3D TSV And 2.5D Market Report and Forecast 2024-2032

According to the report, the global 3D TSV and 2.5D market size reached a value of around USD 57.98 billion in 2023. Aided by the significant developments in sectors such as consumer electronics, automotive, and healthcare, which require more efficient and compact integrated circuits (ICs), the market is projected to grow at a CAGR of 8.8% between 2024 and 2032 to reach a value of nearly USD 123.86 billion by 2032.

3D TSV and 2.5D technologies are pivotal in the evolution of semiconductor packaging and integration. 3D TSV involves vertical interconnections passing through silicon wafers or dies to connect stacked chips, leading to higher component density and improved performance. Meanwhile, 2.5D technology uses interposers (typically silicon) to enable the interconnection of multiple dies on a single substrate, which facilitates better electrical performance than traditional packaging methods. These technologies enable the production of smaller, faster, and more energy-efficient devices and are instrumental in the development of complex applications such as artificial intelligence, big data analytics, and advanced driver-assistance systems (ADAS).

One of the most significant advancements aiding the 3D TSV and 2.5D market growth is the development of hybrid bonding technology. This technique involves directly bonding wafers or dies without the need for solder, leading to better electrical connectivity and reduced thermal issues. Hybrid bonding allows for finer pitches and smaller form factors, which are crucial for applications requiring high-density integration, such as advanced sensors and high-performance computing systems. The adoption of this technology is set to increase as it supports the production of more compact and efficient devices.

As per the 3D TSV and 2.5D market analysis, silicon interposers play a crucial role in 2.5D technology, acting as a bridge between the high-density stacked ICs and the main circuit board. Innovations in this area include the development of interposers with higher routing densities and improved electrical performance, which facilitate the integration of more functionalities within a single package. As the complexity of electronic devices increases, the demand for advanced silicon interposers that can support a larger number of connections and higher speeds continues to grow.

Artificial intelligence is starting to play a crucial role in optimising the manufacturing processes of 3D TSV and 2.5D technologies. As per the 3D TSV and 2.5D market outlook, AI algorithms can predict equipment maintenance needs, optimise production workflows, and enhance quality control measures. Furthermore, AI is being integrated within the devices themselves, enabling smarter electronics that can process data at the edge, reducing latency and improving efficiency in applications like mobile devices and autonomous vehicles.

As devices become smaller and more powerful, managing heat generation becomes increasingly challenging. Innovations in thermal management solutions are crucial for the continued advancement of 3D TSV and 2.5D technologies, boosting the 3D TSV and 2.5D market growth. This includes the development of new materials and structures that can dissipate heat more effectively and the integration of cooling solutions directly into the chip architecture. Effective thermal management ensures device reliability and performance, particularly in high-stake applications such as automotive and aerospace sectors.

There is a growing trend towards adopting more sustainable and environmentally friendly manufacturing processes within the semiconductor sector, which can also aid the 3D TSV and 2.5D market expansion. This involves reducing the use of toxic chemicals, minimising waste, and recycling materials wherever possible. Manufacturers are also exploring the use of greener alternatives for critical materials and are investing in technologies that require less energy consumption.

As the global landscape of electronics continues to evolve, so do the regulatory standards that govern the production and disposal of electronic devices. Compliance with international standards and regulations, such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), is becoming increasingly important. These regulations influence the development and adoption of new technologies and materials, which boost the 3D TSV and 2.5D market development.

Market Segmentation

The market can be divided based on packaging type, end use, and region.

Market Breakup by Packaging Type

• 2.5D Interposer
• 3D SoC
• 3D Stacked Memory
• CIS with TSV
• Others

Market Breakup by End Use

• Consumer Electronics
• Automotive
• High Performance Computing (HPC) and Networking
• Others

Market Breakup by Region

• North America
• Europe
• Asia Pacific
• Latin America
• Middle East and Africa

Competitive Landscape

The report looks into the market shares, plant turnarounds, capacities, investments, and mergers and acquisitions, among other major developments, of the leading companies operating in the global 3D TSV and 2.5D market. Some of the major players explored in the report are as follows:

• Samsung Electronics Co. Ltd
• Toshiba Corp.
• ASE Group
• Amkor Technology, Inc.
• Jiangsu Changing Electronics Technology Co. Ltd
• United Microelectronics Corporation
• ACM Research, Inc.
• Powertech Technology Inc.
• Other