Semiconductor Bonding Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, 2021-2031

The Global Semiconductor Bonding Market is projected to expand from USD 1.01 Billion in 2025 to USD 1.22 Billion by 2031, reflecting a compound annual growth rate of 3.21%. This specialized manufacturing process is essential for joining dies or wafers to establish the requisite mechanical stability and electrical connectivity within microelectromechanical systems and integrated circuits. Market growth is principally underpinned by the rising need for device miniaturization within the consumer electronics sector and the vigorous development of the electric vehicle industry, both of which demand highly reliable interconnect solutions. Furthermore, the infrastructure necessities for 5G telecommunications are driving the uptake of advanced packaging architectures to manage higher data velocities, a trend highlighted by SEMI’s forecast that global sales of packaging and assembly equipment will rise to $5.4 billion in 2025, signaling strong investment momentum.

Nevertheless, a major obstacle impeding more extensive market growth is the substantial capital expenditure necessary for next-generation bonding machinery. As the industry moves toward heterogeneous integration, the technical intricacy involved in bonding dissimilar materials with varying thermal coefficients demands machinery that is both highly precise and costly. This significant financial load creates a high entry barrier for smaller outsourced assembly and test service providers, potentially stalling the widespread implementation of advanced bonding capabilities essential for upcoming semiconductor applications.

Market Drivers

The rising complexity of System-in-Package (SiP) architectures and heterogeneous integration is fundamentally transforming the semiconductor bonding sector. As the industry shifts from monolithic die designs toward chiplet-based frameworks, there is an intensified need for high-precision bonding solutions, particularly thermocompression and hybrid bonding, to secure reliable electrical interconnects between vertically stacked dies. This technological evolution is prompting leading foundries to undertake aggressive capital spending to expand their 3D and 2.5D packaging capacities. For instance, TSMC confirmed in October 2024 its intention to double its Chip-on-Wafer-on-Substrate (CoWoS) production capacity annually through 2025, aiming for a monthly output of approximately 80,000 wafers to alleviate the supply deficit for AI accelerators, a move that directly drives the increased procurement of specialized equipment for fine-pitch interconnects.

Simultaneously, the rapid expansion of high-performance computing and artificial intelligence chip manufacturing serves as a vital catalyst for the bonding market. AI processors require substantial memory bandwidth, necessitating the widespread use of High Bandwidth Memory (HBM), which depends heavily on sophisticated through-silicon via (TSV) stacking and bonding techniques. To sustain this trend, major memory producers are building dedicated packaging infrastructure, as evidenced by SK Hynix’s April 2024 announcement of a $3.87 billion investment to build an advanced packaging plant in Indiana dedicated to next-generation HBM production. This strategic growth is bolstered by a rebounding market; the Semiconductor Industry Association projected in December 2024 that global semiconductor sales would rise by 19.0% year-over-year to $626.9 billion, signaling robust momentum for equipment investment.

Market Challenges

The immense capital expenditure necessary for next-generation bonding equipment constitutes a major barrier to broader market expansion. As the industry advances toward heterogeneous integration, the requirement for machinery capable of performing sub-micron alignment and bonding dissimilar materials with distinct thermal coefficients drastically elevates manufacturing costs. This financial intensity establishes a formidable barrier to entry that disproportionately impacts smaller outsourced assembly and test service providers, who frequently lack the capital resources available to major integrated device manufacturers. Consequently, this dynamic constrains the competitive landscape and consolidates advanced bonding capabilities within a select group of well-funded entities, potentially leading to supply chain bottlenecks.

This concentration of market dominance hinders the universal deployment of advanced packaging technologies, especially in cost-sensitive applications where smaller companies are unable to amortize the substantial equipment expenses. The rising financial pressure on the supply chain is reflected in recent investment patterns, with SEMI reporting that global sales of assembly and packaging equipment rose by 25.4% in 2024. This significant increase in equipment spending highlights the escalating financial threshold needed to maintain competitiveness, effectively precluding smaller market participants from modernizing their infrastructure and delaying the widespread implementation of essential interconnect solutions.

Market Trends

The introduction of glass substrate interposers marks a significant advancement in semiconductor bonding, developed to address the physical scaling constraints of organic materials in high-performance computing. In contrast to conventional organic or silicon interposers, glass provides exceptional thermal stability and ultra-flat surfaces, which facilitate tighter bonding pitches and enhanced electrical performance for intricate multi-die packages. This shift in materials supports higher interconnect density, a necessity for next-generation AI processors demanding substantial data throughput, and industrial readiness is growing quickly as key suppliers expand manufacturing; for example, SKC’s subsidiary Absolics completed the industry’s first commercial glass substrate plant in Georgia, United States, in July 2024 following a strategic investment of roughly $222 million.

Concurrently, the growth of Fan-Out Panel-Level Packaging (FOPLP) is transforming the market by improving manufacturing efficiency and lowering unit costs. By shifting bonding operations from circular wafers to larger rectangular panels, manufacturers can vastly increase the usable area for die placement, thereby enhancing throughput and reducing waste relative to standard wafer-level methods. This transition is especially significant for power management ICs and is increasingly being adopted for high-end logic applications to mitigate capacity limitations in Chip-on-Wafer-on-Substrate (CoWoS) supply chains, a strategic shift illustrated by ASE Technology Holding Co., Ltd., whose Chief Operating Officer announced in February 2024 an allocation of $200 million for FOPLP equipment to launch a dedicated production line in Kaohsiung.

Key Players Profiled in the Semiconductor Bonding Market

• BASF SE.
• Indium Corporation.
• Intel Corporation.
• Hitachi Chemical Co. Ltd.
• KYOCERA Corporation
• Henkel AG & Company KGAA.
• Nichia Corporation
• Intel Corporation and UTAC Holdings Ltd.
• International Quantum Epitaxy PLC

Report Scope

In this report, the Global Semiconductor Bonding Market has been segmented into the following categories:

Semiconductor Bonding Market, by Type:

• Die Bonder
• Wafer Bonder
• Flip Chip Bonder

Semiconductor Bonding Market, by Process Type:

• Die To Die Bonding
• Die To Wafer Bonding
• Wafer To Wafer Bonding

Semiconductor Bonding Market, by Bonding Technology:

• Die Bonding Technology
• Wafer Bonding Technology

Semiconductor Bonding Market, by Application:

• RF Devices
• Mems and Sensors
• CMOS Image Sensors
• LED
• 3D NAND

Semiconductor Bonding Market, by Region:

• North America
• Europe
• Asia-Pacific
• South America
• Middle East & Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Bonding Market.

Available Customization

The analyst offers customization according to your specific needs. The following customization options are available for the report:

• Detailed analysis and profiling of additional market players (up to five).

This product will be delivered within 1-3 business days.