The Europe Interposer and Fan-out Wafer Level Packaging Market would witness market growth of 10.7% CAGR during the forecast period (2023-2030).
The Germany market dominated the Europe Interposer and Fan-out Wafer Level Packaging Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,342.3 million by 2030. The UK market is registering a CAGR of 9.7% during (2023 - 2030). Additionally, The France market would showcase a CAGR of 11.6% during (2023 - 2030).
Interposer and fan-out WLP have found extensive applications in the consumer electronics sector. The demand for compact and powerful devices, such as smartphones, wearables, and tablets, has driven the integration of these packaging technologies to achieve smaller form factors and improved performance. The automotive industry has embraced interposer and fan-out WLP for applications ranging from advanced driver-assistance systems (ADAS) to in-vehicle infotainment. These packaging solutions provide reliability, durability, and performance in the challenging automotive environment.
Furthermore, in the telecommunications sector, the demand for high-speed and high-frequency components has led to the adoption of interposer and fan-out WLP. These technologies enable the integration of advanced communication devices with enhanced signal integrity and reduced signal losses. With the exponential growth of data and the demand for increased computing power, interposer and fan-out WLP have become integral to data center solutions. These packaging technologies facilitate the development of high-performance processors, memory modules, and interconnects for efficient data processing and storage.
As per the International Trade Administration data, in 2022, UK civil aerospace turnover totaled approximately $34.5 billion. The UK aerospace industry is the crown jewel for UK exports, and even though the UK does not produce large civil aircraft, 70% of domestic aerospace production is exported. In 2022, the UK defense industry turnover totaled approximately $29 billion, $15 billion of which was exported. In 2021, the UK space industry turnover totaled approximately $22 billion, $9.5 billion of which was exported. Thus, the rising aerospace sector in Europe will increase demand for interposer and fan-out wafer level packaging in the region.
Based on Packaging Component & Design, the market is segmented into Interposer, and FOWLP. Based on Packaging Type, the market is segmented into 2.5D, and 3D. Based on Device Type, the market is segmented into Memory Devices, Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, and Others. Based on Vertical, the market is segmented into Consumer Electronics, Communications, Manufacturing, Automotive, Aerospace, Medical Devices, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The Germany market dominated the Europe Interposer and Fan-out Wafer Level Packaging Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,342.3 million by 2030. The UK market is registering a CAGR of 9.7% during (2023 - 2030). Additionally, The France market would showcase a CAGR of 11.6% during (2023 - 2030).
Interposer and fan-out WLP have found extensive applications in the consumer electronics sector. The demand for compact and powerful devices, such as smartphones, wearables, and tablets, has driven the integration of these packaging technologies to achieve smaller form factors and improved performance. The automotive industry has embraced interposer and fan-out WLP for applications ranging from advanced driver-assistance systems (ADAS) to in-vehicle infotainment. These packaging solutions provide reliability, durability, and performance in the challenging automotive environment.
Furthermore, in the telecommunications sector, the demand for high-speed and high-frequency components has led to the adoption of interposer and fan-out WLP. These technologies enable the integration of advanced communication devices with enhanced signal integrity and reduced signal losses. With the exponential growth of data and the demand for increased computing power, interposer and fan-out WLP have become integral to data center solutions. These packaging technologies facilitate the development of high-performance processors, memory modules, and interconnects for efficient data processing and storage.
As per the International Trade Administration data, in 2022, UK civil aerospace turnover totaled approximately $34.5 billion. The UK aerospace industry is the crown jewel for UK exports, and even though the UK does not produce large civil aircraft, 70% of domestic aerospace production is exported. In 2022, the UK defense industry turnover totaled approximately $29 billion, $15 billion of which was exported. In 2021, the UK space industry turnover totaled approximately $22 billion, $9.5 billion of which was exported. Thus, the rising aerospace sector in Europe will increase demand for interposer and fan-out wafer level packaging in the region.
Based on Packaging Component & Design, the market is segmented into Interposer, and FOWLP. Based on Packaging Type, the market is segmented into 2.5D, and 3D. Based on Device Type, the market is segmented into Memory Devices, Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, and Others. Based on Vertical, the market is segmented into Consumer Electronics, Communications, Manufacturing, Automotive, Aerospace, Medical Devices, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
List of Key Companies Profiled
- Taiwan Semiconductor Manufacturing Company Limited
- Samsung Electronics Co., Ltd. (Samsung Group)
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- JCET Group
- Powertech Technology, Inc.
- Advanced Micro Devices, Inc.
- Samtec
- SK hynix, Inc.
- Deca Technologies, Inc. (Infineon Technologies AG)
Market Report Segmentation
By Packaging Component & Design- Interposer
- FOWLP
- 2.5D
- 3D
- Memory Devices
- Logic ICs
- Imaging & Optoelectronics
- LEDs
- MEMS/Sensors
- Others
- Consumer Electronics
- Communications
- Manufacturing
- Automotive
- Aerospace
- Medical Devices
- Others
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market at a Glance
Chapter 3. Market Overview
Chapter 4. Competition Analysis - Global
Chapter 5. Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
Chapter 6. Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
Chapter 7. Europe Interposer and Fan-out Wafer Level Packaging Market by Device Type
Chapter 8. Europe Interposer and Fan-out Wafer Level Packaging Market by Vertical
Chapter 9. Europe Interposer and Fan-out Wafer Level Packaging Market by Country
Chapter 10. Company Profiles
Companies Mentioned
- Taiwan Semiconductor Manufacturing Company Limited
- Samsung Electronics Co., Ltd. (Samsung Group)
- ASE Group (ASE Technology Holding Co., Ltd.)
- Amkor Technology, Inc.
- JCET Group
- Powertech Technology, Inc.
- Advanced Micro Devices, Inc.
- Samtec
- SK hynix, Inc.
- Deca Technologies, Inc. (Infineon Technologies AG)
Methodology
LOADING...
