EMEA and APAC solder materials market is expected to grow from US$ 4.73 billion in 2022 and is projected to reach US$ 6.72 billion by 2030. It is expected to grow at a CAGR of 4.5% from 2022 to 2030.
The solder material encompasses a wide range of products employed in electronics assembly and soldering processes. These materials are crucial in constructing reliable electrical connections between electronic components and circuit boards. The expanding electronics industry, fueled by increasing demand for consumer electronics such as tablets, laptops, and smartphones, is causing the solder materials market. The Europe, Middle East & Africa, and Asia Pacific (EMEA and APAC) solder materials market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication. Furthermore, the trend towards miniaturization and more compact electronic devices requires solder materials capable of forming fine-pitch connections with high reliability. The ongoing research concerning the development of innovative solder materials such as low-temperature solder alloys and no-clean fluxes is a concern for the evolving industry.
Based on product, the EMEA and APAC solder materials market is segmented into paste, bar, wire, spheres, and others. The paste segment is expected to be the fastest-growing segment from 2022 to 2030. Solder paste is used in the electronics industry for surface mount assembly processes. It is a mixture of powdered metals and flux. When heated during soldering, the paste melts, forming a bond between the components and the circuit board. It is used in through-hole pin-in paste components by printing solder paste in/over the holes. The solder paste is applied to the board by stencil printing or jet printing, and the components are put in place through a pick-and-place machine or by hand. However, the right amount of paste is necessary for these processes. During PCB production, printed circuit board (PCB) manufacturers usually test the solder paste deposits through solder paste inspection. The inspection systems measure the volume of the solder pads before the components are applied and the solder is melted.
Further, businesses across almost all industry verticals have realized the importance of communications, IoT, and sensors and have paved the way for integrating sensors into the devices. Numerous business functions such as supply chain planning and logistics and manufacturing across industry verticals such as automotive, healthcare, consumer electronic devices, and aerospace & defense can be optimized, thus enabling increased profitability. The positive impact on the companies' balance sheets due to the integration of sensor-enabled devices into the business processes has led to enormous demands for more such devices. Huge demands are further anticipated to burden the semiconductor industry. Therefore, the growth of solder materials in various IC manufacturing is anticipated to rise rapidly during the forecast period, with IoT gaining more prominence in the coming years. The materials meet standard soldering requirements but also align with the specialized needs of IoT devices, including resistance to environmental factors, temperature variations, and long-term durability. The intricated and diverse nature of IoT applications is anticipated to fuel the growth of the solder materials market as manufacturers adapt and innovate to meet the evolving demands of this dynamic industry.
Indium Corp, Fusion Inc, Element Solutions Inc, KOKI Co Ltd, Stannol GmbH & Co KG, AIM Metals & Alloys LP, Nihon Superior Co Ltd, GENMA Europe GmbH, and National Solder Co Ltd, are among the leading players in the EMEA and APAC solder materials market. These companies are adopting mergers & acquisitions and product launches to expand their geographic presence and consumer bases.
The overall EMEA and APAC solder materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers - along with external consultants, including valuation experts, research analysts, and key opinion leaders - specializing in the EMEA and APAC solder materials market.
Reasons to Buy
The solder material encompasses a wide range of products employed in electronics assembly and soldering processes. These materials are crucial in constructing reliable electrical connections between electronic components and circuit boards. The expanding electronics industry, fueled by increasing demand for consumer electronics such as tablets, laptops, and smartphones, is causing the solder materials market. The Europe, Middle East & Africa, and Asia Pacific (EMEA and APAC) solder materials market is experiencing significant growth, driven primarily by the surging demand from two key industries: automotive and telecommunication. Furthermore, the trend towards miniaturization and more compact electronic devices requires solder materials capable of forming fine-pitch connections with high reliability. The ongoing research concerning the development of innovative solder materials such as low-temperature solder alloys and no-clean fluxes is a concern for the evolving industry.
Based on product, the EMEA and APAC solder materials market is segmented into paste, bar, wire, spheres, and others. The paste segment is expected to be the fastest-growing segment from 2022 to 2030. Solder paste is used in the electronics industry for surface mount assembly processes. It is a mixture of powdered metals and flux. When heated during soldering, the paste melts, forming a bond between the components and the circuit board. It is used in through-hole pin-in paste components by printing solder paste in/over the holes. The solder paste is applied to the board by stencil printing or jet printing, and the components are put in place through a pick-and-place machine or by hand. However, the right amount of paste is necessary for these processes. During PCB production, printed circuit board (PCB) manufacturers usually test the solder paste deposits through solder paste inspection. The inspection systems measure the volume of the solder pads before the components are applied and the solder is melted.
Further, businesses across almost all industry verticals have realized the importance of communications, IoT, and sensors and have paved the way for integrating sensors into the devices. Numerous business functions such as supply chain planning and logistics and manufacturing across industry verticals such as automotive, healthcare, consumer electronic devices, and aerospace & defense can be optimized, thus enabling increased profitability. The positive impact on the companies' balance sheets due to the integration of sensor-enabled devices into the business processes has led to enormous demands for more such devices. Huge demands are further anticipated to burden the semiconductor industry. Therefore, the growth of solder materials in various IC manufacturing is anticipated to rise rapidly during the forecast period, with IoT gaining more prominence in the coming years. The materials meet standard soldering requirements but also align with the specialized needs of IoT devices, including resistance to environmental factors, temperature variations, and long-term durability. The intricated and diverse nature of IoT applications is anticipated to fuel the growth of the solder materials market as manufacturers adapt and innovate to meet the evolving demands of this dynamic industry.
Indium Corp, Fusion Inc, Element Solutions Inc, KOKI Co Ltd, Stannol GmbH & Co KG, AIM Metals & Alloys LP, Nihon Superior Co Ltd, GENMA Europe GmbH, and National Solder Co Ltd, are among the leading players in the EMEA and APAC solder materials market. These companies are adopting mergers & acquisitions and product launches to expand their geographic presence and consumer bases.
The overall EMEA and APAC solder materials market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the market. Also, multiple primary interviews have been conducted with industry participants to validate the data and gain more analytical insights. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers - along with external consultants, including valuation experts, research analysts, and key opinion leaders - specializing in the EMEA and APAC solder materials market.
Reasons to Buy
- Progressive industry trends in the EMEA and APAC solder materials market to help players develop effective long-term strategies
- Business growth strategies adopted by developed and developing markets
- Quantitative analysis of the EMEA and APAC solder materials market from 2020 to 2030
- Estimation of the demand for solder materials across various industries
- Porter's Five Forces analysis to illustrate the efficacy of buyers and suppliers operating in the industry to predict the market growth
- Recent developments to understand the competitive market scenario and the demand for solder materials compounds across the EMEA and APAC
- Market trends and outlook coupled with factors driving and restraining the growth of the EMEA and APAC solder materials market.
- Decision-making process by understanding strategies that underpin commercial interest concerning the EMEA and APAC solder materials market growth
- The EMEA and APAC solder materials market size at various nodes of market
- Detailed overview and segmentation of the EMEA and APAC solder materials market as well as its dynamics in the industry
- The EMEA and APAC solder materials market size in different regions with promising growth opportunities
Table of Contents
1. Introduction
2. Executive Summary
3. Research Methodology
4. EMEA and APAC Solder Materials Market Landscape
5. EMEA and APAC Solder Materials Market - Key Market Dynamics
6. EMEA and APAC Solder Materials Market Analysis
7. EMEA and APAC Solder Materials Market Analysis - by Product
8. EMEA and APAC Solder Materials Market Analysis - by Process
9. EMEA and APAC Solder Materials Market - Geographical Analysis
10. Competitive Landscape
11. Industry Landscape
12. Company Profiles
13. Appendix
List of Tables
List of Figures
Companies Mentioned
- AIM Metals & Alloys LP
- KOKI Co Ltd
- Fusion Inc
- Stannol GmbH & Co KG
- National Solder Co (PTY) Ltd
- Nihon Superior Co Ltd
- GENMA Europe GmbH
- Indium Corp
- Element Solutions Inc
- Harima Chemicals Group Inc
Table Information
| Report Attribute | Details |
|---|---|
| No. of Pages | 159 |
| Published | March 2024 |
| Forecast Period | 2022 - 2030 |
| Estimated Market Value ( USD | $ 4.73 Billion |
| Forecasted Market Value ( USD | $ 6.72 Billion |
| Compound Annual Growth Rate | 4.5% |
| Regions Covered | Africa, Asia Pacific, Europe, Middle East |
| No. of Companies Mentioned | 10 |
