Hybrid Memory Cube Market - Forecasts from 2024 to 2029

The hybrid memory cube market was valued at US$1, 233.443 million in 2022.

The Hybrid Memory Cube (HMC) is a superior presentation PC irregular access memory (Slam) interface for through-silicon vias (TSV)- based stacked Measure memory. It was co-developed by Samsung Electronics and Micron Technology in 2011 and promised a 15 times speed improvement over DDR3.The HMC is competing with the incompatible rival interface High Bandwidth Memory (HBM). HMC is a high-performance memory technology that combines DRAM and logic on a single chip. This is achieved by stacking multiple DRAM dies on top of a logic die using through-silicon via (TSV) technology. TSVs are tiny electrical connections that pass through the silicon substrate, allowing the DRAM dies to communicate with the logic die. The HMC Gen2 data sheet by Micron Technology explains that it is a single package containing four DRAM dies and one logic die, all stacked together using TSV technology.

Introduction:

The hybrid memory cube market deals in the development, manufacturing, and sale of HMC technology. HMC is a type of 3D memory that is stacked vertically, rather than horizontally. This allows for higher memory density and bandwidth than traditional DRAM. HMC is used in a variety of applications, including high-performance computing, networking, and artificial intelligence. The hybrid memory cube (HMC) market is still in its infancy, but it is poised for rapid growth in the years to come. This is driven by the growing demand for high-performance memory in a wide range of applications. The main drivers of the HMC market are mainly attributed to the growth of the high-performance computing market, the increasing adoption of artificial intelligence, and the need for high-bandwidth memory in networking applications. The major players in the HMC market are Micron Technologies, Intel Corporation, Fujitsu Ltd., Semtech Corporation, and Open Silicon Inc. These companies are investing heavily in the development and commercialization of HMC technology.

Drivers:

• Growing need for high bandwidth, low power consumption, and highly scalable memories:The HMC technology provides high bandwidth and low power consumption, which is essential for high-performance computing, networking, and data centers. The HMC market is expected to grow due to the increasing demand for high-bandwidth, low-power-consuming, and scalable memories.
• Rising impact of cloud services:The HMC technology is expected to play a significant role in cloud services, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the rising impact of cloud services.
• Increasing demand for mobility:The HMC technology is expected to be used in mobile devices, which require high-performance computing and high-bandwidth memory. The HMC market is expected to grow due to the increasing demand for mobility.
• New collaborations with industry players:To launch HMC products in the market, companies focus on new collaborations with industry players who could use and integrate HMC technology into their products. For example, Micron Technology and Intel Corporation have a long-standing partnership in the development and manufacturing of memory products. One of the most notable outcomes of this partnership is the Hybrid Memory Cube (HMC), a revolutionary memory technology that combines the speed of DRAM with the density of flash memory.

Products offered by key companies:

• Fujitsu's PRIMEHPC FX100 supercomputer uses the state-of-the-art 3D-stacked Hybrid Memory Cube (HMC) technology, achieving a high memory bandwidth of 480 GB/s.
• Samsung's HBM2 (High Bandwidth Memory) technology is a type of HMC that is used in graphics cards, high-performance computing, and networking applications. HBM2 provides high bandwidth and low power consumption, which is essential for high-performance computing and high-bandwidth memory.
• Intel's Stratix 10 FPGA (Field Programmable Gate Array) uses HMC technology to provide high bandwidth and low power consumption, which is essential for high-performance computing and networking.

Prominent growth in the Graphics Processing Unit (GPU) segment within the hybrid memory cube market:

The Graphics Processing Unit (GPU) segment is experiencing prominent growth within the Hybrid Memory Cube (HMC) market. GPUs are essential for high-performance computing, gaming, and artificial intelligence applications, which require high bandwidth and low latency memory solutions. The HMC technology, with its 3D-stacked architecture and through-silicon via (TSV) technology, provides the necessary high bandwidth and low power consumption for GPUs to deliver optimal performance. As the demand for advanced graphics and AI-driven applications continues to rise, the GPU segment within the HMC market is expected to witness significant growth.

The Asia Pacific region is expected to hold a significant share of the hybrid memory cube market:

The Asia Pacific region is expected to hold a significant share of the Hybrid Memory Cube (HMC) market. This can be attributed to several factors, including the region's strong presence in the electronics and semiconductor industries, as well as the increasing demand for high-performance computing, gaming, and artificial intelligence applications in countries like China, Japan, and South Korea. Additionally, the rapid growth of cloud services and the adoption of advanced technologies in the Asia Pacific region are driving the need for high-bandwidth, low-power consuming, and highly scalable memory solutions, making it a key market for HMC technology.

Key development:

• In November 2021, Samsung Electronics declared that it has created Hybrid-Substrate Cube (H-Cube) technology, its most recent 2.5D bundling arrangement specific for semiconductors for HPC, computer-based intelligence, server farm and organization items that require high-execution and enormous region bundling technology.

Segments

By Product

• 2 GB
• 4 GB
• 8 GB

By Application

• Graphics Processing Unit (GPU)
• Central Processing Unit (CPU)
• Accelerated Processing Unit (APU)
• Field-programmable Gate Array (FPGA)
• Application-specific Integrated Circuit (ASIC)

By End Use Industry

• Enterprise Storage
• Telecommunications and Networking
• Others

By Geography

• North America
• United States
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• United Kingdom
• Germany
• France
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• Japan
• China
• India
• South Korea
• Indonesia
• Thailand
• Others