The interconnect and passive components market size is expected to see strong growth in the next few years. It will grow to $289.83 billion in 2030 at a compound annual growth rate (CAGR) of 6.6%. The growth in the forecast period can be attributed to demand for compact high performance electronics, rising use of high speed data transmission systems, growth of automotive electronics and ev circuitry, increasing deployment of 5g and iot devices, focus on energy efficient and thermally stable passive components. Major trends in the forecast period include increasing miniaturization of passive components, growing demand for high frequency interconnect solutions, rising use of advanced materials for thermal stability, expansion of modular and high density connector systems, increasing integration of passive components in embedded designs.
The growing manufacturing of consumer electronics is set to be a key driver of the interconnect and passive components market's expansion in the foreseeable future. Consumer electronics encompass a wide range of electronic devices and gadgets designed for individual use, serving purposes such as entertainment, communication, and productivity. With the surge in consumer electronics production, there is an increasing demand for interconnect and passive components that enable seamless connectivity, support miniaturization, and enhance the functionality of these devices. This is especially crucial in meeting the requirements of modern products, characterized by complexity and integration. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported that total electronic equipment production in Japan reached $6.72 billion (¥771,457 million). Furthermore, the production of consumer electronics soared to $280 million (¥32,099 million) in May 2023, a notable increase from $230.9 million (¥25,268 million) in May 2022. As a result, the upsurge in consumer electronics manufacturing will be a driving force behind the expansion of the interconnect and passive components market.
Major players in the interconnect and passive components market are dedicated to innovating components, particularly high-frequency passive components, to bolster dependable and high-performance satellite communication, thereby securing their positions in the market. For example, in August 2023, Smiths Interconnect Inc., a US-based manufacturer of electronic components, unveiled its line of E-Band passive components, including WR12 couplers, loads, and isolators. These broadband WR12 waveguide components are meticulously engineered to meet the requirements of next-generation E-Band terrestrial uplinks to Low Earth Orbit (LEO) constellations and payloads, efficiently handling the high RF power essential for robust communication links. This product series is ideally suited for critical applications, including prestigious space missions, and is developed, manufactured, and tested in-house. The WR12 waveguide hybrids are designed for global applicability, offering extensive tuning, high-power termination, and consistent performance across the 71-76 and 81-86 GHz frequency bands.
In May 2024, Amphenol Corporation, a US-based electronic connector manufacturing company, acquired Carlisle Interconnect Technologies (CIT) for $2.025 billion. This acquisition strengthens Amphenol's ability to deliver advanced interconnect solutions for the commercial aerospace, defense, and industrial markets. Carlisle Interconnect Technologies, also based in the US, is a manufacturer of high-performance wire and cable, including optical fiber.
Major companies operating in the interconnect and passive components market are Foxconn Electronics Inc., Nichicon Corporation, Koch Industries Inc, Panasonic Corporation, Cisco Systems Inc, KYOCERA AVX Components Corporation, TE Connectivity Corporation, TDK Corporation, Molex Incorporated, YAZAKI Corporation, Amphenol Corporation, Murata Manufacturing Co. Ltd, Samsung Electro-Mechanics Co. Ltd., AMETEK Inc., Hubbell Inc., Delphi Technologies PLC, Yageo Corporation, Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co. Ltd., Japan Aviation Electronics Industry Ltd., KEMET Electronics Corporation, HIROSE ELECTRIC CO., Sumida Corporation, TT Electronics PLC, Rubycon Corporation, Pulse Electronics Corporation, J.S.T. Mfg. Co., Chogori Technology Co. Ltd., Zeeteq Electronics Co. Ltd.
Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report’s Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.
Tariffs on metals, electronic components, and specialized materials have raised production and assembly costs for interconnects and passive components, particularly affecting consumer electronics, telecommunication equipment, and automotive electronics markets across Asia Pacific and North America. These tariffs disrupt supply chains, delay shipments, and increase pricing pressures; however, they also encourage regional manufacturing expansion, localization of component production, and innovation in cost efficient and alternative material technologies, ultimately driving long term resilience in the market.
The interconnect and passive components market research report is one of a series of new reports that provides interconnect and passive components market statistics, including interconnect and passive components industry global market size, regional shares, competitors with a interconnect and passive components market share, detailed interconnect and passive components market segments, market trends and opportunities and any further data you may need to thrive in the interconnect and passive components industry. This interconnect and passive components market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future- scenario of the industry.
Interconnects and passive components are hardware components that enable the transmission of signals and power between electronic elements, with resistors and capacitors functioning as passive components that facilitate signal processing without generating energy. These components are instrumental in establishing connections, managing signals, and ensuring the overall functionality of electronic devices.
The primary categories of interconnects and passive components include passive components and interconnects. Passive components are electronic elements that do not actively amplify or control electrical signals but play a vital role in manipulating and shaping electronic signals within circuits for various purposes, including filtering, signal conditioning, and energy storage. Interconnects and passive components find applications in a wide range of fields, including consumer electronics, data processing, telecommunications, military and aerospace, automotive, industrial, and healthcare.Asia-Pacific was the largest region in the interconnect and passive components market in 2025. The regions covered in the interconnect and passive components market report are Asia-Pacific, South East Asia, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the interconnect and passive components market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Taiwan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
The interconnect and passive components market consists of revenues earned by entities by providing signal transmission and routing, voltage regulation and power distribution, passive sensing and measurement and protection and ESD (electrostatic discharge) handling. The market value includes the value of related goods sold by the service provider or included within the service offering. The interconnect and passive components market also includes sales of resistors, inductors, printed circuit boards, switches and diodes. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
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Table of Contents
Executive Summary
Interconnect And Passive Components Market Global Report 2026 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses interconnect and passive components market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for interconnect and passive components? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The interconnect and passive components market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, total addressable market (TAM), market attractiveness score (MAS), competitive landscape, market shares, company scoring matrix, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market. This section also examines key products and services offered in the market, evaluates brand-level differentiation, compares product features, and highlights major innovation and product development trends.
- The supply chain analysis section provides an overview of the entire value chain, including key raw materials, resources, and supplier analysis. It also provides a list competitor at each level of the supply chain.
- The updated trends and strategies section analyses the shape of the market as it evolves and highlights emerging technology trends such as digital transformation, automation, sustainability initiatives, and AI-driven innovation. It suggests how companies can leverage these advancements to strengthen their market position and achieve competitive differentiation.
- The regulatory and investment landscape section provides an overview of the key regulatory frameworks, regularity bodies, associations, and government policies influencing the market. It also examines major investment flows, incentives, and funding trends shaping industry growth and innovation.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.
- The total addressable market (TAM) analysis section defines and estimates the market potential compares it with the current market size, and provides strategic insights and growth opportunities based on this evaluation.
- The market attractiveness scoring section evaluates the market based on a quantitative scoring framework that considers growth potential, competitive dynamics, strategic fit, and risk profile. It also provides interpretive insights and strategic implications for decision-makers.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
- Expanded geographical coverage includes Taiwan and Southeast Asia, reflecting recent supply chain realignments and manufacturing shifts in the region. This section analyzes how these markets are becoming increasingly important hubs in the global value chain.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The company scoring matrix section evaluates and ranks leading companies based on a multi-parameter framework that includes market share or revenues, product innovation, and brand recognition.
Scope
Markets Covered:
1) By Product: Passive Components; Interconnects2) By Application: Consumer Electronics; Data Processing; Telecommunication; Military And Aerospace; Automotive; Industrial; Healthcare
3) By Mounting Technology: Surface Mount Technology (SMT); Through-Hole Technology (THT)
Subsegments:
1) By Passive Components: Resistors; Capacitors; Inductors; Filters; Crystals And Oscillators; Sensors2) By Interconnects: Connectors; Cables And Wires; Circuit Board Connectors; Terminals; Adapters; Sockets And Plugs
Companies Mentioned: Foxconn Electronics Inc.; Nichicon Corporation; Koch Industries Inc; Panasonic Corporation; Cisco Systems Inc; KYOCERA AVX Components Corporation; TE Connectivity Corporation; TDK Corporation; Molex Incorporated; YAZAKI Corporation; Amphenol Corporation; Murata Manufacturing Co. Ltd; Samsung Electro-Mechanics Co. Ltd.; AMETEK Inc.; Hubbell Inc.; Delphi Technologies PLC; Yageo Corporation; Vishay Intertechnology Inc.; Bourns Inc.; Taiyo Yuden Co. Ltd.; Japan Aviation Electronics Industry Ltd.; KEMET Electronics Corporation; HIROSE ELECTRIC CO.; Sumida Corporation; TT Electronics PLC; Rubycon Corporation; Pulse Electronics Corporation; J.S.T. Mfg. Co.; Chogori Technology Co. Ltd.; Zeeteq Electronics Co. Ltd.
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Taiwan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
Regions: Asia-Pacific; South East Asia; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: Word, PDF or Interactive Report + Excel Dashboard
Added Benefits:
- Bi-Annual Data Update
- Customisation
- Expert Consultant Support
Companies Mentioned
The companies featured in this Interconnect and Passive Components market report include:- Foxconn Electronics Inc.
- Nichicon Corporation
- Koch Industries Inc
- Panasonic Corporation
- Cisco Systems Inc
- KYOCERA AVX Components Corporation
- TE Connectivity Corporation
- TDK Corporation
- Molex Incorporated
- YAZAKI Corporation
- Amphenol Corporation
- Murata Manufacturing Co. Ltd
- Samsung Electro-Mechanics Co. Ltd.
- AMETEK Inc.
- Hubbell Inc.
- Delphi Technologies PLC
- Yageo Corporation
- Vishay Intertechnology Inc.
- Bourns Inc.
- Taiyo Yuden Co. Ltd.
- Japan Aviation Electronics Industry Ltd.
- KEMET Electronics Corporation
- HIROSE ELECTRIC CO.
- Sumida Corporation
- TT Electronics PLC
- Rubycon Corporation
- Pulse Electronics Corporation
- J.S.T. Mfg. Co.
- Chogori Technology Co. Ltd.
- Zeeteq Electronics Co. Ltd.
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 250 |
| Published | January 2026 |
| Forecast Period | 2026 - 2030 |
| Estimated Market Value ( USD | $ 224.43 Billion |
| Forecasted Market Value ( USD | $ 289.83 Billion |
| Compound Annual Growth Rate | 6.6% |
| Regions Covered | Global |
| No. of Companies Mentioned | 31 |


