“3D Printing for Semiconductors” is both an incisive and thorough analysis of the state and outlook for additive manufacturing (AM) technologies to optimize and entrench into the semiconductor industry.
The report features a comprehensive written market analysis and a companion Excel file of historical market data as well as a 10-year forecast.
The report identifies specific cases for AM within the semiconductor value chain, including reduced lead times, reduced parts, and thermal management, packaging, and more. The report considers the implications for AM of such broader initiatives as the CHIPs Act and other geopolitical actions and trends.
The companion Excel file details semiconductor markets various AM technologies including Powder Bed Fusion (PBF), Directed Energy Deposition (DED), Metal Binder Jetting (MBJ), and Bound Metal Deposition (BMD). Breakout are also provided by metal, polymer, ceramic and speciality metal powders, as well as by geography.
Companies and organizations mentioned or profiled include but are not limited to: ASML, 3D Systems, Lam Research, Velo3D, Applied Materials, SIMTech, Fabric8Labs, Intel, Coherent, and Nikon Advanced Manufacturing.
Table of Contents
Chapter One: Top-Down Overview of the Market for Semiconductor Capital Equipment Parts
1.1 Semiconductors: Global Supply Chain Fuel
1.2 Semiconductor Capital Equipment: an AM Success Story
1.2.1 The Opportunity: Helping the World’s Most Important Companies Reshore in the CHIPS Era
Chapter Two: The Case for AM: Cutting Down Lead Times, Reducing the Number of Parts, and Thermal Management
2.1 3D Systems Optimizes Thermal Management for ASML
2.2 Cutting Down Lead Times: ASML Turns to Norsk Titanium and Hittech Group
2.3 The Rest of the Capital Equipment Industry: Activity Outside of ASML
Chapter Three: AM Semiconductor Capital Equipment Market Opportunity Estimates
Chapter Four: Conclusion - A Strategic Match Made in Heaven
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- ASML
- 3D Systems
- Lam Research
- Velo3D
- Applied Materials
- SIMTech
- Fabric8Labs
- Intel
- Coherent
- Nikon Advanced Manufacturing
