer Electronics Demand Weakening
3.2 Leading Players Accelerate Advanced Packaging Technology Development to Meet Emerging HPC and AI Application Trends

Appendix

List of Companies

Table 1 Global Top Ten OSAT Rankings in 2022

Figure 1: Revenue Changes of Major OSAT Companies, 1Q22 - 2Q23
Figure 2: Gross Margin Changes of Major OSAT Companies, 1Q22 - 2Q23
Figure 3: ASE ATM's Revenue Changes by Product Application, 2020 - 2022
Figure 4: ASE ATM's Revenue Changes by Packaging & Testing Product Portfolio, 2020 - 2022
Figure 5: PTI's Revenue Changes by Services, 2020 - 2022
Figure 6: PTI's Revenue Changes by Products, 2020 - 2022
Figure 7: KYEC's Revenue Changes by Process Nodes, 2020 - 2022
Figure 8: KYEC's Revenue Changes by Product Applications, 2020 - 2022
Figure 9: Amkor's Revenue Changes by Packaging & Testing Types, 2020 - 2022
Figure 10: Amkor's Revenue Changes by End Product Applications, 2020 - 2022
Figure 11: JCET's Revenue Changes by End-Product Applications, 2021 - 2022
Figure 12: Revenue Changes in Major OSAT Companies' Computing Business in 2022

Development of the IC Design Industry and Major Players in China
1. Overview of the IC Design Industry in China
1.1 Changes in the Market Size of the IC Design Industry
1.2 Distribution of IC Design Industry Players
1.2.1 Changes in the Number of IC Design Companies
1.2.2 Distribution of IC Design Industry Players by Scale
1.2.3 Distribution of IC Design Products by Category

2. Development of Major IC Design Companies in China
2.1 Huawei HiSilicon
2.2 Unisoc
2.3 GigaDevice
2.4 Will Semiconductor

3. Development of the IC Design Industry in China
3.1 Independent IC Supply Rate in China
3.2 The Subsequent Impact of the EDA Ban
4. Analyst's Perspective

Appendix

List of Companies

Figure 1. Shipment Value of the Semiconductor Industry in China, 2017-2021
Figure 2. IC Design Market Size and Changes in China, 2017-2022
Figure 3. Changes in the number of IC Design Companies in China from 2016 to 2022
Figure 4. Scale Distribution of IC Design Industry in China in 2022
Figure 5. Distribution of IC Design Product Revenue and Number of IC Design Companies in China
Figure 6. GigaDevice's Financial Report Performance from the First Quarter of 2021 to the Third Quarter of 2022
Figure 7. GigaDevice's Revenue Proportion of Each Product Line, 1H 2020 - 1H 2022
Figure 8. Will Semiconductor's Financial Report Performance, 1Q 2021 - 3Q2022
Figure 9. Revenue Proportion of Will Semiconductor's Product Lines in 2019-2021
Figure 10. Changes in IC Self-Sufficiency Rate in China, 2010-2026

Development of the China IC Packaging and Testing Industry and Key Players
1. Development of China IC Packaging and Testing Industry
1.1 Market Size and Recent Changes in China's IC Packaging and Testing Industry
1.2 Regional Distribution of IC Packaging and Testing Industry Players in China

2. Development of major IC Packaging and Testing Players in China
2.1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies
2.2 Recent Performance of the Top-3 Chinese IC Packaging and Testing Companies
2.2.1 JCET
2.2.2 Tongfu Microelectronics
2.2.3 Huatian Technology

3. Outlook for the Industry
3.1 Effects of National Integrated Circuit Industry Investment Fund
3.2 Impact of US-China Conflict and Decoupling from China
3.3 China Shifting Focus to Automotive Semiconductors Following Obstacles in Advanced Process Technology

Appendix

List of Companies

Table 1 Ranking of the Top-10 Chinese IC Packaging and Testing Companies in 2022

Figure 1 Chinese IC Packaging and Testing Shipment Value, 2018-2022
Figure 2 Regional Distribution of IC Packaging and Testing Brands in China
Figure 3 Financial Information of JCET, 2018-2022
Figure 4 Revenue of JCET by Product Application, 2021-2022
Figure 5 Financial Information of Tongfu Microelectronics, 2018-2022
Figure 6 Financial Information of Huatian Technology, 2018-2022

Taiwanese Semiconductor Industry Landscape, 2023 and Beyond
Taiwan's Global Position and Development in the Semiconductor Industry

Development of Taiwan's Major Semiconductor Industry Sectors

Key Developments in the Taiwan Semiconductor Industry, 3Q 2023 and Beyond

1. Development of the Semiconductor Industry
1.1 IC Design
1.1.1 Peak Season Performance Fails to Meet Expectations in 2H23
1.1.2 IC Design Firms Diversify into Multiple Applications amid Continued AI Boom
1.2 IC Manufacturing
1.2.1 Wafer Foundry Outlook Cautious due to Low Order Visibility
1.2.2 Memory Supply and Demand Expected to Stabilize during 4Q23 to 1H24
1.3 IC Packaging and Testing
1.3.1 Peak Season Effect Depending on Consumer Market Momentum Pickups
1.3.2 Emerging Trends in HPC and AI Applications Continue to Drive Demand for Advanced Packaging and Testing

Appendix

List of Companies

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Alchip
  • Amazon
  • AMD
  • Amkor
  • Apple
  • Ardentec
  • ASE Group
  • ASE Holdings
  • ASEN Semiconductors
  • Baidu
  • Biren
  • Bitmain
  • Bosch
  • Broadcom
  • Cadence
  • China Wafer Level
  • Chipmore Technology
  • ChipMOS
  • Chrysler
  • DB HiTek
  • Dell
  • Denso
  • Episil
  • Faraday
  • FlipChip International
  • FocalTech
  • Ford
  • Forehope Electronic
  • Formosa Advanced
  • Geely
  • General Motors
  • GigaDevice
  • Global Unichip
  • GlobalFoundries
  • Google
  • Hana Microelectronics
  • Himax
  • HiSilicon
  • Hongxin Semiconductor
  • HP
  • HSMC
  • Hua Hong Semiconductor
  • Huahong Group
  • Huatian Technology
  • Huawei
  • Huawei HiSilicon
  • Infineon
  • Intel
  • Inventec
  • JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.)
  • Jinan Quanxin
  • Kore Semiconductor
  • KYEC (King Yuan Electronics Co., Ltd.)
  • Lingsen Precision
  • Macronix
  • Marvell
  • MediaTek
  • Micron
  • Mosel
  • Nanya Technology
  • Nepes
  • Nexchip
  • Novatek
  • Nuvoton
  • Nvidia
  • NXP
  • OmniVision
  • Onsemi
  • Open AI
  • Orient Semiconductor
  • Payton Technology
  • Powertech Technology
  • PSMC (Powerchip Semiconductor Manufacturing Corporation)
  • PTI (Powertech Technology Inc.)
  • Qorvo
  • Qualcomm
  • Quanta
  • RDA Microelectronics
  • Realtek
  • Samsung
  • SFA
  • Siemens 
  • Sigurd Microelectronics
  • Silead
  • Siliconware
  • SJ Semiconductor
  • SK Hynix
  • Skyworks
  • SMIC (Semiconductor Manufacturing International Corporation)
  • Sony
  • Spreadtrum
  • STATS ChipPAC
  • STMicroelectronics
  • Sunplus
  • Supermicro
  • Synopsys
  • Texas Instruments
  • Tongfu Electronics
  • Tongfu Microelectronics
  • Tower
  • Tsinghua Unigroup 
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • UMC (United Microelectronics Corporation)
  • Unimos Microelectronics
  • Unisem
  • Unisoc
  • Unitech Holdings
  • UTAC
  • VIS
  • VSI (Vanguard)
  • Walton Advanced Engineering
  • Will Semiconductor
  • Winbond
  • Wise Road Capital
  • Wistron
  • Xilinx
  • YTEC

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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