+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Molded Interconnect Device (MID) Market Report: Trends, Forecast and Competitive Analysis to 2030

  • PDF Icon

    Report

  • 150 Pages
  • January 2024
  • Region: Global
  • Lucintel
  • ID: 5929284

Molded Interconnect Device (MID) Trends and Forecast

The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

Molded Interconnect Device (MID) by Segment

The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.

Molded Interconnect Device (MID) Market by Product Type [Shipment Analysis by Value from 2018 to 2030]

  • Antennae & Connectivity Modules
  • Sensors
  • Connectors & Switches
  • Lighting Systems
  • Others

Molded Interconnect Device (MID) Market by Process [Shipment Analysis by Value from 2018 to 2030]

  • Laser Direct Structuring
  • Two-Shot Molding
  • Film Techniques

Molded Interconnect Device (MID) Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace
  • Others

Molded Interconnect Device (MID) Market by Region [Shipment Analysis by Value from 2018 to 2030]

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Molded Interconnect Device (MID) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-
  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Molded Interconnect Device (MID) Market Insights

The publisher forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Within this market, automotive is expected to witness the highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Features of the Global Molded Interconnect Device (MID) Market

  • Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
  • Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).
  • Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the molded interconnect device (MID) market size?
Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.

Q2. What is the growth forecast for molded interconnect device (MID) market?
Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?
Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

Q4. What are the major segments for molded interconnect device (MID) market?
Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.

Q5. Who are the key molded interconnect device (MID) market companies?
Answer: Some of the key molded interconnect device (MID) companies are as follows:
  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas
Q6. Which molded interconnect device (MID) market segment will be the largest in future?
Answer: The publisher forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Q.8 Do we receive customization in this report?
Answer: Yes,the publisher provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the molded interconnect device (MID) market by product type (antennae & connectivity modules, sensors, connectors & switches, lighting systems, and others), process (laser direct structuring, two-shot molding, and film techniques), end use industry (telecommunications, consumer electronics, automotive, medical, industrial, military & aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?


This product will be delivered within 1-3 business days.

Table of Contents

1. Executive Summary
2. Global Molded Interconnect Device (MID) Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Molded Interconnect Device (MID) Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Molded Interconnect Device (MID) Market by Product Type
3.3.1: Antennae & Connectivity Modules
3.3.2: Sensors
3.3.3: Connectors & Switches
3.3.4: Lighting Systems
3.3.5: Others
3.4: Global Molded Interconnect Device (MID) Market by Process
3.4.1: Laser Direct Structuring
3.4.2: Two-Shot Molding
3.4.3: Film Techniques
3.5: Global Molded Interconnect Device (MID) Market by End Use Industry
3.5.1: Telecommunications
3.5.2: Consumer Electronics
3.5.3: Automotive
3.5.4: Medical
3.5.5: Industrial
3.5.6: Military & Aerospace
3.5.7: Others
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Molded Interconnect Device (MID) Market by Region
4.2: North American Molded Interconnect Device (MID) Market
4.2.1: North American Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
4.3: European Molded Interconnect Device (MID) Market
4.3.1: European Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
4.3.2: European Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
4.4: APAC Molded Interconnect Device (MID) Market
4.4.1: APAC Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
4.4.2: APAC Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
4.5: ROW Molded Interconnect Device (MID) Market
4.5.1: ROW Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
4.5.2: ROW Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Product Type
6.1.2: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Process
6.1.3: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by End Use Industry
6.1.4: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Region
6.2: Emerging Trends in the Global Molded Interconnect Device (MID) Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Molded Interconnect Device (MID) Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Molded Interconnect Device (MID) Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Molex
7.2: TE Connectivity
7.3: Amphenol
7.4: LPKF Laser & Electronics
7.5: Taoglas

Companies Mentioned

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Methodology

The analyst has been in the business of market research and management consulting since 2000 and has published over 600 market intelligence reports in various markets/applications and served over 1,000 clients worldwide. Each study is a culmination of four months of full-time effort performed by the analyst team. The analysts used the following sources for the creation and completion of this valuable report:

  • In-depth interviews of the major players in the market
  • Detailed secondary research from competitors’ financial statements and published data
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of professionals, who have analyzed and tracked the market over the years.

Extensive research and interviews are conducted in the supply chain of the market to estimate market share, market size, trends, drivers, challenges and forecasts.

Thus, the analyst compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. The analyst then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process.

 

Loading
LOADING...