The semiconductor assembly and testing services market size has grown strongly in recent years. It will grow from $32.78 billion in 2023 to $34.94 billion in 2024 at a compound annual growth rate (CAGR) of 6.6%. The expansion observed during the historical era can be credited to the widespread uptake of smartphones and tablets, the growth in consumer electronics, escalating globalization, the demand for inventive packaging solutions, and the increasing adoption of advanced packaging technologies.
The semiconductor assembly and testing services market size is expected to see strong growth in the next few years. It will grow to $45.67 billion in 2028 at a compound annual growth rate (CAGR) of 6.9%. The forecasted growth can be ascribed to ongoing innovation in semiconductor technologies, the implementation of 5G networks, the proliferation of Internet of Things (IoT) devices, the surge in popularity of electric vehicles, and the widespread adoption of wearable devices. Key trends projected for the forecast period include the expansion of the Internet of Things (IoT), the introduction of 5G networks, the automotive industry's shift towards electric vehicles (EVs), the continuous expansion of cloud computing infrastructure, and the rising adoption of renewable energy technologies.
The semiconductor assembly and testing services market is poised for growth due to the increasing demand for consumer electronics. Consumer electronics are devices designed for end-users for personal use, driven by rising disposable incomes, evolving lifestyles, urbanization, and the growth of e-commerce platforms. These services are crucial for providing reliable semiconductor components that power devices such as smartphones, tablets, laptops, wearables, and smart home appliances. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported a significant increase in consumer electronics production, from $161.17 million (¥25,268 million) in May 2022 to $204.75 million (¥32,099 million) in May 2023, indicating a strong market trend.
Leading companies in this market are leveraging AI-powered software solutions to improve yield in integrated circuit (IC) engineering and production processes. These solutions enhance operational efficiency, raise yield rates, and support continuous improvement initiatives. For instance, in November 2022, Advantest Corporation introduced ACS EASY, an AI-powered software designed to enhance productivity across device engineering and production operations. This user-friendly application utilizes AI to autonomously monitor test conditions and identify potential causes of yield degradation, facilitating issue isolation and analysis during production.
In December 2023, Luxshare Precision Industry Co. Ltd., a China-based electronic component manufacturer, acquired the assembly and test facilities of Qorvo Inc. This strategic move allows Luxshare to offer assembly and testing services for Qorvo products, strengthening its position in the market. Qorvo, Inc., a US-based provider of radio-frequency (RF) components, benefits from this partnership by gaining access to Luxshare's expertise in assembly and testing for mobile, infrastructure, and defense applications.
Major companies operating in the semiconductor assembly and testing services market are Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company, Intel Corporation, Micron Technology Inc., ASE Technology Group, QUALCOMM Inc., Amkor Technology Inc., Teledyne Technologies Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co. Ltd., Tianshui Huatian Technology Co. Ltd, Global Foundries Inc., Integrated Microelectronics Inc., King Yuan Electronics Corp., STATS chipPAC Ltd., ChipMOS Technologies INC., Chipbond Technology Corporation, UTAC Holdings Ltd., Unisem Group, Formosa Advanced Technologies Co. Ltd, Walton Advanced Engineering Inc., Lingsen Precision Industries Ltd., Integra Technologies LLC, Greatek Electronics Inc., CORWIL Technology Corp.
Asia-Pacific was the largest region in the semiconductor assembly and testing services market in 2023. The regions covered in the semiconductor assembly and testing services market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor assembly and testing services market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Semiconductor assembly and testing services involve the assembly of individual semiconductor components into complete integrated circuits (ICs) or chips, followed by testing to ensure functionality, reliability, and quality assurance. These services play a critical role in the semiconductor manufacturing supply chain, ensuring that semiconductor devices meet performance specifications and quality standards prior to being shipped to customers.
The primary services provided in semiconductor assembly and testing include assembly and packaging services, along with testing services. Assembly services involve combining multiple small shipments into a single one for shipping or transportation purposes. Various packaging technologies are utilized, including flip-chip, wire bond, and other packaging technologies tailored to end-use industries such as telecommunications, computing, networking, consumer electronics, industrial applications, automotive electronics, and more.
The semiconductor assembly and testing services market research report is one of a series of new reports that provides semiconductor assembly and testing services market statistics, including semiconductor assembly and testing services industry global market size, regional shares, competitors with a semiconductor assembly and testing services market share, detailed semiconductor assembly and testing services market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor assembly and testing services industry. This semiconductor assembly and testing services market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor assembly and testing services market consist of revenues earned by entities by providing services such as wafer-level packaging (WLP), chip-on-board (COB), system-in-package (SiP), and final testing. The market value includes the value of related goods sold by the service provider or included within the service offering. The semiconductor assembly and testing services market also includes sales of assembly equipment, testing equipment, packaging equipment, and metrology and inspection equipment. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
The semiconductor assembly and testing services market size is expected to see strong growth in the next few years. It will grow to $45.67 billion in 2028 at a compound annual growth rate (CAGR) of 6.9%. The forecasted growth can be ascribed to ongoing innovation in semiconductor technologies, the implementation of 5G networks, the proliferation of Internet of Things (IoT) devices, the surge in popularity of electric vehicles, and the widespread adoption of wearable devices. Key trends projected for the forecast period include the expansion of the Internet of Things (IoT), the introduction of 5G networks, the automotive industry's shift towards electric vehicles (EVs), the continuous expansion of cloud computing infrastructure, and the rising adoption of renewable energy technologies.
The semiconductor assembly and testing services market is poised for growth due to the increasing demand for consumer electronics. Consumer electronics are devices designed for end-users for personal use, driven by rising disposable incomes, evolving lifestyles, urbanization, and the growth of e-commerce platforms. These services are crucial for providing reliable semiconductor components that power devices such as smartphones, tablets, laptops, wearables, and smart home appliances. For example, in May 2023, the Japan Electronics and Information Technology Industries Association reported a significant increase in consumer electronics production, from $161.17 million (¥25,268 million) in May 2022 to $204.75 million (¥32,099 million) in May 2023, indicating a strong market trend.
Leading companies in this market are leveraging AI-powered software solutions to improve yield in integrated circuit (IC) engineering and production processes. These solutions enhance operational efficiency, raise yield rates, and support continuous improvement initiatives. For instance, in November 2022, Advantest Corporation introduced ACS EASY, an AI-powered software designed to enhance productivity across device engineering and production operations. This user-friendly application utilizes AI to autonomously monitor test conditions and identify potential causes of yield degradation, facilitating issue isolation and analysis during production.
In December 2023, Luxshare Precision Industry Co. Ltd., a China-based electronic component manufacturer, acquired the assembly and test facilities of Qorvo Inc. This strategic move allows Luxshare to offer assembly and testing services for Qorvo products, strengthening its position in the market. Qorvo, Inc., a US-based provider of radio-frequency (RF) components, benefits from this partnership by gaining access to Luxshare's expertise in assembly and testing for mobile, infrastructure, and defense applications.
Major companies operating in the semiconductor assembly and testing services market are Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company, Intel Corporation, Micron Technology Inc., ASE Technology Group, QUALCOMM Inc., Amkor Technology Inc., Teledyne Technologies Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co. Ltd., Tianshui Huatian Technology Co. Ltd, Global Foundries Inc., Integrated Microelectronics Inc., King Yuan Electronics Corp., STATS chipPAC Ltd., ChipMOS Technologies INC., Chipbond Technology Corporation, UTAC Holdings Ltd., Unisem Group, Formosa Advanced Technologies Co. Ltd, Walton Advanced Engineering Inc., Lingsen Precision Industries Ltd., Integra Technologies LLC, Greatek Electronics Inc., CORWIL Technology Corp.
Asia-Pacific was the largest region in the semiconductor assembly and testing services market in 2023. The regions covered in the semiconductor assembly and testing services market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the semiconductor assembly and testing services market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.
Semiconductor assembly and testing services involve the assembly of individual semiconductor components into complete integrated circuits (ICs) or chips, followed by testing to ensure functionality, reliability, and quality assurance. These services play a critical role in the semiconductor manufacturing supply chain, ensuring that semiconductor devices meet performance specifications and quality standards prior to being shipped to customers.
The primary services provided in semiconductor assembly and testing include assembly and packaging services, along with testing services. Assembly services involve combining multiple small shipments into a single one for shipping or transportation purposes. Various packaging technologies are utilized, including flip-chip, wire bond, and other packaging technologies tailored to end-use industries such as telecommunications, computing, networking, consumer electronics, industrial applications, automotive electronics, and more.
The semiconductor assembly and testing services market research report is one of a series of new reports that provides semiconductor assembly and testing services market statistics, including semiconductor assembly and testing services industry global market size, regional shares, competitors with a semiconductor assembly and testing services market share, detailed semiconductor assembly and testing services market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor assembly and testing services industry. This semiconductor assembly and testing services market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.
The semiconductor assembly and testing services market consist of revenues earned by entities by providing services such as wafer-level packaging (WLP), chip-on-board (COB), system-in-package (SiP), and final testing. The market value includes the value of related goods sold by the service provider or included within the service offering. The semiconductor assembly and testing services market also includes sales of assembly equipment, testing equipment, packaging equipment, and metrology and inspection equipment. Values in this market are ‘factory gate’ values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.
The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).
The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.
This product will be delivered within 3-5 business days.
Table of Contents
1. Executive Summary2. Semiconductor Assembly and Testing Services Market Characteristics3. Semiconductor Assembly and Testing Services Market Trends and Strategies32. Global Semiconductor Assembly and Testing Services Market Competitive Benchmarking33. Global Semiconductor Assembly and Testing Services Market Competitive Dashboard34. Key Mergers and Acquisitions in the Semiconductor Assembly and Testing Services Market
4. Semiconductor Assembly and Testing Services Market - Macro Economic Scenario
5. Global Semiconductor Assembly and Testing Services Market Size and Growth
6. Semiconductor Assembly and Testing Services Market Segmentation
7. Semiconductor Assembly and Testing Services Market Regional and Country Analysis
8. Asia-Pacific Semiconductor Assembly and Testing Services Market
9. China Semiconductor Assembly and Testing Services Market
10. India Semiconductor Assembly and Testing Services Market
11. Japan Semiconductor Assembly and Testing Services Market
12. Australia Semiconductor Assembly and Testing Services Market
13. Indonesia Semiconductor Assembly and Testing Services Market
14. South Korea Semiconductor Assembly and Testing Services Market
15. Western Europe Semiconductor Assembly and Testing Services Market
16. UK Semiconductor Assembly and Testing Services Market
17. Germany Semiconductor Assembly and Testing Services Market
18. France Semiconductor Assembly and Testing Services Market
19. Italy Semiconductor Assembly and Testing Services Market
20. Spain Semiconductor Assembly and Testing Services Market
21. Eastern Europe Semiconductor Assembly and Testing Services Market
22. Russia Semiconductor Assembly and Testing Services Market
23. North America Semiconductor Assembly and Testing Services Market
24. USA Semiconductor Assembly and Testing Services Market
25. Canada Semiconductor Assembly and Testing Services Market
26. South America Semiconductor Assembly and Testing Services Market
27. Brazil Semiconductor Assembly and Testing Services Market
28. Middle East Semiconductor Assembly and Testing Services Market
29. Africa Semiconductor Assembly and Testing Services Market
30. Semiconductor Assembly and Testing Services Market Competitive Landscape and Company Profiles
31. Semiconductor Assembly and Testing Services Market Other Major and Innovative Companies
35. Semiconductor Assembly and Testing Services Market Future Outlook and Potential Analysis
36. Appendix
Executive Summary
Semiconductor Assembly and Testing Services Global Market Report 2024 provides strategists, marketers and senior management with the critical information they need to assess the market.This report focuses on semiconductor assembly and testing services market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.
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Description
Where is the largest and fastest growing market for semiconductor assembly and testing services ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The semiconductor assembly and testing services market global report answers all these questions and many more.The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market’s historic and forecast market growth by geography.
- The market characteristics section of the report defines and explains the market.
- The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
- The forecasts are made after considering the major factors currently impacting the market. These include:
- The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.
- The impact of higher inflation in many countries and the resulting spike in interest rates.
- The continued but declining impact of COVID-19 on supply chains and consumption patterns.
- Market segmentations break down the market into sub markets.
- The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
- The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
- The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.
Scope
Markets Covered:
1) by Service: Assembly and Packaging Services; Testing Services2) by Packaging Technology: Flip-Chip; Wire Bond; Other Packaging Technologies
3) by End Use Industry: Telecommunication; Computing and Networking; Consumer Electronics; Industrial; Automotive Electronics; Other End-Use Industries
Key Companies Mentioned: Powertech Technology Inc.; Taiwan Semiconductor Manufacturing Company; Intel Corporation; Micron Technology Inc.; ASE Technology Group
Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
Time Series: Five years historic and ten years forecast.
Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita.
Data Segmentation: Country and regional historic and forecast data, market share of competitors, market segments.
Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
Delivery Format: PDF, Word and Excel Data Dashboard.
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Powertech Technology Inc.
- Taiwan Semiconductor Manufacturing Company
- Intel Corporation
- Micron Technology Inc.
- ASE Technology Group
- QUALCOMM Inc.
- Amkor Technology Inc.
- Teledyne Technologies Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Siliconware Precision Industries Co. Ltd.
- Tianshui Huatian Technology Co. Ltd
- Global Foundries Inc.
- Integrated Microelectronics Inc.
- King Yuan Electronics Corp.
- STATS chipPAC Ltd.
- ChipMOS Technologies INC.
- Chipbond Technology Corporation
- UTAC Holdings Ltd.
- Unisem Group
- Formosa Advanced Technologies Co. Ltd
- Walton Advanced Engineering Inc.
- Lingsen Precision Industries Ltd.
- Integra Technologies LLC
- Greatek Electronics Inc.
- CORWIL Technology Corp.
Methodology
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Table Information
Report Attribute | Details |
---|---|
No. of Pages | 175 |
Published | July 2024 |
Forecast Period | 2024 - 2028 |
Estimated Market Value ( USD | $ 34.94 Billion |
Forecasted Market Value ( USD | $ 45.67 Billion |
Compound Annual Growth Rate | 6.9% |
Regions Covered | Global |