Thick Film Hybrid Integrated Circuits Global Market Report 2024

The thick film hybrid integrated circuits market size has grown strongly in recent years. It will grow from $3.45 billion in 2023 to $3.68 billion in 2024 at a compound annual growth rate (CAGR) of 6.5%. The growth observed during the historic period can be attributed to several factors, including the expansion of the electronics industry, a growing demand for miniaturization in electronic devices, increased adoption within the automotive sector, growth in the telecommunications industry, expanding applications in medical devices, adherence to government regulations and standards, and the high initial investment costs associated with thick-film hybrid integrated circuits.

The thick film hybrid integrated circuits market size is expected to see strong growth in the next few years. It will grow to $4.75 billion in 2028 at a compound annual growth rate (CAGR) of 6.6%. The anticipated growth in the forecast period can be attributed to several factors, including the proliferation of Internet of Things (IoT) devices, advancements in 5G technology, a rising demand for wearable devices, increased investments in smart infrastructure projects, the expansion of the renewable energy sector, a growing need for efficient power management solutions, and the continued growth of automotive electronics. Major trends expected during this period include a focus on miniaturization and integration of electronics components, rapid prototyping capabilities and customization options, the emergence of advanced materials for circuit design, and the integration of thick-film hybrid integrated circuits with emerging technologies to enhance functionality and performance.

The thick-film hybrid integrated circuits market is poised for growth, driven by the increasing demand for consumer electronics. Consumer electronics refer to devices designed for personal use, such as smartphones, tablets, laptops, and home entertainment systems. Factors such as technological advancements, expanded connectivity, and the desire for convenience and entertainment drive the surge in consumer electronics demand. Thick-film hybrid integrated circuits play a crucial role in consumer electronics by combining the benefits of thick-film and integrated circuit technologies, offering compactness, reliability, and cost-effectiveness. For example, as of February 2024, the Japan Electronics and Information Technology Industries Association reported a significant increase in consumer electronic equipment production, reflecting the growing market momentum.

Leading companies in the thick-film hybrid integrated circuits sector are focusing on developing high-frequency and high-speed components, such as thick-film shunt resistors, to meet the demand for high-performance electronic devices across industries. Thick-film shunt resistors are vital components in electronic circuits, providing precise current sensing and voltage regulation in a compact and reliable format. For instance, ROHM Co. Ltd. launched the LTR100L thick-film shunt resistors in November 2021, tailored for industrial and consumer applications, including battery protection and motor drive circuits. The LTR100L series offers industry-leading power ratings and optimized element structures, ensuring accuracy and reliability in current detection despite temperature changes, making them ideal for various applications.

In January 2023, HEICO Corporation acquired Exxelia International, a France-based manufacturer of passive components and precision subsystems, including thick-film surface mount resistor circuits. This acquisition enhances HEICO's portfolio, expanding its range of components for aerospace, defense, space, and upscale markets, while also strengthening its presence in the European market.

Major companies operating in the thick film hybrid integrated circuits market are Panasonic Corporation, GE Aerospace, Infineon Technologies AG, ROHM CO. LTD, Vishay Intertechnology, KEMET Corporation, Fenghua Advanced Technology Holding CO.LTD, Semtech Corporation, TT Electronics, Anritsu Corporation, Beijing Sevenstar Electronics Co. Ltd., KYOCERA AVX, Ohmite Manufacturing Company, Electro Technik Industries Inc., Delphi Technologies, Zhejiang Huzhou Xinjingchang Electronics Co. Ltd., Corintech Ltd, VPT Inc., AUREL s.p.a., Custom Interconnect Limited, Japan Resistor Mfg. Co. Ltd., Micro Hybrid Electronic GmbH, Advance Circuit Technology Inc., Cermetek Microelectronics, Hybrionic Pte, Bergh Hybrid Circuits, Integrated Technology Lab, Midas Microelectronics, Weiking Electronics Manufacturing, Globec Limited.

North America was the largest region in the thick film hybrid integrated circuits market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the thick film hybrid integrated circuits market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the thick film hybrid integrated circuits market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

Thick-film hybrid integrated circuits (HICs) are sophisticated electronic circuits that integrate multiple electrical components into a single unit. The "thick-film" aspect refers to the process of depositing conductive, resistive, and insulating materials onto a substrate, accomplished through techniques such as screen printing and firing layers of paste materials to form the desired circuit patterns. These circuits are designed to be compact, reliable, and high-performing, suitable for operation in challenging environments.

The primary substrates used in thick-film hybrid integrated circuits include 96% Al2O3 ceramic substrates, beryllium oxide (BeO) ceramic substrates, aluminum nitride (AIN)-based substrates, among others. The 96% Al2O3 ceramic substrate, made predominantly of aluminum oxide, is valued for its excellent electrical insulation, thermal conductivity, and stability, making it an ideal platform for circuit components in thick-film HICs. These circuits encompass various product types such as active, passive, and electromechanical components, serving diverse applications such as avionics and defense, automotive systems, telecommunications, computer technology, consumer electronics, and more.

The thick film hybrid integrated circuits market research report is one of a series of new reports that provides thick film hybrid integrated circuits market statistics, including thick film hybrid integrated circuits industry global market size, regional shares, competitors with an thick film hybrid integrated circuits market share, detailed thick film hybrid integrated circuits market segments, market trends and opportunities, and any further data you may need to thrive in the thick film hybrid integrated circuits industry. This thick film hybrid integrated circuits market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The thick-film hybrid integrated circuits market consist of sales resistors, capacitors, inductors, diodes, transistors, ICs, sensors, and power modules. Values in this market are ‘factory gate’ values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.


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