Table of Contents
1. Analysis of Key Issues1.1 IC Design
1.1.1 IC Design Industry Rebounds from High Inventory Shadow but Seasonal Cycle Yet to Fully Recover
1.1.2 Smartphone Supply Chain Replenishment Boosts Small Display Driver ICs; AMOLED Prices Competitive
1.2 IC Manufacturing
1.2.1 Advanced Process Technology Drives Over 60% Revenue; 8” Wafer Capacity Utilization Keeps Declining
1.2.2 Mainstream Memory Market Shows Signs of Recovery; Niche DRAM Demand Rises
1.3 IC Packaging and Testing
1.3.1 IC Packaging and Testing Industry Remains Cautious Despite Suring Short and Urgent Orders for PC and Smartphone Chips
1.3.2 Memory Inventory Clearance Nearing Completion, Driving Growth in Memory Packaging and Testing
2. Industry Outlook
2.1 IC Design
2.1.1 Smartphone Supply Chain Replenishment Momentum Persists, Yet Recovery in Inventory Rebuilding Remains Uncertain
2.1.2 IC Design Companies to Continuously Benefit from Expansion of AI Applications and Trend of ASIC Outsourcing
2.2 IC Manufacturing
2.2.1 First-Quarter Revenue Outlook for Semiconductor Wafer Foundries Conservative as 2024 Market Demand Slowly Recovers
2.2.2 Memory Market Warming Up, Operations Expected to Improve Quarterly
2.3 IC Packaging and Testing
2.3.1 Rising Demand for Emerging Applications Drives Major OSAT Companies to Increase Production Capacity and CapEx
2.3.2 Advanced Packaging Gaining Importance, Leading OSAT Companies to Invest More in Advanced Packaging Technology and Capacity
- Appendix
- List of Companies
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Alchip Technologies
- AMD
- Amkor
- Apple
- ASE Technology
- Chipbond
- ChipMOS
- CHPT
- ESMT
- Faraday Technology
- FocalTech
- Formosa Advanced Technologies
- GUC
- Intel
- Kioxia
- KYEC
- Macronix
- MediaTek
- Micron Technology
- Nanya Technology
- Nexchip
- Nvidia
- OSE
- Phison
- PSMC
- PTI
- Qualcomm
- Raydium
- Samsung
- SBI
- Sensortek
- Sigurd
- Silicon Motion Technology
- Sitronix
- SK Hynix
- Tata Electronics
- TSMC
- UMC
- Walton Advanced Engineering
- Winbond
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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