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Development of the Global Semiconductor Industry Under Geopolitical Influences

  • Report

  • 24 Pages
  • July 2024
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5986493
With semiconductors emerging as a strategically vital global industry, this report offers an overview of the supply chain strategies employed by several major countries, including the United States, Japan, the EU, South Korea, China, and India. It examines these nations' promotional strategies and the status of global and Taiwanese semiconductor manufacturing capacity distribution, while also addressing five key factors considered by companies when establishing overseas factories.

In response to the U.S.-China tech war and the automotive chip shortage exacerbated by COVID-19 lockdowns, numerous countries have implemented policies aimed at bolstering their semiconductor supply chain resilience. The United States, Japan, and European Union, among others, have proposed legislative measures, tax incentives, and subsidies to attract semiconductor companies to establish manufacturing facilities within their borders, thereby strengthening their chip production capabilities.

Table of Contents

1. Global Governments Promote Regional Semiconductor Supply Chain Development
1.1 The U.S. Introduces the CHIPS and Science Act in 2022
1.2 Japan's Semiconductor and Digital Industry Strategy
1.3 EU Introduces the EU Chips Act in 2022
1.4 South Korea Announces the K-Semiconductor Strategy in 2021
1.5 China Launches the Third Phase of the Big Fund
1.6 India Approves Three Semiconductor Investment Projects in 2024
2. The U.S. Begins Issuing Subsidy Grants at the End of 2023
2.1 The U.S. "CHIPS and Science Act" Confirms Subsidies for Six Companies
2.2 The United States to Distribute Approximately 12 Subsidies in 2024
3. Japan Promotes Semiconductors Through International Cooperation
3.1 Japan's Emergency Semiconductor Industry Strengthening Plan Has Subsidized Nearly 3 Trillion Yen
3.2 Japan's Semiconductor Task Force Rapidus Undertakes Mass Production of 2nm Chips
3.3 Kioxia and WD's Joint Venture Aims to Strengthen Memory Production in Japan and the U.S.
3.4 TSMC Brings Semiconductor Opportunities to Kyushu, Japan
3.5 Micron Continues to Produce Cutting-Edge DRAM Products in Japan
3.6 Kyushu, Tohoku, and Hokkaido: Japan's Future Three Major Semiconductor Bases
4. EU Soliciting Leading Brands to Expand Advanced Semiconductor Production Capacity
4.1 Intel Plans to Build Complete Semiconductor Value Chain in Europe
4.2 TSMC's Joint Venture to Establish a Plant in Germany
4.3 Continuous Expansion of 12-inch Fabs in Europe
5. Global and Taiwan Semiconductor Manufacturing Capacity Distribution
5.1 Global Semiconductor Manufacturing Capacity Grows by 6% in 2024
5.2 Five Key Considerations for Companies Establishing Overseas Factories
5.3 Production of Taiwanese IC Manufacturers Still Based in Taiwan
6. The Analyst's PerspectiveAppendixList of Companies
List of Tables
Table 1: List of Beneficiaries of the United States Chip Program Subsidies
Table 2: List of Japanese Subsidies for Domestic and Foreign Semiconductor Companies
List of Figures
Figure 1: Government Subsidies Actively Promoting Regional Semiconductor Development
Figure 2: Status of New Wafer Fabrication Facilities in the United States (Examples Given)
Figure 3: Overview of New Semiconductor Fabrication Facilities in Japan (Examples Given)
Figure 4: Status of New Wafer Fabrication Facilities in Europe (Examples Given)
Figure 5: Global Semiconductor Manufacturing Capacity Distribution
Figure 6: Five Key Considerations for Semiconductor Manufacturers to Establish Overseas Plants
Figure 7: Distribution of Taiwan's Semiconductor Production Capacity in 2030

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • BAE Systems
  • Bosch
  • Denso
  • Elpida
  • ESMC
  • GlobalFoundries
  • Infineon
  • Intel
  • JASM
  • Kioxia
  • Microchip
  • Micron
  • Mitsubishi Electronic
  • MUFG Bank
  • NEC
  • NTT DoCoMo
  • NXP
  • PSMC
  • Rapidus
  • Renesas Electronics
  • Samsung
  • SBI Group
  • SK Hynix
  • Softbank
  • Sony
  • STMicro
  • Tata Electronics
  • TI
  • Toshiba
  • Toyota
  • TSMC
  • UMC
  • VIS
  • WD

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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